JP2017059713A - Method of manufacturing radiator - Google Patents
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- JP2017059713A JP2017059713A JP2015184126A JP2015184126A JP2017059713A JP 2017059713 A JP2017059713 A JP 2017059713A JP 2015184126 A JP2015184126 A JP 2015184126A JP 2015184126 A JP2015184126 A JP 2015184126A JP 2017059713 A JP2017059713 A JP 2017059713A
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- concave groove
- radiator
- cream solder
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 229910000679 solder Inorganic materials 0.000 claims abstract description 99
- 239000006071 cream Substances 0.000 claims abstract description 61
- 230000005855 radiation Effects 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 49
- 238000007747 plating Methods 0.000 claims description 34
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 238000004381 surface treatment Methods 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 229910001128 Sn alloy Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 is increased Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本発明は、ベースプレートの片面に複数の放熱フィンを接合した放熱器の製造方法に関する。 The present invention relates to a method for manufacturing a radiator in which a plurality of heat radiating fins are joined to one side of a base plate.
通信機器や映像機器や放送機器などの電子装置のハウジング内には多数の回路基板が密に搭載され、各回路基板上には半導体デバイス、ＣＰＵ（Central Processing Unit）、ＦＥＴ（Field Effect Transistor：電界効果トランジスタ）、電力増幅器などの高熱を発する電子部品が実装されているので、電子装置を冷却するための冷却装置が必要になる。半導体デバイス、ＣＰＵ、電力増幅器などの高熱を発する電子部品は、その有効動作温度範囲が狭く、よって、電子装置全体を冷却するのではなく電子部品それぞれを個々に冷却する必要がある。そのため、高熱を発する電子部品の内部温度が限界温度を超えないように、熱伝導性の良いアルミニウム等の金属製の放熱器が広く一般的に使用されている。 A large number of circuit boards are densely mounted in a housing of an electronic device such as a communication device, a video device, and a broadcast device. On each circuit substrate, a semiconductor device, a CPU (Central Processing Unit), and an FET (Field Effect Transistor) Effect transistors), power amplifiers, and other electronic components that generate high heat are mounted, so that a cooling device for cooling the electronic device is required. Electronic components that generate high heat, such as semiconductor devices, CPUs, power amplifiers, etc., have a narrow effective operating temperature range, and therefore it is necessary to cool each electronic component individually rather than cooling the entire electronic device. Therefore, metal radiators such as aluminum having good thermal conductivity are widely used so that the internal temperature of electronic parts that generate high heat does not exceed the limit temperature.
例えば、放送用の送信機において、電力増幅器などの著しく発熱量が大きい電子機器の放熱を行う場合にも、放熱器を使用するのが通例である。デバイス単体の発熱量が大きい、例えば１００Ｗ超の電力増幅器を製作する場合、極力熱抵抗が小さい放熱器を使用し、ファンやブロアー等で強制空冷を行う。しかし、市販されている放熱フィン付きの放熱器の中から熱抵抗が小さいものを選択しようとすると、放熱フィンのフィン間隔が広いタイプのものがほとんどであるため、放熱器のサイズが大きくなってしまい、送信機に実装するにはスペースがなく適当でない。そのため、各送信機メーカでは、放熱フィンの厚みを薄くし、狭ピッチで並べた放熱フィン付きの放熱器を独自に製作することによって、熱抵抗の問題に対処している。 For example, in a broadcasting transmitter, a heat radiator is usually used also when heat is dissipated from an electronic device such as a power amplifier that generates a large amount of heat. When manufacturing a power amplifier with a large device calorific value, for example, more than 100 W, use a radiator with as little thermal resistance as possible and perform forced air cooling with a fan or blower. However, when trying to select a heatsink with a low heat resistance from among heatsinks with heatsinks on the market, most of the heatsink fins have wide fin spacing, which increases the size of the heatsink. In other words, it is not suitable for mounting on a transmitter because there is no space. For this reason, each transmitter maker addresses the problem of thermal resistance by reducing the thickness of the heat dissipation fins and independently manufacturing a heatsink with heat dissipation fins arranged at a narrow pitch.
放熱フィン付きの放熱器を製作する手法としては、ベースプレートの一方の主表面上に、複数の放熱用フィンを耐熱性の接着剤を介して固着する方法（特許文献１参照）、ベースプレートのフィン取り付け面に設けられた溝部にフィンの一部を嵌合させ、溝部内で金属部材を塑性変形させることにより取り付ける方法（特許文献２参照）、または、放熱基板上にろう材を介して載置されたプレートフィンを放熱基板にろう付する方法（特許文献３参照）等が用いられている。 As a method of manufacturing a radiator with a heat radiating fin, a method of fixing a plurality of heat radiating fins on one main surface of the base plate with a heat-resistant adhesive (see Patent Document 1), fin mounting of the base plate A method of attaching a part of a fin to a groove provided on the surface and plastically deforming a metal member in the groove (see Patent Document 2), or placed on a heat dissipation board via a brazing material For example, a method of brazing the plate fin to the heat dissipation substrate (see Patent Document 3) is used.
上述したように、フィン付きの放熱器を製作する手法において、特許文献３のように、薄板の放熱フィン（プレートフィン）をベース部（放熱基板）にろう付する方法は、他の製法に比べて放熱フィンのフィンピッチを狭くできるため、熱抵抗を極力小さくするために放熱面積を増加させる手段としては最適である。
従来のろう付による方法の一例について述べる。放熱フィンは、例えば銅製の厚さ０．３ｍｍ〜０．４ｍｍの薄板を用い、所定の大きさに加工した後、全面にニッケルメッキ、更に錫メッキを施しておく。また、ベース部は、あらかじめ放熱フィンの厚さに対して、０．２ｍｍ〜０．３ｍｍ大きい幅の凹溝加工を施し、凹溝箇所にニッケルメッキを施しておく。そして、必要数量の放熱フィンをベース部の凹溝に挿入した後、電気炉等でベース部および放熱フィンを加熱し、放熱フィンのニッケルメッキ及び錫メッキを溶解させ、Ｎｉ＋Ｓｎ合金がベース部の凹溝内に流れ込むことによって、放熱フィンがベース部に接合される。
As described above, in a method of manufacturing a finned radiator, a method of brazing a thin plate of a heat radiating fin (plate fin) to a base portion (heat radiating substrate) as in Patent Document 3 is compared with other manufacturing methods. Since the fin pitch of the radiating fins can be narrowed, it is optimal as a means for increasing the radiating area in order to minimize the thermal resistance.
