JPH0373458U - - Google Patents

Info

Publication number
JPH0373458U
JPH0373458U JP13561989U JP13561989U JPH0373458U JP H0373458 U JPH0373458 U JP H0373458U JP 13561989 U JP13561989 U JP 13561989U JP 13561989 U JP13561989 U JP 13561989U JP H0373458 U JPH0373458 U JP H0373458U
Authority
JP
Japan
Prior art keywords
fins
cooling
cooling device
fin
semiconductor cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13561989U
Other languages
Japanese (ja)
Other versions
JP2516087Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989135619U priority Critical patent/JP2516087Y2/en
Publication of JPH0373458U publication Critical patent/JPH0373458U/ja
Application granted granted Critical
Publication of JP2516087Y2 publication Critical patent/JP2516087Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す正面図、第２図
は第１図の−矢視からの側面図、第３図は異
なる配置における正面図、第４図は第３図の−
矢視からの側面図、第５図は従来例を示す斜視
図、第６図は動作を示す側面図である。 １……ヒートシンク、１１……冷却フイン、１
２……冷却面、１３……平面部、２……パワー素
子。 Fig. 1 is a front view showing an embodiment of the present invention, Fig. 2 is a side view from the - arrow direction of Fig. 1, Fig. 3 is a front view in a different arrangement, and Fig. 4 is a - of Fig. 3.
5 is a perspective view showing a conventional example, and FIG. 6 is a side view showing the operation. 1...Heat sink, 11...Cooling fin, 1
2...Cooling surface, 13...Plane portion, 2...Power element.

Claims (1)

【実用新案登録請求の範囲】 １ 一方の面に複数の冷却フインを備え、他方の
面にパワー素子を取付ける平面部を備えたヒート
シンクからなる半導体冷却装置において、 前記冷却フインが、断面を長方形に形成した複
数個のフインを、千鳥に配列して構成されたこと
を特徴とする半導体冷却装置。 ２ 前記冷却フインが、側面を台形状に形成した
フインにより構成された請求項１記載の半導体冷
却装置。[Claims for Utility Model Registration] 1. A semiconductor cooling device comprising a heat sink having a plurality of cooling fins on one surface and a flat portion on the other surface for mounting a power device, wherein the cooling fins have a rectangular cross section. A semiconductor cooling device characterized in that a plurality of formed fins are arranged in a staggered manner. 2. The semiconductor cooling device according to claim 1, wherein the cooling fin is constituted by a fin having a trapezoidal side surface.
JP1989135619U 1989-11-22 1989-11-22 Semiconductor cooling device Expired - Fee Related JP2516087Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989135619U JP2516087Y2 (en) 1989-11-22 1989-11-22 Semiconductor cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989135619U JP2516087Y2 (en) 1989-11-22 1989-11-22 Semiconductor cooling device

Publications (2)

Publication Number Publication Date
JPH0373458U true JPH0373458U (en) 1991-07-24
JP2516087Y2 JP2516087Y2 (en) 1996-11-06

Family

ID=31682877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989135619U Expired - Fee Related JP2516087Y2 (en) 1989-11-22 1989-11-22 Semiconductor cooling device

Country Status (1)

Country Link
JP (1) JP2516087Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10512073A (en) * 1995-01-13 1998-11-17 オートトロニックス・エンジニアリング・インターナショナル・リミテッド Electrical equipment
JP2013239666A (en) * 2012-05-17 2013-11-28 T Rad Co Ltd Heat sink
JP2014135180A (en) * 2013-01-09 2014-07-24 Mitsubishi Heavy Ind Ltd Battery module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230024264A1 (en) * 2021-07-20 2023-01-26 Transportation Ip Holdings, Llc Fluid control device and method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268298U (en) * 1985-10-18 1987-04-28
JPS6336052U (en) * 1986-08-27 1988-03-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268298U (en) * 1985-10-18 1987-04-28
JPS6336052U (en) * 1986-08-27 1988-03-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10512073A (en) * 1995-01-13 1998-11-17 オートトロニックス・エンジニアリング・インターナショナル・リミテッド Electrical equipment
JP2013239666A (en) * 2012-05-17 2013-11-28 T Rad Co Ltd Heat sink
JP2014135180A (en) * 2013-01-09 2014-07-24 Mitsubishi Heavy Ind Ltd Battery module

Also Published As

Publication number Publication date
JP2516087Y2 (en) 1996-11-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees