KR101735439B1 - Manufacturing method for radiant heat circuit board - Google Patents

Manufacturing method for radiant heat circuit board Download PDF

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Publication number
KR101735439B1
KR101735439B1 KR1020150128152A KR20150128152A KR101735439B1 KR 101735439 B1 KR101735439 B1 KR 101735439B1 KR 1020150128152 A KR1020150128152 A KR 1020150128152A KR 20150128152 A KR20150128152 A KR 20150128152A KR 101735439 B1 KR101735439 B1 KR 101735439B1
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KR
South Korea
Prior art keywords
heat
circuit board
printed circuit
heat sink
sink pad
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Application number
KR1020150128152A
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Korean (ko)
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KR20170030797A (en
Inventor
권석표
Original Assignee
주식회사 코스모텍
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Priority to KR1020150128152A priority Critical patent/KR101735439B1/en
Publication of KR20170030797A publication Critical patent/KR20170030797A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a method of manufacturing a heat-dissipating printed circuit board in which a heat sink pad for inserting a heat sink pad which is economical and mass-producible while being capable of effectively dissipating heat from a printed circuit board is formed. Forming a primary plating layer of copper on the front and back surfaces of the printed circuit board and inside the heat dissipation holes; Inserting a built-in heat sink pad into the heat dissipating hole; (S4) forming a secondary plating layer made of copper on the front and back surfaces of the printed circuit board, inside the heat dissipation hole in which the internal heat sink pad is inserted, and on the internal heat sink pad; (S5) forming a PSR ink layer on the front and rear surfaces of the printed circuit board; Filling the solder into the PSR ink layer in the heat dissipating hole and curing (S6); And a step (S7) of attaching an external heat sink pad to the front surface or back surface of the cured solder and mounting the electronic component at the same time, wherein the internal heat sink pad in step S3 includes a body having a disc shape And protrusions formed integrally on the outer circumferential surface of the body, wherein the protrusions are formed to be equally spaced on the outer circumferential surface of the body, and the protrusions can be brought into close contact with the heat dissipating holes while causing plastic deformation when the protrusions are inserted into the heat dissipating holes.

Description

Technical Field [0001] The present invention relates to a manufacturing method of a heat-dissipating printed circuit board having a heat sink pad inserted therein,

The present invention relates to a method of manufacturing a heat-dissipating printed circuit board in which a heating sink pad is inserted.

2. Description of the Related Art In general, a printed circuit board (PCB) is formed with a circuit pattern through which electric current flows, and at the same time, a large number of electronic components are mounted. Therefore, Such high temperature heat causes the temperature of the printed circuit board to rise, thereby causing malfunction of the electronic component and causing the reliability of the printed circuit board to deteriorate.

As shown in FIG. 1, in order to maximize the area of contact between the printed circuit board P and outside air, a conventional method for heat dissipation of a printed circuit board The heat dissipating method using only the heat dissipating hole H has a limited effect on the amount of heat dissipated by the heat dissipating hole H and the effect is insufficient.

Various studies have been conducted in order to solve such problems, and representative examples thereof include Korean Patent Publication No. 10-2012-0072689 and Korean Patent Publication No. 10-2010-0109332.

Korean Patent Laid-Open Publication No. 10-2012-0072689 discloses a heat dissipation circuit board in which a heat dissipation fin is inserted into a heat dissipation hole and then a heat dissipation fin is embedded in a heat dissipation hole, and a manufacturing method thereof.

Also, Korean Patent Laid-Open No. 10-2010-0109332 discloses a chip-type heat sink which is soldered to a conductive pattern of a printed circuit board by reflow soldering adjacent to a lead frame of a heat generating element to emit heat of the heat generating element. .

However, since the heat dissipation circuit board disclosed in Korean Patent Laid-Open Publication No. 10-2012-0072689 does not have a fixing means in the heat dissipation fin or the heat dissipation hole, when the heat dissipation fin is embedded in the heat dissipation hole, , So that the process of embedding the heat sink pin can not be performed smoothly, and the productivity can not be improved.