An example of a conventional brazing method will be described. The heat radiating fin is made of, for example, a copper thin plate having a thickness of 0.3 mm to 0.4 mm, processed to a predetermined size, and then plated with nickel and further with tin. In addition, the base portion is preliminarily processed with a groove having a width 0.2 mm to 0.3 mm larger than the thickness of the heat radiating fin, and the groove portion is plated with nickel. Then, after inserting the required number of heat radiation fins into the concave groove of the base part, the base part and the heat radiation fin are heated in an electric furnace or the like to dissolve the nickel plating and tin plating of the heat radiation fin, and the Ni + Sn alloy is By flowing into the groove, the radiating fin is joined to the base portion.
ここで、図７〜図９を用いて、従来のろう付によってフィン付きの放熱器を製作する際の具体的な手順について説明する。図７は、従来の放熱器の製造工程を説明するための説明図（１）であり、図８は、従来の放熱器の製造工程を説明するための説明図（２）であり、また、図９は、電気炉で加熱した後の図８でのＣ−Ｃ断面を示す図である。
従来の放熱器２０は、図８に示すように、ベース部２１の主表面上に、放熱フィン２２の厚さに適合する幅の凹溝２１ａを設け、凹溝２１ａ内に、冷却に必要な枚数の放熱フィン２２を固着する構造となっている。
ベース部２１には、凹溝２１ａ加工後、放熱フィン２２を固着する凹溝２１ａ箇所にニッケルメッキを施しておく。また、放熱フィン２２には、図７（ｂ）に示すように、所定の大きさに加工した後、予め全面にニッケルメッキ２２ａおよび錫メッキ２２ｂを施しておき、図７（ａ）に示すように、必要数量の放熱フィン２２の下端部をベース部２１の凹溝２１ａ内部に挿入する。そして、図８に示すように、ベース部２１の底面を電気炉５０で加熱することによって、図９に示すように、放熱フィン２２のニッケルメッキ２２ａと錫メッキ２２ｂが溶解してＮｉ＋Ｓｎ合金２５となって凹溝２１ａ内部に流れ込むことにより、放熱フィン２２がベース部２１に接合されるものである。
Here, a specific procedure for manufacturing a finned heatsink by conventional brazing will be described with reference to FIGS. FIG. 7 is an explanatory diagram (1) for explaining the manufacturing process of the conventional radiator, FIG. 8 is an explanatory diagram (2) for explaining the manufacturing process of the conventional radiator, FIG. 9 is a diagram showing a CC cross section in FIG. 8 after heating in an electric furnace.
As shown in FIG. 8, the conventional radiator 20 is provided with a concave groove 21a having a width matching the thickness of the radiating fin 22 on the main surface of the base portion 21, and is necessary for cooling in the concave groove 21a. The structure is such that the number of heat radiation fins 22 is fixed.
The base portion 21 is subjected to nickel plating at the location of the concave groove 21a to which the radiating fin 22 is fixed after the concave groove 21a is processed. Further, as shown in FIG. 7 (b), the heat radiating fins 22 are processed to a predetermined size and then preliminarily plated with nickel plating 22a and tin plating 22b, as shown in FIG. 7 (a). Further, the lower end portion of the required number of the heat radiation fins 22 is inserted into the concave groove 21 a of the base portion 21. Then, as shown in FIG. 8, by heating the bottom surface of the base portion 21 with the electric furnace 50, as shown in FIG. 9, the nickel plating 22a and the tin plating 22b of the radiating fins 22 are melted to form the Ni + Sn alloy 25. Thus, the heat radiating fins 22 are joined to the base portion 21 by flowing into the concave grooves 21a.
しかしながら、放熱フィン２２の全面に処理加工を施したニッケルメッキ２２ａと錫メッキ２２ｂを溶解させるためには、ベース部２１の凹溝２１ａ内部に放熱フィン２２を挿入後、ベース部２１の底面を高温で加熱して、放熱フィン２２の上部先端まで高温にする必要があり、例えば放熱フィン２２が銅材の場合には、熱の影響で材料が軟化するので、放熱フィン２２が変形し易く、取り扱いが難しいという問題があった。 However, in order to dissolve the nickel plating 22a and the tin plating 22b that have been processed on the entire surface of the heat radiating fins 22, after the heat radiating fins 22 are inserted into the concave grooves 21a of the base portion 21, the bottom surface of the base portion 21 is heated to a high temperature. It is necessary to heat up to the upper end of the radiating fins 22, and for example, when the radiating fins 22 are made of copper, the material is softened by the influence of heat, so the radiating fins 22 are easily deformed and handled. There was a problem that was difficult.
