JP5104020B2 - Mold package - Google Patents

Description

The present invention relates to a mold package in which leads do not protrude outward from the outer peripheral edge of the mold resin when viewed from the top surface of the mold resin, that is, an outer leadless mold package such as a QFN (quad flat non-lead package). about the characters.

  Conventionally, in this type of mold package, an electronic component and a lead electrically connected to the electronic component are sealed with a mold resin, and the lower surface of the lead is exposed at the periphery of the lower surface of the mold resin. Outer dress type has been proposed. In this case, when the package is viewed from the upper surface of the mold resin, the leads do not protrude outward from the outer peripheral end portion of the mold resin.

When this is mounted on a wiring board or the like, the lower surface of the mold resin is opposed to the board, and soldering is performed with the wiring board on the lower surface of the lead exposed therefrom.
Japanese Patent No. 3428591

  By the way, it is considered that the connection between the lead and the outside is preferably performed by welding instead of the conventional solder when the electronic component is adapted to a large current in the future.

  However, in the outer leadless type mold package, the exposure from the mold resin in the lead is only on the lower surface of the mold resin and the outer peripheral end portion around the lower surface. Here, since the portion of the lead exposed at the outer peripheral end of the mold resin has a small area, the substantially weldable direction is limited to the lower surface side of the mold resin.

  The present invention has been made in view of the above problems, and an object of the present invention is to enable lead connection by welding from one side and the other side of a mold resin in an outer leadless mold package.

In order to achieve the above object, an invention according to claim 1 is an outer leadless mold package in which one surface (32) of the lead (30) is exposed at a peripheral portion of one surface (42) of the mold resin (40). The periphery of the other surface (41) is cut out on the other surface (41) side of the mold resin (40) located on the opposite side of the one surface (42) of the mold resin (40). A part of the other surface (31) of the lead (30) located on the side opposite to the one surface (32) of the lead (30) is connected to the other surface (41) of the mold resin (40) through the notched portion. Configured as an exposed portion (31a) exposed to the side ,
The end surface (44) of the mold resin (40) that partitions between the exposed portion (31a) and the portion other than the exposed portion (31a) on the other surface (31) of the lead (30) is outside the exposed portion (31a). It is an inclined surface that is inclined to spread toward the direction,
The end surface (44) of the mold resin (40) and the exposed portion (31a) on the other surface (31) of the lead (30) are surfaces formed by cutting or removing the mold resin (40). It is characterized by that.

  According to this, in the outer lead type mold package, one surface (32) and the other surface (31) of the lead (30) from the one surface (42) side and the other surface (41) side of the mold resin (40), respectively. Is exposed, lead connection by welding is possible from one side (42) and the other side (41) of the mold resin (40).

Further, according to the present invention, the end surface (44) of the mold resin (40) that partitions between the exposed portion (31a) on the other surface (31) of the lead (30) and a portion other than the exposed portion (31a). Is an inclined surface that is inclined so as to spread outwardly of the exposed portion (31a) (see FIG. 12 described later), so that alignment during welding is facilitated.
Further, as in the invention described in claim 2, in the package of claim 1, the exposed portion (31a) on the other surface (31) of the lead (30) is formed by cutting the lead (30). It may be a flat surface. Further, in this case, as in the third aspect of the invention, the exposed portion (31a) on the other surface (31) of the lead (30) is replaced with the other surface (31) of the lead (30) other than the exposed portion (31a). ), The surface of the exposed portion (31a) that is thinned is a surface formed by cutting the lead (30). (Refer to FIG. 20 described later). In view of securing the weldability, this is preferable.

  When a plurality of leads (30) are arranged, the peripheral portion of the other surface (41) of the mold resin (40) is continuously cut out over all the leads of the plurality of leads (30). The exposed portion (31a) may be provided on the other surface (31) of all the leads (30) (see FIG. 3 described later).

  Further, when a plurality of leads (30) are arranged, the peripheral portion of the other surface (41) of the mold resin (40) is notched for some of the leads (30). An exposed portion (31a) may be provided on the other surface (31) of the partial lead (see FIG. 16 and the like described later).

  Further, the exposed portion (31a) on the other surface (31) of the lead (30) is continuous from the intermediate portion on the other surface (31) of the lead (30) to the end portion near the outer peripheral end of the mold resin (40). It can be an area (see FIGS. 1 and 3 to be described later).

  Further, the exposed portion (31a) on the other surface (31) of the lead (30) is an intermediate region on the other surface (31) of the lead (30), and the mold on the other surface (31) of the lead (30). The end near the outer peripheral end of the resin (40) can be sealed with the mold resin (40) instead of the exposed portion (see FIGS. 14 and 15 described later).

