JPH036838U - - Google Patents

Info

Publication number
JPH036838U
JPH036838U JP1989065832U JP6583289U JPH036838U JP H036838 U JPH036838 U JP H036838U JP 1989065832 U JP1989065832 U JP 1989065832U JP 6583289 U JP6583289 U JP 6583289U JP H036838 U JPH036838 U JP H036838U
Authority
JP
Japan
Prior art keywords
cooling module
cooling structure
facing
cooling
immersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989065832U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989065832U priority Critical patent/JPH036838U/ja
Publication of JPH036838U publication Critical patent/JPH036838U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａは本考案の一実施例を示す図であり、
同図ｂはその第１図における−′断面図、第
２図ａは本考案の他の実施例を示す図であり、同
図ｂはその第２図における−′断面図、第３
図は本考案が適用される冷却システムの全体構成
図、第４図は従来の冷却モジユール内部構造図、
第５図は第４図におけるＡ−Ａ′断面図を示して
いる。 図において、１……基板、２……素子、５……
低沸点冷媒、６ａ……冷却水通路、８……放熱フ
イン、１００……冷却モジユールをそれぞれ示す
。 FIG. 1a is a diagram showing an embodiment of the present invention,
Figure b is a cross-sectional view taken at -' in Figure 1, Figure 2 a is a diagram showing another embodiment of the present invention, Figure b is a cross-sectional view taken at -' in Figure 2, and Figure 3 is a cross-sectional view taken at
The figure is an overall configuration diagram of a cooling system to which the present invention is applied, and Figure 4 is a diagram of the internal structure of a conventional cooling module.
FIG. 5 shows a sectional view taken along the line AA' in FIG. In the figure, 1... substrate, 2... element, 5...
Low boiling point refrigerant, 6a...Cooling water passage, 8...Radiation fin, 100...Cooling module, respectively.

Claims (1)

【実用新案登録請求の範囲】 (1) 素子２が実装された基板１を有し、少なく
とも該素子２と対向する部分が金属体より構成さ
れた冷却モジユール１００に低沸点冷媒５を充填
して該素子２の冷却を行う素子の浸漬冷却構造に
於いて、 前記素子２と対向する側の前記冷却モジユール
１００に熱伝導冷却構造を形成したことを特徴と
する素子の浸漬冷却構造。 (2) 前記冷却モジユール１００における前記素
子２と対向する内側表面を櫛歯形状４ａとしたこ
とを特徴とする請求項１記載の素子の浸漬冷却構
造。[Claims for Utility Model Registration] (1) A cooling module 100 having a substrate 1 on which an element 2 is mounted, and at least a portion facing the element 2 made of a metal body, is filled with a low boiling point refrigerant 5. An immersion cooling structure for an element that cools the element 2, characterized in that a heat conduction cooling structure is formed on the cooling module 100 on the side facing the element 2. (2) The immersion cooling structure for an element according to claim 1, wherein the inner surface of the cooling module 100 facing the element 2 has a comb-teeth shape 4a.
JP1989065832U 1989-06-07 1989-06-07 Pending JPH036838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989065832U JPH036838U (en) 1989-06-07 1989-06-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989065832U JPH036838U (en) 1989-06-07 1989-06-07

Publications (1)

Publication Number Publication Date
JPH036838U true JPH036838U (en) 1991-01-23

Family

ID=31598019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989065832U Pending JPH036838U (en) 1989-06-07 1989-06-07

Country Status (1)

Country Link
JP (1) JPH036838U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297069A (en) * 2003-03-27 2004-10-21 Stmicroelectronics Inc System and method for direct convective cooling of exposed integrated circuit die surface
JP2010134693A (en) * 2008-12-04 2010-06-17 Fujitsu Ltd Cooling jacket, cooling unit, cooling system, and electronic appliance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61135144A (en) * 1984-12-05 1986-06-23 Fujitsu Ltd Cooling device for electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61135144A (en) * 1984-12-05 1986-06-23 Fujitsu Ltd Cooling device for electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297069A (en) * 2003-03-27 2004-10-21 Stmicroelectronics Inc System and method for direct convective cooling of exposed integrated circuit die surface
JP4657617B2 (en) * 2003-03-27 2011-03-23 エスティーマイクロエレクトロニクス，インコーポレイテッド System and method for direct convection cooling of an exposed integrated circuit die surface
JP2010134693A (en) * 2008-12-04 2010-06-17 Fujitsu Ltd Cooling jacket, cooling unit, cooling system, and electronic appliance
US8422228B2 (en) 2008-12-04 2013-04-16 Fujitsu Limited Cooling jacket, cooling unit, and electronic apparatus

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