In addition, since the chip type heat sink disclosed in the aforementioned Korean Patent Laid-Open No. 10-2010-0109332 is soldered on a printed circuit board, it is not easy to apply to a recent printed circuit board which is integrated and miniaturized, There is a problem that productivity is lowered due to soldering work.

In addition, the chip-type heat sink disclosed in the aforementioned Korean Patent Laid-Open No. 10-2010-0109332 has another problem in that it is not easy to manufacture since the grooves are formed on the outer circumferential surface in order to increase the heat radiation effect by enlarging the surface area.

The present invention provides a method of manufacturing a heat-dissipating printed circuit board in which a heat sink pad is inserted, which is economical and mass-producible, while effectively dissipating heat from a printed circuit board.

The technical objects to be achieved by the present invention are not limited to the above-mentioned technical problems.

According to an aspect of the present invention, there is provided a method of manufacturing a heat dissipation printed circuit board, comprising: forming a heat dissipation hole in a printed circuit board; Forming a primary plating layer of copper on the front and back surfaces of the printed circuit board and inside the heat dissipation holes; Inserting a built-in heat sink pad into the heat dissipating hole; (S4) forming a secondary plating layer made of copper on the front and back surfaces of the printed circuit board, inside the heat dissipation hole in which the internal heat sink pad is inserted, and on the internal heat sink pad; (S5) forming a PSR ink layer on the front and rear surfaces of the printed circuit board; Filling the solder into the PSR ink layer in the heat dissipating hole and curing (S6); And a step (S7) of attaching an external heat sink pad to the front surface or back surface of the cured solder and mounting the electronic component at the same time, wherein the internal heat sink pad in step S3 includes a body having a disc shape And protrusions formed integrally on the outer circumferential surface of the body, wherein the protrusions are formed to be equally spaced on the outer circumferential surface of the body, and the protrusions can be brought into close contact with the heat dissipating holes while causing plastic deformation when the protrusions are inserted into the heat dissipating holes.

As described above, the present invention has an advantage that the heat of the printed circuit board can be efficiently dissipated through the heat sink.

In addition, since the heat sink pad is fixed while causing plastic deformation in the heat dissipating hole, it is possible to prevent the heat sink pad from being separated from the heat dissipating hole in a process to be described later, Can be greatly reduced and mass production can be performed.

1 is a schematic view of a conventional printed circuit board,
2 is a diagram illustrating various embodiments of heat sink pads according to the present invention,
3 to 9 are views showing a process of manufacturing a heat-dissipating printed circuit board according to the present invention,
10 is a flowchart illustrating a process of manufacturing a heat-dissipating printed circuit board according to the present invention, and
FIG. 11 is a photograph of a heat-dissipating printed circuit board according to the present invention in which the heat sink pad shown in FIG. 2 is mounted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference symbols whenever possible. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

FIG. 2 shows various embodiments of the heat sink pad 100 for internal use according to the present invention. The internal heat sink pad 100 may be made of copper (Cu) or a copper-based alloy.

The built-in heat sink pad 100 is disposed in a heat dissipating hole 210 (see FIG. 3) formed in a printed circuit board (PCB) (see FIG. 3) to heat the heat of the printed circuit board 102a, 103a and 104a having a disk shape and protrusions 101b, 102b and 102b integrally formed on the outer circumferential surfaces of the bodies 101a, 102a, 103a and 104a, 103b, 104b.

The protrusions 101b, 102b, 103b and 104b are equally spaced on the outer circumferential surface of the bodies 101a, 102a, 103a and 104a as shown in FIG. 2. The protrusions 101b, 102b, The number is not limited as shown in FIG. That is, the protrusions may be formed as seven or more as long as the protrusions are formed to be equally spaced on the outer circumferential surface of the body.

The reason why the protrusions 101b, 102b, 103b and 104b are equally spaced on the outer circumferential surfaces of the bodies 101a, 102a, 103a and 104a is that the heat sink pad for internal use 100 is placed in the heat dissipating hole 210 The heat sink pad 100 for internal use is prevented from tilting in a specific direction and inserted into the heat dissipating hole 210 stably. Since the projections 101b, 102b, 103b and 104b are directly abutted against the printed circuit board (PCB), the protrusions 101b, 102b, 103b, It is preferable to form equal intervals on the outer circumferential surface.