  Further, considering the weldability of the lead (30) and prevention of peeling from the mold resin (40), the length (l) of the exposed portion (31a) on the other surface (31) of the lead (30) is determined by the lead ( It is preferable that the thickness be equal to or greater than the thickness (t) of 30) and equal to or less than ½ of the length (L) of the lead (30) (see FIG. 19 described later).

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing a schematic cross-sectional configuration of a mold package 100 according to a first embodiment of the present invention. In FIG. 2, (a) and (b) are a top view and a bottom surface of the mold package 100 of FIG. FIG. In the following, the upper and lower surfaces of each component means only the upper surface and the lower surface of each component in FIG. 1, and are limited to the actual vertical relationship. is not.

  In the mold package 100 of this embodiment, the circuit board 20 is mounted on the upper surface 11 of the heat sink 10, the circuit board 20 and the leads 30 are electrically connected, and the circuit is formed on the upper surface 11 side of the heat sink 10. The substrate 20 and the leads 30 are sealed with a mold resin 40.

  The heat sink 10 is a plate-shaped member that dissipates the heat of the circuit board 20 and is made of a material such as copper, molybdenum, aluminum, or iron that is excellent in heat dissipation. The lower surface 12 opposite to the upper surface 11 of the heat sink 10 is exposed from the lower surface 42 of the mold resin 40 and is configured as a heat radiating surface.

  The circuit board 20 is made of a ceramic board or a printed board. Electronic components 50 and 51 are mounted on the upper surface 21 of the circuit board 20. An adhesive 60 is interposed between the lower surface 22 of the circuit board 20 and the upper surface 11 of the heat sink 10, and the circuit board 20 and the heat sink 10 are bonded to each other. Examples of the adhesive 60 include a general adhesive made of a silicone resin or the like.

  The electronic components 50 and 51 may be surface-mounted components such as an IC chip, a capacitor, and a resistance element. In the example shown in FIG. 1, an IC chip 50 and a capacitor 51 are mounted on the upper surface 21 of the circuit board 20 as electronic components.

  These electronic components 50 and 51 are fixed on the upper surface 21 of the circuit board 20 via a die mount material 55 made of solder, conductive adhesive or the like, and are attached to the circuit board 20 via bonding wires 70 as necessary. Electrically connected.

  The leads 30 are arranged around the circuit board 20 inside the mold resin 40. The lead 30 is made of a lead frame material such as copper, and the upper surface 21 of the circuit board 20 and the upper surface 31 of the lead 30 are electrically connected by a bonding wire 70.

  Here, the bonding wire 70 is made of general Au, aluminum, or the like, and is formed by ordinary wire bonding. In the mold package 100, the electronic components 50 and 51 and the leads 30 are electrically connected via the circuit board 20 and the bonding wires 70.

  As the mold resin 40, a mold material generally used for this type of mold package, for example, a thermosetting resin such as an epoxy resin can be employed. The mold package 100 is used by being mounted on a base material such as a case (not shown). At this time, the lower surface 12 of the heat sink 10 exposed from the mold resin 40 is brought into contact with the base material so as to release heat. I have to.

  Here, as shown in FIG. 1, of the outer surface of the mold resin 40, the upper surface 41 is a surface that covers the upper surface 21 of the circuit board 20, and the lower surface 42 is a surface that exposes the lower surface 12 of the heat sink 10. is there. The mold resin 40 is a rectangular plate having the upper and lower surfaces 41 and 42 as a rectangular main surface (see FIG. 2).

  The lower surface 42 of the mold resin 40 is a mounting surface 42 that faces the base material when the mold package 100 is mounted on the base material or the like. As shown in FIGS. 1 and 2B, the lower surface 32 of the lead 30 is exposed at the lower surface 42 of the mold resin 40.

  Here, the lead 30 is exposed at the peripheral portion of the lower surface 42 of the mold resin 40. Specifically, each lead 30 is a flat strip-shaped plate material extending from the circuit board 20 side toward the outer peripheral end portion of the mold resin 40, and the plurality of leads 30 are the bottom surfaces of the mold resin 40 forming a rectangle. 42 are arranged along each side.

  As a feature of the outer leadless mold package, also in this embodiment, when the package 100 is viewed from the upper surface 41 of the mold resin 40, the lead 30 does not protrude outward from the outer peripheral end 43 of the mold resin 40 (FIG. 2).