また、放熱フィン２２は、表面処理を２工程（ニッケルメッキ工程と錫メッキ工程）施すため、メッキ厚の管理が不十分であると、ニッケルメッキ２２ａおよび錫メッキ２２ｂのメッキ厚にバラツキが発生し、電気炉５０によるベース部２１の加熱時に凹溝２１ａ内部に流れ込むＮｉ＋Ｓｎ合金２５の量にもバラツキが出てしまう。例えば凹溝２１ａ内部にＮｉ＋Ｓｎ合金２５が過剰に流れ込んだ場合には、凹溝２１ａ内部からＮｉ＋Ｓｎ合金２５が溢れ出てしまうという問題があった。
また、ニッケルメッキ２２ａと錫メッキ２２ｂが一様に溶解せず、ベース部２１方向に流れ落ちずに、放熱フィン２２の表面に留まって、図９のように、放熱フィン２２の表面が凸凹になってしまい、冷却流体である空気の流れの圧力損失を増加させたり、ごみが付着し易い欠点があった。
Further, since the heat radiation fin 22 is subjected to two processes (nickel plating process and tin plating process), if the management of the plating thickness is insufficient, the plating thickness of the nickel plating 22a and the tin plating 22b varies. The amount of Ni + Sn alloy 25 flowing into the concave groove 21a when the base portion 21 is heated by the electric furnace 50 also varies. For example, when the Ni + Sn alloy 25 flows excessively into the concave groove 21a, there is a problem that the Ni + Sn alloy 25 overflows from the concave groove 21a.
Further, the nickel plating 22a and the tin plating 22b are not uniformly dissolved and do not flow down toward the base portion 21, but remain on the surface of the radiation fin 22, and the surface of the radiation fin 22 becomes uneven as shown in FIG. As a result, the pressure loss of the flow of air, which is a cooling fluid, is increased, and dust easily adheres.
また、放熱フィン２２は、メッキ工程が２工程（ニッケルメッキ工程と錫メッキ工程）となるため、上述したように、メッキ厚を管理してバラツキの低減化を図るため、部品製作上の歩留りが悪くなり、部品の製作数が多い場合には製作工数が増えて、装置製作の工程に影響を及ぼしたり、コストアップにつながるという問題があった。 In addition, since the radiating fin 22 has two plating steps (nickel plating step and tin plating step), as described above, the plating thickness is managed to reduce variation, so that the yield in component manufacturing is increased. When the number of parts to be manufactured is large, the number of manufacturing steps increases, which affects the device manufacturing process and increases costs.
また、ベース部２１および放熱フィン２２を加熱する場合、電気炉５０の昇温温度、加熱速度は電気炉５０とベース部２１および放熱フィン２２のサイズが変わる度に設定が異なる。また、加熱作業時の電気炉５０とベース部２１の密着度合いによっても接合の仕上がりが異なるためノウハウを要する。また、事前にサンプルをいくつか製作して、放熱フィン２２がベース部２１に着実に接合されているかを確認する等の手間を要するという問題があった。 Moreover, when heating the base part 21 and the radiation fin 22, the temperature rising temperature and heating speed of the electric furnace 50 are set differently when the sizes of the electric furnace 50, the base part 21 and the radiation fin 22 are changed. In addition, know-how is required because the finishing of the joining differs depending on the degree of adhesion between the electric furnace 50 and the base portion 21 during the heating operation. Further, there is a problem that it takes time and effort to manufacture some samples in advance and confirm whether the heat radiating fins 22 are steadily joined to the base portion 21.
本発明は、このような従来の事情に鑑みなされたものであり、ベース部に薄肉の放熱フィンを狭ピッチで一様に、かつ放熱フィンの接合部だけにハンダ材を塗布して、ハンダ接合することができるので、伝熱性能と品質が向上し、並びに不必要な加熱をしないで済む等、製造コストの低減を図ることが可能な放熱器の製造方法を提供することを目的とする。 The present invention has been made in view of such a conventional situation. A thin heat radiating fin is uniformly applied to a base portion at a narrow pitch, and a solder material is applied only to a joint portion of the heat radiating fin. Therefore, it is an object of the present invention to provide a method for manufacturing a radiator that can improve the heat transfer performance and quality, and can reduce the manufacturing cost such as unnecessary heating.
上記目的を達成するために、本発明に係る放熱器の製造方法は、ベースプレートの片面に少なくとも１つの放熱フィンを接合する放熱器の製造方法であって、前記放熱フィンの端部を挿入する略直線状の凹溝を複数平行に並べて設けた前記ベースプレートの前記片面に、前記凹溝の位置に合わせて、前記凹溝の長手方向に所定の間隔を空けて複数の矩形の開口部を設けたテンプレートを重ね合わせ、当該テンプレートを用いて前記矩形の開口部を通して前記凹溝上部に所定の間隔を空けてクリームハンダで半田印刷を行い、前記放熱フィンの前記端部を前記凹溝に挿入することで、前記クリームハンダが前記凹溝に沿って前記凹溝内部に押し広げられ、前記ベースプレートを加熱することで、前記ベースプレートの前記凹溝内の前記クリームハンダが溶融し、溶融ハンダの毛細管現象でぬれ広がり、前記放熱フィンの前記端部と前記ベースプレートとの間に溶融ハンダのフィレットが形成され、その後前記ベースプレートを冷却すると、前記ベースプレートに前記放熱フィンがハンダ接合されることを特徴とする。 In order to achieve the above object, a method of manufacturing a radiator according to the present invention is a method of manufacturing a radiator in which at least one radiating fin is joined to one surface of a base plate, and includes an end portion of the radiating fin. A plurality of rectangular openings are provided on the one surface of the base plate provided with a plurality of linear concave grooves arranged in parallel with a predetermined interval in the longitudinal direction of the concave grooves in accordance with the position of the concave grooves. Superimposing templates, solder printing with cream solder at a predetermined interval through the rectangular opening using the template, and inserting the end portions of the radiating fins into the concave grooves The cream solder is pushed and spread along the concave groove into the concave groove, and the base plate is heated, whereby the cream in the concave groove of the base plate is heated. When the solder melts and spreads by capillary action of the molten solder, a fillet of the molten solder is formed between the end portion of the radiating fin and the base plate, and then the base plate is cooled, the radiating fin is attached to the base plate. It is characterized by being soldered.