On the other hand, when the built-in heat sink pad 100 is inserted into the heat dissipating hole 210, the protrusions 101b, 102b, 103b and 104b are brought into close contact with the heat dissipating hole 210 while causing plastic deformation. 101b, 102b, 103b, and 104b, the internal heat sink pad 100 is strongly detached from the heat dissipating hole 210. [

In order to prevent the heat sink hole 210 from being damaged when the heat sink pad 100 is inserted into the heat dissipation hole 210, the built-in heat sink pad 100 may be smoothly rounded, such as "A" or "B" Or the outer peripheral surfaces of the bodies 101a, 102a, 103a, 104a and the projections 101b, 102b, 103b, 104b may have a semicircular cross-sectional shape.

In addition, the built-in heat sink pad 100 may be surface treated with a pure metal or a metal alloy such as gold (Au) or tin (Sn) having a high thermal conductivity so as to increase heat conduction and heat emission efficiency.

A method of manufacturing a heat-dissipating printed circuit board (PCB) into which the heat sink pad 100 for built-in use is inserted will be described below.

In order to manufacture a heat-radiating printed circuit board (PCB-R) according to the present invention, first, a heat dissipating hole 210 is formed in a printed circuit board (PCB) (step S1; see FIG. 3) Similarly, the first and second plating layers 220 are formed on the front and back surfaces of the printed circuit board (PCB) and the inside of the heat dissipation hole 210 by copper plating (step S2).

In step S1, the printed circuit board (PCB) is mounted on the printed circuit board (PCB) in such a manner that the copper foil 201 and the insulating layer 202 are alternately layered, And it is possible to use a commercially available printed circuit board.

The method of forming the heat dissipation hole 210 in step S1 and the method of forming the primary plating layer 220 in step S2 are well known and will not be described in detail.

When the first plating layer 220 is formed on the printed circuit board PCB as described above (step S2), the built-in heat sink pad 100 is inserted into the heat dissipating hole 210 (step S3).

The protrusions 101b, 102b, 103b and 104b of the built-in heat sink pad 100 are brought into close contact with the heat dissipating hole 210 (refer to FIG. 5B) while causing plastic deformation as described above, The bodies 101a, 102a, 103a and 104a of the built-in heat sink pad 100 are spaced apart from the heat dissipating holes 210 by a predetermined distance 211, preferably between 200 μm and 800 μm, The reason for this is that when the interval 211 after inserting the heat sink pad 100 for internal use into the heat dissipating hole 210 is 200 m or more, the plating liquid is separated from the gap 211 (step S4) in the secondary plating layer 230 forming step The solder paste application and curing step S6 (step S6), which is a step to be described later, is performed smoothly to smoothly fix the protrusions 101b, 102b, 103b and 104b and the primary plating layer 220, The solder 250 (see FIG. 8) can be easily filled in the heat dissipating hole 210. In this case, as shown in FIG.

In step S3, the insertion of the internal heat sink pad 100 is physically performed, and the internal heat sink pad 100 may be manually or mechanically connected to the heat dissipating hole 210 The car is fixed.

6, the surface and back of the printed circuit board (PCB), the inside of the heat dissipating hole 210 in which the internal heat sink pad 100 is inserted, and the internal heat The secondary pad layer 230 is formed by performing secondary plating on the sink pad 100 with a copper material (step S4). 6B, the protrusions 101b, 102b, 103b and 104b of the built-in heat sink pad 100 and the inside of the heat dissipating hole 210 are filled with the secondary plating layer 230 So that the built-in heat sink pad 100 is more firmly fixed to the heat dissipating hole 210 so as not to flow in the heat dissipating hole 210.

6A, after the secondary plating layer 230 is formed, the bodies 101a, 102a, 103a, and 104a of the internal heat sink pad 100 are inserted into the heat dissipating holes 210 It is preferable that the solder 250 (see FIG. 8) is easily filled in the heat dissipating hole 210 in the solder application and curing step S6, which will be described later, The solder 250 is attached to the heat dissipating hole 210 symmetrically after the curing, so that the attached force is not directed toward one side.

