CN111654979A - Method for embedding copper pillar in seamless connection mode in through hole - Google Patents
Method for embedding copper pillar in seamless connection mode in through hole Download PDFInfo
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- CN111654979A CN111654979A CN202010612353.2A CN202010612353A CN111654979A CN 111654979 A CN111654979 A CN 111654979A CN 202010612353 A CN202010612353 A CN 202010612353A CN 111654979 A CN111654979 A CN 111654979A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 123
- 239000010949 copper Substances 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000009713 electroplating Methods 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000007598 dipping method Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 238000000151 deposition Methods 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 17
- 238000005553 drilling Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 2
- CEOCDNVZRAIOQZ-UHFFFAOYSA-N pentachlorobenzene Chemical compound ClC1=CC(Cl)=C(Cl)C(Cl)=C1Cl CEOCDNVZRAIOQZ-UHFFFAOYSA-N 0.000 claims 7
- 239000003814 drug Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 23
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 23
- 238000012360 testing method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 240000007817 Olea europaea Species 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007494 plate polishing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Abstract
The invention discloses a method for embedding copper pillars in a through hole in a seamless connection manner, which relates to the technical field of circuit board manufacturing and mainly solves the technical problem that the existing method for embedding copper pillars has poor reliability; and sequentially carrying out oil removal, micro-etching and pre-dipping treatment on the PCB before the pulse hole filling electroplating of the PCB. According to the invention, the hole wall and the copper column can be well connected by embedding the special-shaped copper column, residual air and liquid medicine can be removed by sequentially carrying out oil removal, microetching and presoaking on the PCB before pulse hole filling electroplating, seamless connection between the hole wall and the copper column can be realized during pulse hole filling electroplating, and the reliability of the PCB is improved.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a method for embedding copper pillars in a seamless connection mode in a through hole.
Background
The process technology for embedding the copper columns in the PCB can well process the heat dissipation of high-power electronic elements such as high-frequency RF (radio frequency) and PA (power amplifier), the copper columns are required to be embedded in through holes in part of PCB design, SMT (surface mount technology) is required to be directly welded on the copper columns for rapid heat dissipation, the service life of the electronic elements is prolonged, and PCB factories begin to introduce the process technology for embedding the copper columns so as to play a better heat dissipation role.
The existing method for embedding the copper column comprises the following processing steps of knocking the copper column into a hole of a PCB, then electroplating, and rapidly filling copper into the hole to seal the hole. The method has the serious reliability defect that a gap exists between the hole wall and the copper column in the process of knocking the copper column into the hole, only the copper foils on the upper surface and the lower surface are communicated with the copper column after electroplating, the gap still exists in the hole, residual air and liquid medicine cannot overflow out of the hole due to the fact that the hole opening is completely sealed, the reliability of the PCB is directly affected, and the risk of exposure of the PCB exists when the PCB is subjected to high temperature.
Disclosure of Invention
The present invention is directed to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a method for embedding copper pillars in a seamless manner in via holes, which can improve reliability.
The technical scheme of the invention is as follows: a method for embedding copper columns in a through hole in a seamless connection mode is characterized in that special-shaped copper columns are embedded in the through hole of a PCB; and sequentially carrying out oil removal, micro-etching and pre-dipping treatment on the PCB before the pulse hole filling electroplating of the PCB.
As a further improvement, the special-shaped copper cylinder is of a structure with a large middle part and small two ends, the diameter of the middle part of the special-shaped copper cylinder is consistent with that of the through hole, and the length of the special-shaped copper cylinder is consistent with the thickness of the PCB.