  Here, in the mold package 100 of the present embodiment, as shown in FIGS. 1 and 2A, unlike the normal mold package of this type, not only the lower surface 32 of the lead 30 but also the upper surface 31 are molded. The resin 40 is exposed. Here, FIG. 3 is an enlarged schematic perspective view showing the exposed portion 31 a on the upper surface 31 of the lead 30 in the mold package 100.

  As shown in FIG. 1, FIG. 2A, and FIG. 3, a shape in which the peripheral portion of the upper surface 41 is notched on the upper surface 41 side of the mold resin 40 located on the opposite side of the lower surface 42 of the mold resin 40. It has become.

  Then, a part of the upper surface 31 of the lead 30 located on the side opposite to the lower surface 32 of the lead 30 is exposed to the upper surface 41 side of the mold resin 40 through this cut-out portion, and this exposed portion is The exposed portion 31a is configured.

  That is, in the present embodiment, the upper surface 31 of the lead 30 is removed by removing the portion of the mold resin 40 that has been sealing the portion near the end of the lead 30 on the upper surface 41 side of the mold resin 40 in the prior art. A portion near the end of the mold is exposed on the upper surface 41 side of the mold resin 40.

  In particular, here, as shown in FIGS. 2A and 3, the upper surface 41 of the mold resin 40 extends over all the leads of the plurality of leads 30 including the portion located between the adjacent leads 30. The peripheral part of is made into the shape notched continuously. Thereby, the exposed portions 31 a are provided on the upper surfaces 31 of all the leads 30 of the plurality of leads 30.

  Here, the notched portion is formed in a rectangular frame shape in the peripheral portion of the upper surface 41 of the mold resin 40. Accordingly, as shown in FIG. 2, the upper surface 41 of the mold resin 40 is a rectangular surface that is slightly smaller than the lower surface 42 on the opposite side, and the end of the upper surface 41 is the end of the lower surface 42. Recessed than the department.

  In this way, the lead 30 is exposed on both the upper surface 41 side and the lower surface 42 side of the mold resin 40. The exposed portion 31a and the lower surface 32 of the upper surface 31 of the lead 30 exposed from the mold resin 40 are surfaces to be welded to the outside.

  FIG. 4 is a schematic cross-sectional view showing an example in which the mold package 100 and the external wiring member 200 are welded. FIG. 4A is an example in which lead connection is performed by welding from the lower surface 42 side of the mold resin 40. Shows an example of lead connection by welding from the upper surface 41 side of the mold resin 40.

  Here, the external wiring member 200 may be any member that can be welded to the lead 30 such as a bus bar made of phosphor bronze. Moreover, as a welding method, general laser welding, resistance welding, plasma welding, etc. are mentioned.

  According to the mold package 100 of the present embodiment, in the outer leadless mold package, the lower surface 32 and the upper surface 31 of the lead 30 are exposed from the lower surface 42 side and the upper surface 41 side of the mold resin 40, respectively. Lead connection by welding is possible from the upper and lower surfaces 41 and 42 side of the mold resin 40. As a result, there are fewer restrictions on the welding direction in the mold package 100.

  In FIGS. 4A and 4B, the welding direction is indicated by an arrow. The welding direction is, for example, a laser irradiation direction in laser welding, and is a direction in which welding energy is applied. In FIG. 4, the lead 30 side that is thinner than the external wiring member 200 is the welding direction, but in each of FIGS. 4A and 4B, the external wiring member 200 is opposite to the arrow in the figure. The side may be the welding direction.

  Further, as described above, in this case, as shown in FIGS. 2A and 3, the mold resin 40 exists between the leads 30, and the package 100 is viewed from the upper surface 41 of the mold resin 40. In this case, the outer peripheral end 43 of the mold resin 40 is substantially flush with the end portion (that is, the front end surface) of the lead 30 near the outer peripheral end 43 of the mold resin 40, and the lead 30 is the outer peripheral end 43 of the mold resin 40. Does not protrude outside. Therefore, this package 100 also has an outer leadless type feature.

  As shown in FIGS. 1 to 3, in this embodiment, the exposed portion 31 a of the lead 30 is continuous from an intermediate portion on the upper surface 31 of the lead 30 to an end portion near the outer peripheral end 43 of the mold resin 40. It is an area.

  Next, a method for manufacturing the mold package 100 of this embodiment will be described. This manufacturing method is based on the MAP molding technique. To describe the overall flow, first, the circuit board 20 on which the electronic components 50 and 51 are mounted is fixed to the upper surface 11 of the heat sink 10 via the adhesive 60.