また、上記目的を達成するために、本発明に係る放熱器の製造方法は、上記した放熱器の製造方法であって、前記テンプレートを用いて前記矩形の開口部を通して前記凹溝上部にクリームハンダで半田印刷を行う際に、クリームハンダのクリームハンダ塗布部の長さをｗ、クリームハンダを半田印刷しない間隔をｓとすると、
ｗ／２ ＜ ｓ ＜ ｗ ・・・（式１）
（式１）の関係とすることを特徴とする。
In order to achieve the above object, a method of manufacturing a radiator according to the present invention is the above-described method of manufacturing a radiator, wherein cream solder is applied to the upper portion of the concave groove through the rectangular opening using the template. When solder printing is performed, the length of the cream solder application part of the cream solder is w, and the interval at which the solder paste is not printed is s.
w / 2 <s <w (Formula 1)
It is characterized by the relationship of (Formula 1).
また、上記目的を達成するために、本発明に係る放熱器の製造方法は、上記した放熱器の製造方法であって、前記ベースプレートの前記凹溝の長さは、前記放熱フィンの長さより、前後それぞれに所定の余長部を設けることを特徴とする。 In order to achieve the above object, the radiator manufacturing method according to the present invention is the above radiator manufacturing method, wherein the length of the concave groove of the base plate is greater than the length of the radiator fin. A predetermined extra length portion is provided on each of the front and rear sides.
また、上記目的を達成するために、本発明に係る放熱器の製造方法は、上記した放熱器の製造方法であって、前記ベースプレートの前記凹溝箇所と前記放熱フィンの少なくとも一方には、半田溶着可能な表面処理を施すことを特徴とする。 In order to achieve the above object, a radiator manufacturing method according to the present invention is a radiator manufacturing method described above, in which at least one of the concave groove portion of the base plate and the radiator fin is soldered. A surface treatment capable of welding is performed.
また、上記目的を達成するために、本発明に係る放熱器の製造方法は、上記した放熱器の製造方法であって、前記半田溶着可能な表面処理は、ニッケルメッキ処理であることを特徴とする。 Further, in order to achieve the above object, a radiator manufacturing method according to the present invention is the above radiator manufacturing method, wherein the solderable surface treatment is a nickel plating process. To do.
以上説明したように、本発明によれば、ベース部に薄肉の放熱フィンを狭ピッチで一様に、かつ放熱フィンの接合部だけにハンダ材を塗布して、ハンダ接合することができるので、伝熱性能と品質が向上し、並びに不必要な加熱をしないで済む等、製造コストの低減を図ることが可能な放熱器の製造方法を提供することができる。 As described above, according to the present invention, thin base heat radiation fins can be uniformly applied at a narrow pitch, and solder material can be applied only to the joint portions of the heat radiation fins, so that solder bonding can be performed. It is possible to provide a method of manufacturing a radiator that can reduce the manufacturing cost, such as improving heat transfer performance and quality, and eliminating unnecessary heating.
以下、本発明の一実施形態に係る放熱器について説明する。
本発明の一実施形態に係る放熱器では、ベース部に、放熱フィンに適合する幅の凹溝加工を施し、当該凹溝箇所にニッケルメッキを塗布した後、凹溝毎に所定の面積のクリームハンダを所定の間隔を空けて印刷する。そして、ベース部の凹溝に必要な枚数の放熱フィンを挿入することで、前記クリームハンダが凹溝内部を凹溝に沿って押し広げられる。その際、クリームハンダを所定の間隔を空けて印刷することで凹溝内部からベース部表面にあふれるクリームハンダを極力少なくすることができ、そして、ベース部を加熱することで、ベース部の凹溝内のクリームハンダが溶融し、溶融ハンダの毛細管現象でぬれ広がり、放熱フィンの下端部とベース部との間に溶融ハンダのフィレットが形成され、ベース部を冷却することによって、放熱フィンがベース部に安定してハンダ接合される。
なお、本発明の放熱器は、通信機器や映像機器や放送機器などの電子装置に限らず、高熱を発する電子部品を実装する電子装置で使用する放熱器であれば、本発明を適用することは可能である。
Hereinafter, a radiator according to an embodiment of the present invention will be described.
In the radiator according to the embodiment of the present invention, the base portion is subjected to a groove processing having a width suitable for the heat dissipation fin, and after applying nickel plating to the groove portion, a cream having a predetermined area is provided for each groove. The solder is printed at a predetermined interval. Then, by inserting the necessary number of heat dissipating fins into the concave groove of the base portion, the cream solder is spread along the concave groove. At that time, it is possible to minimize the cream solder overflowing from the inside of the groove to the surface of the base by printing the cream solder at a predetermined interval, and by heating the base, the groove of the base The inside of the solder solder melts and spreads by the capillary action of the molten solder, and a fillet of molten solder is formed between the lower end of the radiating fin and the base. By cooling the base, the radiating fin becomes the base. To be soldered stably.
Note that the heatsink of the present invention is not limited to electronic devices such as communication devices, video devices, and broadcasting devices, and the present invention is applicable to any heatsink that is used in electronic devices that mount electronic components that generate high heat. Is possible.
［放熱器の構成］
次に、本発明の一実施形態に係る放熱器の構成について、図１を参照して説明する。図１は、本発明の一実施形態に係る放熱器の構成を示す斜視図である。
本発明の一実施形態に係る放熱器１０は、図１に示すように、複数の凹溝１１ａを有するベース部１１と、下端部をベース部１１の凹溝１１ａに挿入後、クリームハンダを使用してベース部１１に接合された複数の放熱フィン１２とから構成されている。
ベース部１１の凹溝１１ａは、図１に示すように、ベース部１１の上方の主表面に、前後方向に略直線状に形成された凹形状の溝であり、溝幅は、後述するように放熱フィン１２の厚さに応じた寸法となっている。また、ベース部１１は、凹溝１１ａ加工を行った後、凹溝１１ａの箇所にニッケルメッキを施したものである。
なお、ベース部１１および放熱フィン１２の材質は、例えば、銅、アルミニウム、チタン、セラミック等である。
放熱フィン１２は、材料を所定の大きさに切断加工した後、ニッケルメッキを施したものである。
なお、ベース部１１の凹溝１１ａ箇所や放熱フィン１２に施す表面処理は、半田溶着可能な表面処理であれば、ニッケルメッキ以外の表面処理でもよい。
[Configuration of radiator]
Next, the structure of the heat radiator which concerns on one Embodiment of this invention is demonstrated with reference to FIG. FIG. 1 is a perspective view showing a configuration of a radiator according to an embodiment of the present invention.