Further, the method comprises the following specific steps:
s1, pressing and milling edges of a multi-layer core board according to design requirements to obtain the PCB;
s2, thinning the surface copper of the copper plate coated on the PCB to a first thickness;
s3, drilling the PCB once to obtain the via hole;
s4, carrying out copper deposition treatment on the PCB to enable two surfaces of the PCB to be conducted through copper deposition in the conducting holes; carrying out flash copper plating treatment on the PCB to enable the thickness of the plated copper on the inner wall of the via hole to reach a second thickness;
s5, embedding the special-shaped copper column into the through hole in an extruding or knocking mode to enable the special-shaped copper column to be flush with the surface of the PCB;
s6, sequentially carrying out oil removal, micro-etching and pre-dipping treatment on the PCB;
s7, performing pulse hole filling electroplating treatment on the PCB to enable the gaps in the through holes to be fully plated with copper;
s8, polishing the surface copper of the PCB to reduce the surface copper to H/H;
s9, secondary drilling is carried out on the PCB to obtain the rest through holes;
and S10, carrying out whole-board electroplating on the PCB, and then sequentially manufacturing a circuit, a solder mask layer, silk-screen characters and carrying out surface treatment to obtain the circuit board.
Further, reducing the surface copper of the copper plate covered on the PCB to a first thickness by using special chemical copper reduction equipment, wherein the first thickness is 5-7 μm.
And further, cleaning foreign matters and impurities in the through holes through ultrasonic water washing before carrying out copper deposition treatment on the PCB.
Further, the second thickness is 8-10 μm.
Advantageous effects
Compared with the prior art, the invention has the advantages that:
1. the copper columns which are large in the middle and small in two ends are embedded in the conduction holes which are conducted in the inner layer and the outer layer, the hole wall can be well connected with the copper columns, the PCB is sequentially subjected to oil removal, micro-etching and pre-dipping before pulse hole filling electroplating, residual air and liquid medicine can be removed, seamless connection between the hole wall and the copper columns can be achieved during pulse hole filling electroplating, and through various reliability tests such as a cold-hot impact test, a high-temperature test, a low-temperature test, a high-temperature high-humidity test and a mechanical vibration test, the hole wall is well connected with the copper columns, seamless connection between the hole wall and the copper columns is achieved, and high reliability of the PCB is guaranteed.
2. According to the detailed steps of the invention, the processing has no requirement on equipment with a high standard, is suitable for the existing conditions of a common factory, and does not need to add other equipment.
Drawings
FIG. 1 is a flow chart of a method of the present invention;
fig. 2 is a schematic structural diagram of the present invention.
Wherein: 1-PCB board, 2-special-shaped copper column, 3-filling hole and copper deposition.
Detailed Description
The invention will be further described with reference to specific embodiments shown in the drawings.
Referring to fig. 1 and 2, a method for embedding copper pillars in a through hole in a seamless manner, wherein a special-shaped copper pillar 2 is embedded in the through hole of a PCB 1; before the pulse hole filling electroplating of the PCB 1, the PCB 1 is sequentially subjected to oil removal, microetching and presoaking treatment. Wherein, special-shaped copper post 2 is middle big, the little structure in both ends, for example special-shaped copper post 2 is middle big, the little toper copper post in both ends or olive shape copper post, and the diameter in the middle of special-shaped copper post 2 is unanimous with the diameter of conducting hole, and the length of special-shaped copper post 2 is unanimous with the thickness of PCB board 1.
The method comprises the following specific steps:
s1, pressing and milling edges of a multi-layer core board according to design requirements to obtain a PCB (printed Circuit Board) 1, specifically cutting a copper-clad plate, cutting the PCB 1 with the thickness of 1.5mm and the thickness of H/H of copper, and cutting the PCB 1 with the size of 250mm x 300mm, and then chamfering and edging;
s2, thinning the surface copper of the copper plate covered on the PCB 1 to a first thickness, and thinning the surface copper of the copper plate covered on the PCB 1 by using special chemical copper-reducing equipment, wherein the first thickness is 5-7 mu m so as to facilitate subsequent circuit etching;
s3, drilling the PCB 1 once to obtain a via hole, namely selectively drilling the via hole, and only drilling a hole needing to be embedded with the copper column, so that the thickness of copper on the hole wall of the rest copper column does not need to be embedded and controlled, the drilling quality is checked, and the defects of burrs, flashes and the like cannot exist;