  On the other hand, a lead frame 300 in which a plurality of leads 30 are connected at their ends, that is, a so-called multiple lead frame 300 is prepared (see FIG. 5 described later). Then, the heat sink 10 is disposed with respect to each lead 30, and the electronic components 50, 51 and the lead 30 are electrically connected by wire bonding the circuit board 20 and each lead 30 on the heat sink 10.

  Thereafter, this is put into a molding die, and a sealing step with the mold resin 40 is performed. FIG. 5 is a process diagram showing the sealing process and the subsequent cutting process, and shows a cross-section of the workpiece in each process.

  In the sealing step, the lead frame 300 and electronic components (not shown), a circuit board, a heat sink, and a bonding wire are sealed with the mold resin 40 so that the lower surface 32 of the lead 30 is exposed from the lower surface 42 of the mold resin 40.

  Next, in the cutting step, the mold resin 40 and the lead frame 300 are cut at the connecting portions of the leads 30 using blades 401 and 402, and separated into individual package units.

  As shown in FIG. 5A, in the dicing line DL, leads 30 in different package units are connected to each other. Here, although not shown, a dicing tape is attached to the lower side of the lead frame 300 to support a work including the lead frame 300. In the cutting step, the connecting portion of the lead 30 is cut and the mold resin 40 located at the connecting portion is cut.

  Here, in the cutting process of the present embodiment, first, as shown in FIG. 5B, the mold located in the peripheral portion of the upper surface 41 of the mold resin 40, that is, the connecting portion, using the first blade 401. The resin 40 is removed by cutting until reaching the upper surface 31 of the lead 30. By doing so, the exposed portion 31a is formed.

  Next, as shown in FIG. 5C, a second blade 402 having a blade width smaller than that of the first blade 401 is prepared, and the second blade 402 is formed at a portion where the mold resin 40 is removed. Then, the lead 30 is cut. As a result, the mold package 100 is obtained which is separated into individual package units and has the exposed portion 31a.

(Second Embodiment)
6A to 6C are process diagrams showing the main part of the method for manufacturing a mold package according to the second embodiment of the present invention, and show the cutting process of this embodiment. The present embodiment is different from the first embodiment in that this cutting process is modified.

  Also in the cutting process of the present embodiment, the first blade 401 and the second blade 402 having a smaller blade width than the first blade 401 are prepared as blades. In the present embodiment, the first embodiment is different from the first embodiment. The order of cutting the lead 30 and cutting / removing the mold resin 40 is reversed.

  That is, in the cutting process of the present embodiment, as shown in FIGS. 6A and 6B, first, the connecting portion between the mold resin 40 and the lead 30 is cut by the second blade 402 having a small blade width. And predivide into individual package units. At this time, the work is integrated by the dicing tape.

  Thereafter, the mold resin 40 located inside the cut surface of the lead 30 is removed by the first blade 401 having a large blade width. The cutting with the first blade 401 is performed from the upper surface 41 of the mold resin 40, and stops when the first blade 401 reaches the upper surface 31 of the lead 30.

  By doing so, the peripheral portion of the upper surface 41 of the mold resin 40 is cut and removed by the first blade 401, and the exposed portion 31a on the upper surface 31 of the lead 30 is formed. Thus, also in this embodiment, a mold package similar to that shown in the first embodiment can be manufactured.

(Third embodiment)
FIG. 7 is a schematic cross-sectional view showing a blade 403 in the mold package manufacturing method according to the third embodiment of the present invention, and FIGS. 8A and 8B are process diagrams showing a cutting process of the present embodiment. is there. This embodiment is different from the first embodiment in that the cutting process is modified.

  In the cutting process of the present embodiment, as shown in FIG. 7, a stepped shape is used as the blade 403. The blade 403 is provided at a position where the first blade portion 403a for cutting the lead 30 is retracted in the cutting direction with respect to the first blade portion 403a and protrudes on both sides than the first blade portion 403a. And a second blade portion 403b having a large blade width.

  In the cutting process of the present embodiment, as shown in FIGS. 8A and 8B, the lead 30 is cut by the first blade portion 403a and the mold resin 40 is cut by the second blade portion 403b. The peripheral portion of the upper surface 41 is cut and removed. Here, dicing is stopped when the second blade portion 403b hits the upper surface 31 of the lead 30.

  Thereby, the individual package unit can be separated and the exposed portion 31a can be formed in a lump. Also by the manufacturing method of the present embodiment, a mold package similar to that shown in the first embodiment can be manufactured.

(Fourth embodiment)
FIGS. 9A and 9B are process diagrams showing the main part of the mold package manufacturing method according to the fourth embodiment of the present invention, and show the cutting process of the present embodiment. The difference from the manufacturing method of the first embodiment will be mainly described.