As shown in FIG. 1, the radiator 10 according to an embodiment of the present invention uses a cream solder after inserting a base portion 11 having a plurality of concave grooves 11 a and a lower end portion into the concave grooves 11 a of the base portion 11. And a plurality of heat radiation fins 12 joined to the base portion 11.
As shown in FIG. 1, the concave groove 11a of the base portion 11 is a concave groove formed in a substantially linear shape in the front-rear direction on the main surface above the base portion 11, and the groove width will be described later. In addition, the dimensions correspond to the thickness of the heat dissipating fins 12. In addition, the base portion 11 is formed by performing nickel-plating on the portion of the concave groove 11a after processing the concave groove 11a.
In addition, the material of the base part 11 and the radiation fin 12 is copper, aluminum, titanium, ceramic etc., for example.
The heat radiating fins 12 are obtained by cutting a material into a predetermined size and then performing nickel plating.
The surface treatment applied to the concave groove 11a portion of the base portion 11 and the heat radiation fin 12 may be a surface treatment other than nickel plating as long as the surface treatment can be performed by solder welding.
［放熱器の製造方法］
次に、本発明の一実施形態に係る放熱器の製造方法について、図１〜図６を用いて説明する。図２は、本発明の一実施形態に係る放熱器においてベース部へのクリームハンダ印刷工程を説明するための図であり、図２（ａ）はクリームハンダ印刷時の作業手順を説明するための説明図であり、また、図２（ｂ）はクリームハンダ印刷後のベース部の状態を示している。図３は、図２（ｂ）においてクリームハンダ印刷後のベース部各部の寸法を示す図であり、図３（ａ）は上方から見た平面図であり、また、図３（ｂ）は前方正面から見た正面図である。図４は、ベース部の凹溝へ放熱フィンを挿入する際のベース部と放熱フィンとの位置関係を示す斜視図である。図５は、図４におけるＡ−Ａ面で切断した断面図で、放熱フィンをベース部の凹溝に挿入する前後の状態を説明する図であり、図５（ａ）は放熱フィンをベース部の凹溝に挿入する前を示す図であり、また、図５（ｂ）は放熱フィンをベース部の凹溝に挿入した後を示す図である。図６は、ベース部の凹溝へ放熱フィンを挿入した後、ベース部に加熱処理を加えた後の状態を示す図であり、図４のＢ−Ｂ断面に相当する断面図である。
[Manufacturing method of radiator]
Next, the manufacturing method of the heat radiator which concerns on one Embodiment of this invention is demonstrated using FIGS. FIG. 2 is a diagram for explaining a cream solder printing process on a base portion in a radiator according to an embodiment of the present invention, and FIG. 2 (a) is a diagram for explaining a work procedure at the time of cream solder printing. It is explanatory drawing and FIG.2 (b) has shown the state of the base part after cream solder printing. FIG. 3 is a view showing dimensions of each part of the base portion after the cream solder printing in FIG. 2B, FIG. 3A is a plan view seen from above, and FIG. 3B is a front view. It is the front view seen from the front. FIG. 4 is a perspective view showing a positional relationship between the base portion and the heat radiating fin when the heat radiating fin is inserted into the concave groove of the base portion. FIG. 5 is a cross-sectional view taken along plane AA in FIG. 4 and is a diagram for explaining the state before and after inserting the radiating fin into the concave groove of the base portion. FIG. FIG. 5B is a diagram illustrating a state after the heat radiation fin is inserted into the concave groove of the base portion. FIG. 6 is a view showing a state after the heat radiation fin is inserted into the concave groove of the base portion and then the heat treatment is applied to the base portion, and is a cross-sectional view corresponding to the BB cross section of FIG. 4.
最初に、ベース部１１の主表面上にクリームハンダ１６を印刷するが、クリームハンダ１６を凹溝１１ａの箇所に印刷する際、凹溝１１ａの箇所の長手方向（前後方向）すべてに印刷せず、所定の間隔を空けて印刷することが重要である。
そこで、ベース部１１の凹溝１１ａの箇所にクリームハンダ１６を所定の間隔を空けて印刷するために、図２（ａ）に示すように、左右方向は凹溝１１ａ間のピッチに合わせ、前後方向に所定の間隔を空けて角穴１５ａ（ｗ×ｂ）を設けたテンプレート１５を予め準備しておく。そして、テンプレート１５の角穴１５ａをベース部１１の凹溝１１ａの位置に合わせ、テンプレート１５をベース部１１の主表面上に重ね合わせて固定した後、テンプレート１５の上でクリームハンダ１６をスキージ１７で矢印Ｒ１方向に引き伸ばすと、角穴１５ａを通して凹溝１１ａ上部に半田が印刷される。
図２（ａ）に示す印刷作業が終了した後、ベース部１１の主表面上からテンプレート１５を取り外すと、図２（ｂ）、図３（ａ）および図３（ｂ）のように、ベース部１１の凹溝１１ａの所定の位置に、クリームハンダ塗布部１６ａ（ｗ×ｂ）で示すように半田印刷が為される。
First, the cream solder 16 is printed on the main surface of the base portion 11, but when the cream solder 16 is printed on the groove 11a, the cream solder 16 is not printed in all the longitudinal direction (front-rear direction) of the groove 11a. It is important to print at a predetermined interval.