s4, cleaning foreign matters and impurities (such as dust) in the through hole by using ultrasonic water washing; carrying out copper deposition treatment on the PCB (printed circuit board) 1 to enable two sides of the PCB 1 to be conducted through copper deposition in the through hole, specifically, depositing a copper film on the wall of the through hole by using horizontal copper deposition equipment to enable the upper and lower sides of the PCB 1 to be conducted through the through hole; after the copper deposition and drying, carrying out flash copper plating treatment on the PCB 1 to ensure that the thickness of the copper plated on the inner wall of the via hole reaches a second thickness, wherein the second thickness is 8-10 mu m, and the stability of the via hole is ensured;
s5, because the diameter of the conducting hole is smaller than the middle diameter of the special-shaped copper column 2 after the copper deposition and flash plating treatment, the special-shaped copper column 2 is embedded into the conducting hole in an extruding or knocking mode, so that the special-shaped copper column 2 is flush with the board surface of the PCB 1, a fixing effect is naturally achieved, the middle of the copper column is bridged with the hole wall and is connected together, and at the moment, the through hole is in a symmetrical blind hole shape; before the special-shaped copper cylinder 2 is embedded, the special-shaped copper cylinder 2 can be subjected to oil removal and rust removal treatment;
s6, sequentially carrying out oil removal, microetching and presoaking treatment on the PCB 1 for removing residual air and liquid medicine in the through holes; specifically, the PCB 1 is put into an alkaline degreasing agent to degrease, and is taken out and cleaned; putting the PCB 1 into an acid solution for microetching, taking out and cleaning; putting the PCB 1 into a pre-dipping solution for treatment;
s7, performing pulse hole filling electroplating treatment on the PCB 1 to enable the gaps in the through holes to be fully plated with copper, such as hole filling copper deposition 3 in the figure 1; the method specifically comprises the steps of carrying out copper deposition on a PCB (printed circuit board) 1, electroplating the whole PCB, filling holes and electroplating, carrying out chemical treatment on the surface of a plated layer on the hole wall of a via hole and the surface of a special-shaped copper column 2 by using chemical copper deposition equipment, and depositing a copper film; connecting the copper pillar and the hole wall into a whole by utilizing the high permeability of copper deposition, then carrying out pulse hole filling electroplating, and filling copper in the symmetrical blind holes by utilizing the pulse electroplating to realize seamless connection of the hole wall and the copper pillar; after hole filling and electroplating are finished, the hole opening of the conducting hole is provided with a recess of 10-15 mu m;
s8, polishing the surface copper of the PCB 1 to reduce the surface copper to H/H, wherein the thickness of the surface copper of the PCB 1 is too thick and the hole opening has a recess of 10-15 microns after the pulse hole filling electroplating treatment, and the surface copper is repeatedly and alternately polished by a resin plate polishing machine to polish the thickness of the surface copper of the PCB 1 to 17-20 microns so as to meet the subsequent manufacturing requirement and check whether the hole opening is flat and has no recess;
s9, secondary drilling is carried out on the PCB 1 to obtain the rest through holes, the expansion and contraction condition of the PCB 1 needs to be detected by using a quadratic element before drilling, the expansion and contraction coefficient of a secondary drilling belt is provided according to the expansion and contraction proportion at the moment, and the drilling parameters are controlled according to conventional parameters; and drilling twice in sequence, so that the thickness of copper on a through hole wall plating layer of the copper column does not need to be embedded in the copper column for convenient control.
S10, carrying out whole-board electroplating on the PCB 1, and then sequentially manufacturing a circuit, a solder mask layer, silk-screen characters and carrying out surface treatment to obtain a circuit board; the step can also be carried out according to a known method (for example, copper deposition, electroplating, negative film dry film-acid etching, AOI detection, solder resistance, character, surface treatment, molding, testing, final inspection, finished product packaging and warehousing).
According to the invention, the copper columns with large middle and small two ends are embedded in the conductive holes which are communicated with the inner layer and the outer layer, so that the hole wall and the copper columns can be well jointed, the PCB is sequentially subjected to oil removal, microetching and presoaking before pulse hole filling electroplating, residual air and liquid medicine can be removed, seamless joint between the hole wall and the copper columns can be realized during pulse hole filling electroplating, and the hole wall and the copper columns are well jointed through various reliability tests such as a cold-hot impact test, a high-temperature test, a low-temperature test, a high-temperature high-humidity test, a mechanical vibration test and the like, so that the seamless joint between the hole wall and the copper columns is realized, and the high reliability of the PCB is ensured. According to the detailed steps of the invention, the processing has no requirement on equipment with a high standard, is suitable for the existing conditions of a common factory, and does not need to add other equipment.
