JPS6219861U - - Google Patents
Info
- Publication number
- JPS6219861U JPS6219861U JP1985110430U JP11043085U JPS6219861U JP S6219861 U JPS6219861 U JP S6219861U JP 1985110430 U JP1985110430 U JP 1985110430U JP 11043085 U JP11043085 U JP 11043085U JP S6219861 U JPS6219861 U JP S6219861U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- solid
- image sensor
- state image
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第1図は本考案の一実施例を示すCCDチツプ
の放熱装置の断面図、第2図は本考案の一実施例
を示すCCDチツプの放熱装置の分解斜視図、第
3図及び第4図はそれぞれ本考案の別の実施例を
示す断面図である。
なお図面に用いた符号において、1……CCD
チツプ、2……CCDパツケージ、4……CCD
基板、5……穴部、6……放熱部材、12……熱
電素子、13……開孔部、である。
FIG. 1 is a sectional view of a CCD chip heat dissipation device showing an embodiment of the present invention, FIG. 2 is an exploded perspective view of a CCD chip heat dissipation device showing an embodiment of the present invention, and FIGS. 3 and 4 2A and 2B are cross-sectional views showing other embodiments of the present invention, respectively. In addition, in the symbols used in the drawings, 1...CCD
Chip, 2...CCD package, 4...CCD
Substrate, 5... hole, 6... heat dissipation member, 12... thermoelectric element, 13... hole.
Claims (1)
具備し、上記固体撮像素子は回路基板上に配置さ
れ、上記放熱部材は上記回路基板に形成された穴
部を貫通して機器筐体まで延長されていることを
特徴とする固体撮像素子の放熱装置。 A heat dissipation member is provided in close contact with the back side of the solid-state image sensor, the solid-state image sensor is placed on a circuit board, and the heat dissipation member penetrates a hole formed in the circuit board and extends to the device casing. A heat dissipation device for a solid-state image sensor, characterized in that:
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985110430U JPS6219861U (en) | 1985-07-18 | 1985-07-18 | |
KR1019860005222A KR870001657A (en) | 1985-07-18 | 1986-06-28 | Heat sink of solid state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985110430U JPS6219861U (en) | 1985-07-18 | 1985-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6219861U true JPS6219861U (en) | 1987-02-05 |
Family
ID=30989421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985110430U Pending JPS6219861U (en) | 1985-07-18 | 1985-07-18 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6219861U (en) |
KR (1) | KR870001657A (en) |
-
1985
- 1985-07-18 JP JP1985110430U patent/JPS6219861U/ja active Pending
-
1986
- 1986-06-28 KR KR1019860005222A patent/KR870001657A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR870001657A (en) | 1987-03-17 |
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