Therefore, in order to print the cream solder 16 on the concave grooves 11a of the base portion 11 at a predetermined interval, as shown in FIG. 2 (a), the horizontal direction is adjusted to the pitch between the concave grooves 11a. A template 15 provided with square holes 15a (w × b) at predetermined intervals in the direction is prepared in advance. Then, the square hole 15 a of the template 15 is aligned with the position of the concave groove 11 a of the base portion 11, and the template 15 is superimposed and fixed on the main surface of the base portion 11, and then the cream solder 16 is placed on the template 15 with the squeegee 17. When it is stretched in the direction of the arrow R1, solder is printed on the concave groove 11a through the square hole 15a.
When the template 15 is removed from the main surface of the base portion 11 after the printing operation shown in FIG. 2A is completed, the base as shown in FIG. 2B, FIG. 3A, and FIG. Solder printing is performed at a predetermined position of the groove 11a of the part 11 as shown by the cream solder application part 16a (w × b).
ベース部１１の凹溝１１ａの所定の箇所にクリームハンダ塗布部１６ａが形成された後、図４および図５（ａ）に示すように、放熱フィン１２の下端部を凹溝１１ａの所定の位置に挿入すると、図５（ｂ）に示すように、クリームハンダ塗布部１６ａが凹溝１１ａに挿入された放熱フィン１２の下端部によって押され、矢印Ｒ２で示すように、凹溝１１ａに沿って前後方向に広がり、放熱フィン１２の下端部は凹溝１１ａの所定の位置に挿入し終えた状態となる。
ベース部１１の凹溝１１ａに放熱フィン１２を必要な枚数挿入した後、ベース部１１の底面を図示していない電気炉で加熱すると、図５（ｂ）に示したクリームハンダ塗布部１６ａが溶融し、クリームハンダ塗布部１６ａが凹溝１１ａに沿って同様に矢印Ｒ２で示すように、凹溝１１ａに沿って前後方向に溶融ハンダの毛細管作用で濡れ広がっていく。
そして、溶融したクリームハンダ塗布部１６ａがベース部１１の凹溝１１ａと放熱フィン１２との隙間に均一に流れ込むことによって、その後ベース部１１が冷却されると、図１および図６に示すように、ベース部１１と放熱フィン１２との間に仕上がりの良好なハンダフィレットを含んだハンダ凝固部１６ｂが形成され、ベース部１１に放熱フィン１２を安定した状態で接合することができる。
After the cream solder application portion 16a is formed at a predetermined location of the concave groove 11a of the base portion 11, as shown in FIGS. 4 and 5A, the lower end portion of the radiating fin 12 is placed at a predetermined position of the concave groove 11a. As shown in FIG. 5 (b), the cream solder application part 16a is pushed by the lower end of the radiating fin 12 inserted into the concave groove 11a, and along the concave groove 11a as shown by the arrow R2. It spreads in the front-rear direction, and the lower end of the radiating fin 12 is in a state where it has been inserted into a predetermined position of the concave groove 11a.
After inserting a necessary number of the heat radiation fins 12 into the concave groove 11a of the base part 11, when the bottom surface of the base part 11 is heated in an electric furnace (not shown), the cream solder application part 16a shown in FIG. Then, as indicated by the arrow R2, the cream solder application portion 16a spreads along the concave groove 11a by the capillary action of the molten solder in the front-rear direction along the concave groove 11a.
Then, when the melted cream solder application part 16a flows uniformly into the gap between the concave groove 11a of the base part 11 and the heat radiation fin 12, and then the base part 11 is cooled, as shown in FIG. 1 and FIG. A solder solidified portion 16b including a solder fillet with good finish is formed between the base portion 11 and the radiating fin 12, and the radiating fin 12 can be joined to the base portion 11 in a stable state.
ここで、図２および図３に示すように、クリームハンダ１６のクリームハンダ塗布部１６ａの長さをｗ、クリームハンダ１６を印刷しない間隔をｓとすると、
ｗ／２ ＜ ｓ ＜ ｗ ・・・（式１）
（式１）の関係とすることにより、クリームハンダ１６がベース部１１の上面に余分にあふれ出さずに、ベース部１１と放熱フィン１２との間で良好なハンダ接合が達成できる。
即ち、放熱フィン１２の下端部をベース部１１の凹溝１１ａの中に挿入した際に、間隔ｓが（式１）の値より大きすぎると、溶融したクリームハンダ１６が凹溝１１ａと放熱フィン１２との間の隙間にうまく埋まらない部分が生じてしまう。一方、間隔ｓが（式１）の値より小さすぎると、溶融したクリームハンダ１６が凹溝１１ａと放熱フィン１２との間の隙間を乗り越えて、ベース部１１の主表面上に余分に流れ出してしまうなどの問題が生じてしまう。このため、（式１）の関係を保つことで、凹溝１１ａに挿入した放熱フィン１２と、凹溝１１ａを形成したベース部１１との間に仕上がりの良いハンダフィレットを含んだハンダ凝固部１６ｂが形成でき、強度的に品質の良い放熱器１０を製作することができる。
Here, as shown in FIGS. 2 and 3, when the length of the cream solder application portion 16a of the cream solder 16 is w and the interval at which the cream solder 16 is not printed is s,
w / 2 <s <w (Formula 1)
By adopting the relationship of (Formula 1), the cream solder 16 does not overflow excessively on the upper surface of the base portion 11, and good solder bonding can be achieved between the base portion 11 and the radiation fins 12.
