JPS62128638U - - Google Patents
Info
- Publication number
- JPS62128638U JPS62128638U JP1643186U JP1643186U JPS62128638U JP S62128638 U JPS62128638 U JP S62128638U JP 1643186 U JP1643186 U JP 1643186U JP 1643186 U JP1643186 U JP 1643186U JP S62128638 U JPS62128638 U JP S62128638U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating body
- heat generating
- hollow chamber
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Description
第１図及び第２図はこの考案の一実施例による
熱発生体の冷却装置を示す斜視図及び断面図、第
３図は従来の熱発生体の熱低減装置を示す斜視図
である。
図において、１は熱発生体、４は基板、５はヒ
ートシンク、６は中空室、７は吸熱部、８は放熱
部である。尚、図中同一符号は同一又は相当部分
を示す。
1 and 2 are a perspective view and a sectional view showing a cooling device for a heat generating body according to an embodiment of the present invention, and FIG. 3 is a perspective view showing a conventional heat reducing device for a heat generating body. In the figure, 1 is a heat generating body, 4 is a substrate, 5 is a heat sink, 6 is a hollow chamber, 7 is a heat absorption part, and 8 is a heat radiation part. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
て配置された基板と、この基板上に取付けられた
ヒートシンクと、このヒートシンクの上記基板に
相対する面に凹状の溝が形成されて上記基板とヒ
ートシンクとの間に設けられ、吸熱部と放熱部を
有しその内部に作動液体が封入された中空室とを
備え、上記熱発生体の熱量を上記中空室の吸熱部
で吸収して上記中空室の放熱部に熱輸送して上記
熱発生体を冷却するようにしたことを特徴とする
熱発生体の冷却装置。 (2) 中空室は基板面側がラツパ状に形成された
ことを特徴とする実用新案登録請求の範囲第１項
記載の熱発生体の冷却装置。 (3) 熱発生体は半導体素子であることを特徴と
する実用新案登録請求の範囲第１項又は第２項記
載の熱発生体の冷却装置。[Claims for Utility Model Registration] (1) A substrate disposed in thermal contact with a heat generating body that generates heat, a heat sink mounted on this substrate, and a heat sink that faces the substrate of this heat sink. A concave groove is formed in the surface between the substrate and the heat sink, and the hollow chamber has a heat absorption part and a heat radiation part, and a working liquid is sealed inside the hollow chamber, and the heat generating body absorbs the heat amount of the heat generating body. A cooling device for a heat generating body, characterized in that the heat generating body is cooled by absorbing heat in a heat absorbing portion of the hollow chamber and transporting the heat to a heat radiating portion of the hollow chamber. (2) The cooling device for a heat generating body according to claim 1, wherein the hollow chamber is formed in a round shape on the substrate surface side. (3) The cooling device for a heat generating body according to claim 1 or 2 of the utility model registration claim, wherein the heat generating body is a semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1643186U JPS62128638U (en) | 1986-02-05 | 1986-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1643186U JPS62128638U (en) | 1986-02-05 | 1986-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62128638U true JPS62128638U (en) | 1987-08-14 |
Family
ID=30808279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1643186U Pending JPS62128638U (en) | 1986-02-05 | 1986-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128638U (en) |
-
1986
- 1986-02-05 JP JP1643186U patent/JPS62128638U/ja active Pending