JPH0179847U - - Google Patents
Info
- Publication number
- JPH0179847U JPH0179847U JP1987174694U JP17469487U JPH0179847U JP H0179847 U JPH0179847 U JP H0179847U JP 1987174694 U JP1987174694 U JP 1987174694U JP 17469487 U JP17469487 U JP 17469487U JP H0179847 U JPH0179847 U JP H0179847U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- hybrid integrated
- ultrasonic vibration
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例を示す斜視図、第２図
は従来例を示す斜視図である。
１……混成集積回路基板、２……導電路、３…
…ヒートシンク、４……パワー半導体素子、５…
…溝、６……アーム、７……半田。
FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 1... Hybrid integrated circuit board, 2... Conductive path, 3...
...Heat sink, 4...Power semiconductor element, 5...
...Groove, 6...Arm, 7...Solder.
Claims (1)
ヒートシンクに超音波振動を加え、混成集積回路
基板上の所定位置に前記ヒートシンクが固着され
る混成集積回路において、前記ヒートシンクの対
向する側面に列方向に複数本の溝を設けたことを
特徴とする混成集積回路。 Ultrasonic vibration is applied to a heat sink with good thermal conductivity to which a power semiconductor element is fixed, and in a hybrid integrated circuit in which the heat sink is fixed to a predetermined position on a hybrid integrated circuit board, the heat sink is applied with ultrasonic vibration to the opposite sides of the heat sink in the column direction. A hybrid integrated circuit characterized by having multiple grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987174694U JPH0179847U (en) | 1987-11-16 | 1987-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987174694U JPH0179847U (en) | 1987-11-16 | 1987-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179847U true JPH0179847U (en) | 1989-05-29 |
Family
ID=31466535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987174694U Pending JPH0179847U (en) | 1987-11-16 | 1987-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179847U (en) |
-
1987
- 1987-11-16 JP JP1987174694U patent/JPH0179847U/ja active Pending
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