The above is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that several variations and modifications can be made without departing from the structure of the present invention, which will not affect the effect of the implementation of the present invention and the utility of the patent.
Claims (6)
1. A method for embedding copper columns in a through hole in a seamless connection mode is characterized in that special-shaped copper columns (2) are embedded in the through hole of a PCB (1); the method comprises the steps of sequentially carrying out oil removal, micro-etching and pre-dipping treatment on the PCB (1) before pulse hole filling electroplating of the PCB (1).
2. The method for embedding copper pillars in the through hole in a seamless manner according to claim 1, wherein the special-shaped copper pillar (2) has a structure with a large middle and small two ends, the diameter of the middle of the special-shaped copper pillar (2) is consistent with that of the through hole, and the length of the special-shaped copper pillar (2) is consistent with the thickness of the PCB (1).
3. The method of claim 1 or 2, wherein the method comprises the following steps:
s1, pressing and milling edges of a multi-layer core board according to design requirements to obtain the PCB (1);
s2, thinning the surface copper of the copper plate coated on the PCB (1) to a first thickness;
s3, drilling the PCB (1) once to obtain the via hole;
s4, carrying out copper deposition treatment on the PCB (1) to enable two surfaces of the PCB (1) to be conducted through copper deposition in the conducting holes; carrying out flash copper plating treatment on the PCB (1) to enable the thickness of the plated copper on the inner wall of the via hole to reach a second thickness;
s5, embedding the special-shaped copper column (2) into the through hole in an extruding or knocking mode, so that the special-shaped copper column (2) is flush with the surface of the PCB (1);
s6, sequentially carrying out oil removal, micro-etching and pre-dipping treatment on the PCB (1);
s7, pulse hole filling electroplating treatment is carried out on the PCB (1) to enable the gaps in the through holes to be fully plated with copper;
s8, polishing the surface copper of the PCB (1) to reduce the surface copper to H/H;
s9, secondary drilling is carried out on the PCB (1) to obtain the rest through holes;
and S10, carrying out whole-board electroplating on the PCB (1), and then sequentially manufacturing a circuit, a solder mask layer, silk-screen characters and carrying out surface treatment to obtain the circuit board.
4. The method for embedding copper pillars in the through holes in a seamless connection manner according to claim 3, wherein a special chemical copper reduction device is used for reducing the copper on the surface of the copper plate on the PCB (1) to a first thickness, and the first thickness is 5-7 μm.
5. The method for embedding copper pillars in the through holes in a seamless connection manner according to claim 3, wherein foreign matters and impurities in the through holes are cleaned by ultrasonic water washing before the PCB (1) is subjected to copper deposition treatment.
6. The method of claim 3, wherein the second thickness is 8-10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010612353.2A CN111654979A (en) | 2020-06-30 | 2020-06-30 | Method for embedding copper pillar in seamless connection mode in through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010612353.2A CN111654979A (en) | 2020-06-30 | 2020-06-30 | Method for embedding copper pillar in seamless connection mode in through hole |
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| CN111654979A true CN111654979A (en) | 2020-09-11 |
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|---|---|---|---|
| CN202010612353.2A Pending CN111654979A (en) | 2020-06-30 | 2020-06-30 | Method for embedding copper pillar in seamless connection mode in through hole |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822870A (en) * | 2020-12-22 | 2021-05-18 | 珠海市沃德科技有限公司 | FPC double-sided board processing technology |
| CN113390991A (en) * | 2021-06-11 | 2021-09-14 | 北京高麦克仪器科技有限公司 | Application of gas chromatograph in high-purity ammonia analysis |
| CN114364130A (en) * | 2021-12-22 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Manufacturing method of copper-embedded column PCB |
| CN114561675A (en) * | 2022-03-29 | 2022-05-31 | 电子科技大学 | Method for controlling thickness of copper on electroplating hole filling surface of printed circuit |
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Application publication date: 20200911 |