  In the present embodiment, first, in the sealing process, the mold resin is provided in a state in which the release material 500 having a lower adhesion to the mold resin 40 than the lead 30 is provided in a portion that becomes the exposed portion 31 a on the upper surface 31 of the lead 30. Sealing with 40 is performed.

  Examples of the release material 500 include a silicon-based resin, Au plating, Ni plating, and the like, and a tape made of resin. The arrangement method may be arranged only at a portion that becomes the exposed portion 31a on the upper surface 31 of the lead 30, but in the case of the tape described above, it may be arranged so as to connect between the leads 30.

  In this way, after performing the sealing process with the release material 500 provided, in the cutting process, first, similarly to the above, the connecting portion between the mold resin 40 and the lead 30 is cut using a blade, and each package unit is cut. It is divided into pieces.

  Thereafter, as shown in FIG. 9A, a notch K reaching the upper surface 31 of the lead 30 is made with respect to the mold resin 40 by a dicing blade. As the blade at this time, for example, a second blade 402 for cutting a lead as shown in the above embodiments is used.

  Thereafter, a force is applied to the mold resin 40 on the release material 500 through the cut K, and the mold resin 40 is peeled from the upper surface 31 of the lead 30 together with the release material 500. As a result, as shown in FIG. 9B, a mold package similar to that shown in the first embodiment can be manufactured.

  In this case, the mold resin 40 can be removed without damaging the lead 30 with the blade 402 as much as possible. It should be noted that the timing of making the cut K may be before individualization by cutting the lead 30. In addition to using the blade 402, the cutting K may be performed using, for example, laser cutting.

(Fifth embodiment)
FIGS. 10A and 10B are process diagrams showing the main part of the mold package manufacturing method according to the fifth embodiment of the present invention, and show the cutting process of the present embodiment. The difference from the manufacturing method of the first embodiment will be mainly described.

  Also in this embodiment, as shown in FIG. 5 and FIG. 6, the exposed portion 31a of the lead 30 is removed by cutting and removing the peripheral portion of the upper surface 41 of the mold resin 40 with the first blade 401. To form.

  Here, in the manufacturing method of the present embodiment, as shown in FIG. 10A, a convex portion 31 b that protrudes from the upper surface 31 is provided in advance in a portion that becomes the exposed portion 31 a in the upper surface 31 of the lead 30. deep. Then, a sealing process is performed on this product in the same manner as described above, and sealing with the mold resin 40 is performed.

  Subsequently, in the cutting step, the lead 30 is cut and the exposed portion 31a is formed using the first and second blades 401 and 402 in the same manner as the method shown in FIG. 5 or FIG. Here, in this embodiment, as shown in FIG. 10B, the peripheral portion of the upper surface 41 of the mold resin 40 is cut and removed by the first blade (not shown), so that the convex portion 31b is exposed. It is exposed as 31a.

  Thereby, the mold package of this embodiment is completed. The mold package of this embodiment is the same as that shown in FIG. 1 except for the part not shown in FIG. According to this embodiment, even if the convex portion 31b is slightly cut, it is preferable to secure the thickness of the lead 30 without damaging the portion of the lead 30 other than the exposed portion 31a.

  Here, the shape of the convex portion 31b in the present embodiment is not limited to that shown in FIG. 10, and various shapes shown in the following FIGS. 11A, 11B, 11C, etc. Are possible.

  In the example shown in FIG. 11A, the convex portion 31 b has a conical shape that narrows outward from the upper surface 31 of the lead 30. Further, as in the example shown in FIG. 11B, the convex portion 31 b may extend to the tip of the lead 30. Moreover, in FIG.11 (c), the convex part 31b has a taper-shaped side surface.

  Here, the protrusion 31b shown in FIGS. 11A and 11C has a width that changes in the thickness direction of the lead 30 (vertical direction in FIG. 11). Specifically, as the distance from the upper surface 31 of the lead 30 in the thickness direction increases, the width of the convex portion 31b decreases.

  In this case, the exposed area of the exposed portion 31a can be controlled by changing the amount of cutting and removing the convex portion 31b. For example, in the convex part 31b shown in FIG. 11A, the exposed area of the exposed part 31a increases as the amount of cutting / removing the convex part 31b increases.

(Sixth embodiment)
FIG. 12 is a diagram showing a schematic cross-sectional configuration of a mold package 101 according to the sixth embodiment of the present invention. Differences from the mold package 100 of the first embodiment (see FIG. 1 and the like) will be mainly described.

