JPS6221542U - - Google Patents
Info
- Publication number
- JPS6221542U JPS6221542U JP11361085U JP11361085U JPS6221542U JP S6221542 U JPS6221542 U JP S6221542U JP 11361085 U JP11361085 U JP 11361085U JP 11361085 U JP11361085 U JP 11361085U JP S6221542 U JPS6221542 U JP S6221542U
- Authority
- JP
- Japan
- Prior art keywords
- sealed cavity
- thin
- thin groove
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の実施例を示す部分断面拡大
斜視図である。
１……板材、２……Ｖ溝、３……フイン、４…
…蓋板、５……空洞部、６……狭幅部、７……凝
縮性流体、Ｃ……回路。
FIG. 1 is an enlarged partially sectional perspective view showing an embodiment of this invention. 1... Plate material, 2... V groove, 3... Fin, 4...
...Lid plate, 5...Cavity part, 6...Narrow width part, 7...Condensable fluid, C...Circuit.
Claims (1)
に、毛細管圧力を生じさせるに充分な細い狭幅部
を内部に有する所定長さの細溝を刻設し、かつそ
の細溝の開口部を、外表面にフインを設けた蓋板
によつて密閉することにより前記板材の内部に密
閉空洞部が形成され、その密閉空洞部の内部に、
凝縮および蒸発を行なつて循環流動することによ
り熱輸送を行なう凝縮性流体のみが封入されてい
ることを特徴とする熱伝導性の良い集積回路用基
板。 A thin groove of a predetermined length having a thin narrow portion inside that is sufficient to generate capillary pressure is carved on the opposite side of the board material to the side on which the circuit is provided, and the opening of the thin groove is A sealed cavity is formed inside the board by sealing with a lid plate having fins on the outer surface, and inside the sealed cavity,
1. A substrate for an integrated circuit having good thermal conductivity, characterized in that only a condensable fluid, which transports heat by condensing and evaporating and circulates, is enclosed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11361085U JPH0337237Y2 (en) | 1985-07-24 | 1985-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11361085U JPH0337237Y2 (en) | 1985-07-24 | 1985-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6221542U true JPS6221542U (en) | 1987-02-09 |
| JPH0337237Y2 JPH0337237Y2 (en) | 1991-08-07 |
Family
ID=30995577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11361085U Expired JPH0337237Y2 (en) | 1985-07-24 | 1985-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337237Y2 (en) |
-
1985
- 1985-07-24 JP JP11361085U patent/JPH0337237Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337237Y2 (en) | 1991-08-07 |