After the secondary plating layer 230 is formed as described above, an electronic circuit and photo solder resist (PSR) ink are applied to the front and back surfaces of the printed circuit board (PCB) on which the primary plating layer 220 is formed, After the layer 240 is formed (step S5), the solder 250 is filled up to the PSR ink layer 240 in the heat dissipating hole 210 and then cured (step S6).

Here, the material of the solder 250 is an alloy having a high thermal conductivity and a low melting point. For example, the solder 250 may be SnPb (flexible solder) or SnAgCu (lead-free solder).

The solder 250 may be a solder mixed with components other than SnPb (flexible solder) or SnAgCu (lead-free solder). The solder 250 may be filled through the upper part of the heat dissipating hole 210 When heat is applied to the solder 250, the solder 250 is melted to fill the gap 212 without any gap, and the filled solder 250 is cured at room temperature. The built-in heat sink pad 100 is thirdarily fixed inside the heat dissipating hole 210 by the solder 250 which is cured.

9, after the step S6, an external heat sink pad 260 is attached to the front surface or back surface of the cured solder 250 to facilitate heat dissipation, (S7) of mounting the heat-radiating printed circuit board (PCB-R) according to the present invention is completed.

The mounting state of the built-in heat sink pad 100 in the thus-manufactured heat-radiating printed circuit board (PCB-R) finished product according to the present invention is shown in FIG.

The manufacturing method of the heat-dissipating printed circuit board having the heat sink pad inserted therein is not limited to the configuration and the operation method of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: Built-in heat sink pad 210: Heat dissipation hole
220: primary plating layer 230: secondary plating layer
240: PSR ink layer 250: solder
260: External heat sink pad

Claims (1)

A method of manufacturing a heat-dissipating printed circuit board,
Forming a heat dissipating hole in the printed circuit board (S1);
(S2) forming a primary plating layer of copper on the front and back surfaces of the printed circuit board and inside the heat dissipation holes;
(S3) of inserting a built-in heat sink pad into the heat dissipating hole and fixing the built-in heat sink pad to the heat dissipating hole;
A second plating layer made of a copper material is formed on the front and back surfaces of the printed circuit board, inside the heat dissipation hole in which the internal heat sink pad is inserted, and on the internal heat sink pad, (S4) securing the sink pad to the heat dissipating hole;
(S5) forming a PSR ink layer on the front and rear surfaces of the printed circuit board;
(S6) of filling the solder in the heat dissipating hole up to the PSR ink layer and curing the solder, and fixing the internal heat sink pad to the heat dissipating hole by the solder in a third order (S6); And
(S7) attaching an external heat sink pad to the surface or back surface of the cured solder and mounting the electronic component,
The built-in heat sink pad in the step (S3)
A body having a disk shape and protrusions integrally formed on an outer circumferential surface of the body,
The protrusions are formed on the outer circumferential surface of the body at equal intervals,
Wherein the heat dissipation holes are spaced apart from each other by an interval of not less than 200 占 퐉 and not more than 800 占 퐉, wherein the heat dissipation printed circuit board Gt;
KR1020150128152A 2015-09-10 2015-09-10 Manufacturing method for radiant heat circuit board KR101735439B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150128152A KR101735439B1 (en) 2015-09-10 2015-09-10 Manufacturing method for radiant heat circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150128152A KR101735439B1 (en) 2015-09-10 2015-09-10 Manufacturing method for radiant heat circuit board

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Publication Number Publication Date
KR20170030797A KR20170030797A (en) 2017-03-20
KR101735439B1 true KR101735439B1 (en) 2017-05-15

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111654979A (en) * 2020-06-30 2020-09-11 博敏电子股份有限公司 Method for embedding copper pillar in seamless connection mode in through hole
CN113966067A (en) * 2020-07-20 2022-01-21 宏恒胜电子科技（淮安）有限公司 Circuit board and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2010258260A (en) * 2009-04-27 2010-11-11 Nec Corp Heat radiation printed board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2010258260A (en) * 2009-04-27 2010-11-11 Nec Corp Heat radiation printed board

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