  In the first embodiment, the end surface 44 of the mold resin 40 that partitions the exposed portion 31a and the portion other than the exposed portion 31a on the upper surface 31 of the lead 30 is a surface perpendicular to the exposed surface 31a. In the embodiment, as shown in FIG. 12, the end surface 44 of the mold resin 40 is inclined so as to spread outward of the exposed portion 31a.

  According to this, the adjustment accuracy of the vertical alignment of the laser irradiated at the time of laser welding may be low. That is, welding is possible from the directions indicated by arrows Y1 and Y2 in FIG. In the case of the first embodiment, laser irradiation cannot be performed from a tilted direction as indicated by the arrow Y2.

  FIG. 13 is a process diagram showing the cutting process in the present embodiment, and shows a method for manufacturing the inclined end surface 44 of the mold resin 40. In this case, in the blade 403 as shown in FIG. 7, a blade 403 having an inclination corresponding to the end face 44 may be used as shown in FIG.

(Seventh embodiment)
FIG. 14 is a schematic cross-sectional view showing the main part of the mold package according to the seventh embodiment of the present invention. In each of the above embodiments, the exposed portion 31 a on the upper surface 31 of the lead 30 is a continuous region from the intermediate portion on the upper surface 31 of the lead 30 to the end portion near the outer peripheral end of the mold resin 40.

  On the other hand, in the present embodiment, the exposed portion 31 a on the upper surface 31 of the lead 30 is only an intermediate region on the upper surface 31 of the lead 30. In this case, the end portion of the upper surface 31 of the lead 30 near the outer peripheral end of the mold resin 40 is sealed with the mold resin 40 instead of the exposed portion. Such an exposed portion 31a can be formed by drilling the mold resin 40 with a laser or the like.

  Further, FIGS. 15A, 15B, and 15C show other examples of the present embodiment. As shown in FIGS. 15A and 15B, also in this embodiment, the end surface 44 of the mold resin 40 that partitions the exposed portion 31a and the portion other than the exposed portion 31a on the upper surface 31 of the lead 30 is outside the exposed portion 31a. The inclined surface may be inclined so as to spread toward the direction. In this case, the same effect as that of FIG. 12 is expected.

(Eighth embodiment)
FIG. 16 is a schematic perspective view showing the main part of the mold package according to the eighth embodiment of the present invention, and shows an enlarged exposed portion 31a on the upper surface 31 of the lead 30 in the package.

  In each of the above embodiments, as shown in FIG. 2A and FIG. 3, the periphery of the upper surface 41 of the mold resin 40 is continuously cut out across all the leads 30. Thus, the exposed portions 31 a are provided on the upper surfaces 31 of all the leads 30.

  On the other hand, as shown in FIG. 16, some of the leads 30 out of the plurality of leads 30 have a shape in which the peripheral portion of the upper surface 41 of the mold resin 40 is cut out, so that the partial An exposed portion 31 a may be provided on the upper surface 31 of the lead 30.

  Such a configuration can be formed by cutting and removing the mold resin 40 with a laser or a blade. In this case as well, lead connection by welding is possible from the upper and lower surfaces 41 and 42 side of the mold resin 40 through the exposed portion 31a. Note that this embodiment may be applied to each of the above embodiments.

  FIG. 17 is a schematic perspective view showing another example of the present embodiment. As described above, the case where the exposed portion 31a is formed on the upper surface 31 of one lead 30 and the mold resin 40 between the adjacent leads 30 is left will be described in further detail. FIGS. 18A and 18B are partial schematic cross-sectional views in the vicinity of the exposed portion 31a in this case.

  That is, in this case, as shown in FIG. 18A, the mold resin 40 extends further to the outer side than both ends of the upper surface 31 of the lead 30 with respect to one lead 30 constituting the exposed portion 31 a. 18B, both ends of the upper surface 31 of the lead 30 may be covered with the mold resin 40. As shown in FIG.

(Ninth embodiment)
FIG. 19 is a schematic cross-sectional view showing the main part of the mold package according to the ninth embodiment of the present invention. Here, the dimensional relationship of the exposed portion 31a on the upper surface 31 of the lead 30 will be described. In addition, the dimensional relationship of this embodiment can be applied to each above-mentioned embodiment.

  FIG. 19 shows various dimensions l, t, and L related to the lead 30. The dimension l is the length l of the exposed portion 31 a on the other surface 31 of the lead 30, the dimension t is the thickness t of the lead 30, and the dimension L is the length L of the lead 30.

  In this embodiment, the length l of the exposed portion 31a is equal to or greater than the thickness t of the lead 30 and the length L of the lead 30 in consideration of weldability of the lead 30 and prevention of peeling from the mold resin 40. Or less. That is, a relationship of t ≦ l ≦ 0.5L is established between these dimensions.