That is, when the lower end portion of the radiating fin 12 is inserted into the recessed groove 11a of the base portion 11 and the interval s is too larger than the value of (Equation 1), the melted cream solder 16 is moved into the recessed groove 11a and the radiating fin. The part which is not buried well in the clearance gap between 12 will arise. On the other hand, if the distance s is too smaller than the value of (Equation 1), the melted cream solder 16 gets over the gap between the concave groove 11a and the heat radiating fin 12 and flows out excessively on the main surface of the base portion 11. Problems will occur. For this reason, by maintaining the relationship of (Equation 1), a solder solidified portion 16b including a solder fillet having a good finish between the heat dissipating fins 12 inserted into the concave groove 11a and the base portion 11 formed with the concave groove 11a. Therefore, it is possible to manufacture the radiator 10 having a high quality in terms of strength.
つまり、ベース部１１の凹溝１１ａ箇所にクリームハンダ１６を所定の間隔を空けて印刷することで、接合する放熱フィン１２の下端部を凹溝１１ａ内部に挿入する際の圧力によって、クリームハンダ塗布部１６ａの両端が凹溝１１ａに沿って押し広げられ、クリームハンダ塗布部１６ａのクリームハンダが凹溝１１ａ内部からベース部１１表面に大きく溢れることなく、凹溝１１ａと放熱フィン１２との間の隙間に沿って流れるようにすることができる。 That is, the cream solder 16 is printed at a predetermined interval on the concave groove 11a of the base portion 11, so that the solder solder is applied by the pressure when the lower end portion of the radiating fin 12 to be joined is inserted into the concave groove 11a. Both ends of the portion 16a are spread along the concave groove 11a, and the cream solder of the cream solder application portion 16a is not greatly overflowed from the inside of the concave groove 11a to the surface of the base portion 11, so that the gap between the concave groove 11a and the radiating fin 12 is increased. It can be made to flow along the gap.
また、クリームハンダを使用することにより、クリームハンダの昇温温度や加熱温度の設定はハンダメーカ推奨のプロファイルを活用することができるので、従来のろう付による方法のように、Ｎｉ＋Ｓｎ合金による接合のためにニッケルメッキと錫メッキのメッキ厚の管理に注力することなく、ハンダ接合での仕上がりも均一化されるので、放熱器を製作する前にハンダの接合状態を確認するためのサンプルを作成する等の手間を削減することができる。 Also, by using cream solder, it is possible to use the solder manufacturer's recommended profile for setting the temperature rise and heating temperature of the cream solder. Therefore, as with the conventional brazing method, joining with Ni + Sn alloy is possible. For this reason, the finish of solder bonding is made uniform without focusing on the management of nickel plating and tin plating thickness. Etc. can be reduced.
また、クリームハンダを使用することにより、ベース部を電気炉で加熱する際に、ベース部と放熱フィンとの接合箇所までを加熱の範囲とすれば良いため、従来のろう付による方法のように、薄板の放熱フィン全体を加熱することがなく、薄板の放熱フィンに変形を生じさせるような高熱を加えることがないため、放熱フィンの軟化および変形を防止することができる。 Also, by using cream solder, when heating the base part with an electric furnace, it is only necessary to set the heating range up to the joint part between the base part and the radiating fin. In addition, since the entire thin plate heat dissipating fins are not heated and high heat that causes deformation of the thin heat dissipating fins is not applied, softening and deformation of the heat dissipating fins can be prevented.
なお、クリームハンダをベース部に印刷する際、クリームハンダをベース部の凹溝に所定の間隔を空けて印刷することにより、クリームハンダの塗布量が均一で、クリームハンダが過剰に供給されないようにしている。
そのためには、放熱フィンの板厚ｔを基本とした関係式により、クリームハンダ塗布部（テンプレートの角穴）の寸法やベース部の凹溝の寸法を、例えば下記のようにするとよい。
図３に示すように、放熱フィン１２の厚さをｔ、ベース部１１の凹溝１１ａの溝幅および深さをδ、クリームハンダ塗布部１６ａ（テンプレート１５の角穴１５ａと同様）の幅をｂとすると、
（１）ベース部１１の凹溝１１ａの溝幅および深さδ＝ｔ＋（０．２ｍｍ〜０．３ｍｍ）
（２）クリームハンダ塗布部１６ａの幅ｂ＝δ＋（０．２ｍｍ〜０．４ｍｍ）
とすることで、ベース部と放熱フィンとの間で良好なハンダ接合が可能となる。
When printing the cream solder on the base part, the cream solder is printed in the concave groove of the base part with a predetermined interval so that the amount of cream solder applied is uniform and the cream solder is not supplied excessively. ing.
For that purpose, the size of the cream solder application part (template square hole) and the dimension of the concave groove of the base part may be set as follows, for example, by a relational expression based on the plate thickness t of the radiating fin.
As shown in FIG. 3, the thickness of the radiating fin 12 is t, the groove width and depth of the concave groove 11a of the base portion 11 is δ, and the width of the cream solder application portion 16a (similar to the square hole 15a of the template 15). If b,
(1) Groove width and depth of the concave groove 11a of the base portion 11 δ = t + (0.2 mm to 0.3 mm)
(2) Width b = δ + (0.2 mm to 0.4 mm) of cream solder application part 16a
By doing so, it is possible to perform good solder bonding between the base portion and the radiation fin.
また、図１に示すように、ベース部１１の凹溝１１ａの加工長さは放熱フィン１２の前後方向の長さよりそれぞれ余長部Ｌ１を設けることで、万が一クリームハンダが過剰に供給された場合でも、余長部Ｌ１内で溶融したクリームハンダの余分な量を受け止めることができ、ベース部１１から外部へのクリームハンダの流出を防止することができる。 In addition, as shown in FIG. 1, the processing length of the concave groove 11 a of the base portion 11 is provided with an extra length portion L <b> 1 from the length in the front-rear direction of the radiating fin 12, so that by any chance cream solder is excessively supplied However, it is possible to catch an excess amount of the cream solder melted in the extra length portion L1, and to prevent the cream solder from flowing out from the base portion 11 to the outside.
