JPH0184447U - - Google Patents
Info
- Publication number
- JPH0184447U JPH0184447U JP1987180782U JP18078287U JPH0184447U JP H0184447 U JPH0184447 U JP H0184447U JP 1987180782 U JP1987180782 U JP 1987180782U JP 18078287 U JP18078287 U JP 18078287U JP H0184447 U JPH0184447 U JP H0184447U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat
- air flow
- protruded
- bases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案に係る半導体装置用放熱器の
斜視図、第２図は、本考案の作用を示す模式図、
第３図は、本考案の他の実施例を示す斜視図、第
４図は、従来の半導体用放熱器を示す図、である
。
図において、１……半導体装置、２，３……半
導体装置用放熱器、２１，３１……基台、２２，
２３，２４，３３……放熱フイン、２５，３５…
…流入側、２６，３６……流出側、３２……天井
部、Ａ……空気流、である。
FIG. 1 is a perspective view of a heat sink for a semiconductor device according to the present invention, and FIG. 2 is a schematic diagram showing the operation of the present invention.
FIG. 3 is a perspective view showing another embodiment of the present invention, and FIG. 4 is a diagram showing a conventional semiconductor heat sink. In the figure, 1...semiconductor device, 2, 3... radiator for semiconductor device, 21, 31... base, 22,
23, 24, 33...radiating fin, 25, 35...
...Inflow side, 26, 36...Outflow side, 32...Ceiling part, A...Air flow.
Claims (1)
からの発熱を放熱フインを介して空気流に放散す
る放熱器であつて、 基台２１，３１上に突設された放熱フイン２２
，２３，２４，３３の配列間隔もしくは高さを、
空気流の流入側２５，３５から流出側２６，３６
へ向けて減少させて、空気通路の断面積を空気流
の方向へ連続的に減少せしめてなることを特徴と
する半導体装置用放熱器。[Claims for Utility Model Registration] A heat radiator that is attached to the top surface of a semiconductor device 1 to dissipate heat generated from the semiconductor device into an air flow through heat radiating fins, which is protruded from the bases 21 and 31. heat dissipation fin 22
, 23, 24, 33 array interval or height,
From the airflow inflow side 25, 35 to the outflow side 26, 36
1. A heat sink for a semiconductor device, characterized in that the cross-sectional area of an air passage is continuously reduced in the direction of air flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180782U JPH0184447U (en) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180782U JPH0184447U (en) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184447U true JPH0184447U (en) | 1989-06-05 |
Family
ID=31472288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180782U Pending JPH0184447U (en) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184447U (en) |
-
1987
- 1987-11-27 JP JP1987180782U patent/JPH0184447U/ja active Pending