  The welding is performed in the direction of the thickness t of the lead 30 and is melted in this direction. Therefore, if the length 1 of the exposed portion 31a is shorter than the thickness t of the lead 30, it is difficult to ensure the welding strength. On the other hand, if the length 1 of the exposed portion 31a is longer than ½ of the length L of the lead 30, the support of the lead 30 by the mold resin 40 becomes insufficient, and the mold resin 40 and the lead 30 are separated. It becomes easy to do. Therefore, the above dimensional relationship is preferable.

(10th Embodiment)
FIG. 20 is a schematic cross-sectional view showing the main part of the mold package according to the tenth embodiment of the present invention. This embodiment can be applied to any of the above embodiments other than the one having the convex portion 31b shown in FIG.

  As shown in FIG. 20, in this embodiment, the exposed portion 31a on the upper surface 31 of the lead 30 is closer to the upper surface 41 side of the mold resin 40 than the portion on the other surface 31 of the lead 30 other than the exposed portion 31a. It is thin in a state of being recessed toward the lower surface 42 side. The thickness d of the thinned portion is, for example, 0.01 mm to 0.5 mm.

  Such a configuration can be easily formed by, for example, excessive cutting with the blade. In this case, since the portion of the exposed portion 31a can be made thin, improvement in weldability of this portion can be expected. Further, since the thickness of the portion of the lead 30 other than the exposed portion 31a can be ensured, heat dissipation can be ensured.

(Eleventh embodiment)
FIG. 21 is a schematic cross-sectional view showing the main part of the mold package according to the eleventh embodiment of the present invention.

  As shown in FIG. 21, the exposed portion 31a on the other surface 31 of the lead 30 may include a layered mold resin 40 that is thin enough to be welded to the outside on the exposed portion 31a. Good. In this case, the thickness t ′ of the thin layered mold resin 40 is, for example, about 0.001 mm to 0.3 mm.

  Thus, by leaving the mold resin 40 thin on the surface of the exposed portion 31a, when the laser welding is performed, the mold resin 40 absorbs heat and the weldability is improved, or when the mold resin 40 is pressed against the mating member during welding. In addition, it is possible to obtain effects such as prevention of distortion and fluttering of the lead 30.

(Other embodiments)
FIG. 22 is a schematic cross-sectional view showing a main part of a mold package according to another embodiment of the present invention. As described above, since the lead 30 is configured to be exposed from the mold resin 40 on the upper and lower surfaces 31 and 32, the support strength of the lead 30 by the mold resin 40 is lowered, and there is a concern about peeling.

  Therefore, as shown in FIGS. 22A to 22C, an uneven portion 33 is provided in a portion of the lead 30 that is in close contact with the mold resin 40, thereby improving the adhesion between the mold resin 40 and the lead 30. desirable.

  In the example shown in FIG. 22A, a notch-shaped uneven portion 33 is provided on a part of the lower surface 32 of the lead 30, and in the example shown in FIG. 22B, a groove is formed on the upper surface 31 of the lead 30. In the example shown in (c), the uneven portion 33 as a hole penetrating the lead 30 is provided.

  The mold package is an outer leadless type in which an electronic component and a lead electrically connected thereto are sealed with a mold resin, and one surface of the lead is exposed at the periphery of one surface of the mold resin. It may be sufficient and it is not limited to the thing of the said embodiment.

  For example, the heat sink and the circuit board described above may not be provided, and the electrical connection between the electronic component and the lead may be performed by an electrical connection method other than wire bonding, such as a bump.