また、図７に示すように、従来の放熱器は、放熱フィンにニッケルメッキと錫メッキを施す必要があったが、本発明の放熱器では、放熱フィンとベース部とのハンダ接合にクリームハンダを使用するため、放熱フィンを製作する際、放熱フィンへの錫メッキ処理が不要で、ニッケルメッキ処理のみとなるため、放熱フィンの製造工程が従来より短縮され、放熱器のコストダウンにつながる。 In addition, as shown in FIG. 7, the conventional heatsink has to be plated with nickel and tin on the heatsink fins. In the heatsink of the present invention, cream solder is used for soldering between the heatsink fins and the base part. Therefore, when manufacturing the radiating fins, tin plating is not required for the radiating fins, and only the nickel plating process is required. Therefore, the manufacturing process of the radiating fins is shortened compared to the conventional method, leading to cost reduction of the radiator.
以上説明したように、本発明の一実施形態に係る放熱器によれば、ベース部に薄肉の放熱フィンを狭ピッチで一様に、かつ放熱フィンの接合部だけにハンダ材を塗布して、ハンダ接合することができるので、伝熱性能と品質が向上し、並びに不必要な加熱をしないで済む等、製造コストの低減を図ることが可能な放熱器の製造方法を提供することができる。 As described above, according to the radiator according to one embodiment of the present invention, the thin radiating fin is uniformly applied to the base portion at a narrow pitch, and the solder material is applied only to the joining portion of the radiating fin, Since it can be soldered, it is possible to provide a method of manufacturing a radiator capable of improving the heat transfer performance and quality and reducing the manufacturing cost, such as unnecessary heating.
なお、本発明は、上記実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合せにより種々の発明を形成できる。
さらに、本発明は、上記実施形態そのままに限定されるものではなく、ニッケルメッキ以外の表面処理でもよく、放熱フィンおよびベース部の材料に金属以外の非金属材料等、どのような材料でも適用可能である。
Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.
Furthermore, the present invention is not limited to the above-described embodiment as it is, but may be a surface treatment other than nickel plating, and any material such as a non-metal material other than metal can be applied to the material of the heat radiating fin and the base portion. It is.
本発明は、通信機器や映像機器や放送機器などの電子装置に限らず、高熱を発する電子部品を実装する電子装置で使用する放熱器を製造する産業で利用される。 The present invention is not limited to electronic devices such as communication devices, video devices, and broadcasting devices, but is used in industries that manufacture heat radiators that are used in electronic devices that mount electronic components that generate high heat.
１０：放熱器、１１：ベース部、１１ａ：凹溝、１２：放熱フィン、１５：テンプレート、１５ａ：角穴、１６：クリームハンダ、１６ａ：クリームハンダ塗布部、１６ｂ：ハンダ凝固部、１６ｃ：ハンダ凝固部、１７：スキージ、２０：放熱器、２１：ベース部、２１ａ：凹溝、２２：放熱フィン、２２ａ：ニッケルメッキ、２２ｂ：錫メッキ、２５：Ｎｉ＋Ｓｎ合金、５０：電気炉。
10: radiator, 11: base portion, 11a: concave groove, 12: heat radiation fin, 15: template, 15a: square hole, 16: cream solder, 16a: cream solder application portion, 16b: solder coagulation portion, 16c: solder Solidification part, 17: Squeegee, 20: Radiator, 21: Base part, 21a: Groove, 22: Radiation fin, 22a: Nickel plating, 22b: Tin plating, 25: Ni + Sn alloy, 50: Electric furnace.
Claims (5)
前記放熱フィンの端部を挿入する略直線状の凹溝を複数平行に並べて設けた前記ベースプレートの前記片面に、前記凹溝の位置に合わせて、前記凹溝の長手方向に所定の間隔を空けて複数の矩形の開口部を設けたテンプレートを重ね合わせ、当該テンプレートを用いて前記矩形の開口部を通して前記凹溝上部に所定の間隔を空けてクリームハンダで半田印刷を行い、前記放熱フィンの前記端部を前記凹溝に挿入することで、前記クリームハンダが前記凹溝に沿って前記凹溝内部に押し広げられ、前記ベースプレートを加熱することで、前記ベースプレートの前記凹溝内の前記クリームハンダが溶融し、溶融ハンダの毛細管現象でぬれ広がり、前記放熱フィンの前記端部と前記ベースプレートとの間に溶融ハンダのフィレットが形成され、その後前記ベースプレートを冷却すると、前記ベースプレートに前記放熱フィンがハンダ接合されることを特徴とする放熱器の製造方法。 A method of manufacturing a radiator in which at least one radiating fin is joined to one side of a base plate,
A predetermined interval is provided in the longitudinal direction of the concave groove on the one surface of the base plate in which a plurality of substantially linear concave grooves into which the end portions of the heat radiating fins are inserted are arranged in parallel. A plurality of rectangular openings are superposed on each other, and solder printing is performed with cream solder at a predetermined interval on the concave groove upper portion through the rectangular openings using the template. By inserting the end portion into the concave groove, the cream solder is spread inside the concave groove along the concave groove, and by heating the base plate, the cream solder in the concave groove of the base plate Melts and spreads by the capillarity of the molten solder, and a fillet of the molten solder is formed between the end portion of the radiating fin and the base plate. On cooling the base plate, heat sink method of manufacturing the radiating fin to the base plate is characterized in that it is soldered.
ｗ／２ ＜ ｓ ＜ ｗ ・・・（式１）
（式１）の関係とすることを特徴とする放熱器の製造方法。 It is a manufacturing method of the radiator of Claim 1, Comprising: When performing solder printing with cream solder on the said ditch | groove upper part through the said rectangular opening using the said template, the length of the cream solder application part of cream solder If w is w and the interval where the solder paste is not solder printed is s,
w / 2 <s <w (Formula 1)
A method of manufacturing a radiator, characterized by satisfying the relationship of (Formula 1).
5. The method of manufacturing a radiator according to claim 1, wherein the solderable surface treatment is a nickel plating process. 6.
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