JPS62149850U - - Google Patents
Info
- Publication number
- JPS62149850U JPS62149850U JP1986036775U JP3677586U JPS62149850U JP S62149850 U JPS62149850 U JP S62149850U JP 1986036775 U JP1986036775 U JP 1986036775U JP 3677586 U JP3677586 U JP 3677586U JP S62149850 U JPS62149850 U JP S62149850U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- sensor
- temperature sensor
- cooling
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Thyristors (AREA)
Description
第１図は本考案の温度センサを内蔵したトラン
ジスタの概略縦断面図を、第２図及び第３図は従
来のトランジスタにおける温度センサの位置を示
す概略側面図を表わす。
１……トランジスタ、２……冷却体、３……温
度センサ、４……放熱用銅ケース、５……トラン
ジスタチツプ、６……モリブデン板、１１ａ……
金属ケースの冷却体結合部。
FIG. 1 is a schematic longitudinal sectional view of a transistor incorporating a temperature sensor of the present invention, and FIGS. 2 and 3 are schematic side views showing the position of the temperature sensor in a conventional transistor. 1... Transistor, 2... Cooling body, 3... Temperature sensor, 4... Copper case for heat radiation, 5... Transistor chip, 6... Molybdenum plate, 11a...
Cooling body connection part of metal case.
Claims (1)
温度を検出するセンサを備えたトランジスタにお
いて、その内部のトランジスタチツプとモリブデ
ン板との接合体に近接して位置しかつ前記冷却体
に接触する如くに設けられるその放熱部材に前記
温度センサを埋設してなることを特徴とするトラ
ンジスタ。 In a transistor having a cooling fin coupled thereto and equipped with a sensor for detecting the junction temperature thereof, the heat dissipation device is provided so as to be located close to a bonded body of a transistor chip and a molybdenum plate inside the transistor and in contact with the cooling body. A transistor characterized in that the temperature sensor is embedded in a member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036775U JPS62149850U (en) | 1986-03-13 | 1986-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036775U JPS62149850U (en) | 1986-03-13 | 1986-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62149850U true JPS62149850U (en) | 1987-09-22 |
Family
ID=30847495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986036775U Pending JPS62149850U (en) | 1986-03-13 | 1986-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62149850U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018505545A (en) * | 2014-11-27 | 2018-02-22 | ラッペーンランナン・テクニッリネン・ユリオピストＬａｐｐｅｅｎｒａｎｎａｎ Ｔｅｋｎｉｌｌｉｎｅｎ Ｙｌｉｏｐｉｓｔｏ | Thermally controlled electronic device |
-
1986
- 1986-03-13 JP JP1986036775U patent/JPS62149850U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018505545A (en) * | 2014-11-27 | 2018-02-22 | ラッペーンランナン・テクニッリネン・ユリオピストＬａｐｐｅｅｎｒａｎｎａｎ Ｔｅｋｎｉｌｌｉｎｅｎ Ｙｌｉｏｐｉｓｔｏ | Thermally controlled electronic device |