It is a schematic sectional drawing of the mold package which concerns on 1st Embodiment of this invention. (A) is a top view of the mold package of FIG. 1, and (b) is a bottom view of the mold package of FIG. FIG. 2 is a schematic perspective view showing an enlarged exposed portion on an upper surface of a lead in the mold package shown in FIG. 1. It is a schematic sectional drawing which shows the example which welded the mold package and external wiring member which are shown by FIG. 1, (a) is an example from the lower surface side of mold resin, (b) is an example from the upper surface side of mold resin. Show. It is process drawing which shows the sealing process and cutting process in the manufacturing method of the mold package which concerns on the said 1st Embodiment. It is process drawing which shows the principal part of the manufacturing method of the mold package concerning 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the braid | blade in the manufacturing method of the mold package which concerns on 3rd Embodiment of this invention. It is process drawing which shows the cutting process of the said 3rd Embodiment. It is process drawing which shows the principal part of the manufacturing method of the mold package concerning 4th Embodiment of this invention. It is process drawing which shows the principal part of the manufacturing method of the mold package concerning 5th Embodiment of this invention. It is a schematic sectional drawing which shows the other shape of the convex part in the said 5th Embodiment. It is a schematic sectional drawing of the mold package which concerns on 6th Embodiment of this invention. It is process drawing which shows the cutting process in the said 6th Embodiment. It is a schematic sectional drawing which shows the principal part of the mold package which concerns on 7th Embodiment of this invention. It is a schematic sectional drawing which shows the other example of the said 7th Embodiment. It is a schematic perspective view which shows the principal part of the mold package which concerns on 8th Embodiment of this invention. It is a schematic perspective view which shows the other example of the said 8th Embodiment. FIG. 18 is a partial schematic cross-sectional view in the vicinity of an exposed portion when the configuration of FIG. 17 is adopted. It is a schematic sectional drawing which shows the principal part of the mold package which concerns on 9th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package which concerns on 10th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package which concerns on 11th Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the mold package which concerns on other embodiment of this invention.

Explanation of symbols

30 ... lead, 31 ... upper surface as the other surface of the lead,
31a: an exposed portion on the upper surface of the lead, 31b: a convex portion,
32: Lower surface as one surface of the lead, 40 ... Mold resin,
41 ... Upper surface as the other surface of the mold resin, 42 ... Lower surface as one surface of the mold resin,
44 ... End face of mold resin, 50 ... IC chip as electronic component,
51: Capacitor as an electronic component, 300 ... Lead frame,
401 ... first blade 402 ... second blade 403 ... blade
403a ... 1st blade part, 403b ... 2nd blade part, 500 ... Release material.

Claims (8)

An electronic component (50, 51) and a lead (30) electrically connected to the electronic component (50, 51) are sealed with a mold resin (40), and one surface of the mold resin (40) In the outer leadless mold package in which one surface (32) of the lead (30) is exposed at the peripheral portion in (42),
The mold resin (40) has a shape in which the peripheral portion of the other surface (41) is notched on the other surface (41) side of the mold resin (40) located on the opposite side of the one surface (42). And
A part of the other surface (31) of the lead (30) located on the opposite side of the one surface (32) of the lead (30) through the notched portion is the mold resin (40). the is configured as exposed portion (31a) exposed to the other surface (41) side,
The end surface (44) of the mold resin (40) that partitions between the exposed portion (31a) and a portion other than the exposed portion (31a) on the other surface (31) of the lead (30) is the exposed surface. It is an inclined surface that is inclined so as to spread outward of the portion (31a),
The exposed surface (31a) of the end surface (44) of the mold resin (40) and the other surface (31) of the lead (30) is formed by cutting or removing the mold resin (40). A molded package characterized in that the surface is a molded surface . The mold according to claim 1, wherein the exposed portion (31a) on the other surface (31) of the lead (30) is a surface formed by cutting the lead (30). package. The exposed portion (31a) on the other surface (31) of the lead (30) is recessed compared to the portion on the other surface (31) of the lead (30) other than the exposed portion (31a). It ’s thinner,
3. The mold package according to claim 2, wherein a surface of the thin exposed portion (31 a) is a surface formed by cutting the lead (30). 4. A plurality of the leads (30) are arranged,
The peripheral portion of the other surface (41) of the mold resin (40) is continuously cut out across all the leads of the plurality of leads (30),
The mold package according to any one of claims 1 to 3 , wherein the exposed portion (31a) is provided on the other surface (31) of all the leads (30). A plurality of the leads (30) are arranged,
The peripheral portion of the other surface (41) of the mold resin (40) is cut out for some of the leads (30).
The mold package according to any one of claims 1 to 3 , wherein the exposed portion (31a) is provided on the other surface (31) of the part of the leads. The exposed portion (31a) on the other surface (31) of the lead (30) is an end portion near the outer peripheral end of the mold resin (40) from an intermediate portion on the other surface (31) of the lead (30). molded package according to any one of claims 1 to 5, characterized in that a continuous region up. The exposed portion (31a) on the other surface (31) of the lead (30) is an intermediate region on the other surface (31) of the lead (30);
An end near the outer peripheral end of the mold resin (40) on the other surface (31) of the lead (30) is sealed with the mold resin (40) instead of the exposed portion. The mold package according to any one of claims 1 to 5 . The length (l) of the exposed portion (31a) on the other surface (31) of the lead (30) is not less than the thickness (t) of the lead (30) and the length of the lead (30). The mold package according to any one of claims 1 to 7 , wherein the mold package is 1/2 or less of (L).

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