JPS6270447U - - Google Patents
Info
- Publication number
- JPS6270447U JPS6270447U JP16253385U JP16253385U JPS6270447U JP S6270447 U JPS6270447 U JP S6270447U JP 16253385 U JP16253385 U JP 16253385U JP 16253385 U JP16253385 U JP 16253385U JP S6270447 U JPS6270447 U JP S6270447U
- Authority
- JP
- Japan
- Prior art keywords
- condensation
- evaporation
- heat transfer
- thermal conductivity
- location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す概略的な斜
視図、第２図は第１図の―線拡大断面図であ
る。
１……板材、２……密閉空洞部、６……狭幅部
、７……凝縮性流体、Ｃ……回路。
FIG. 1 is a schematic perspective view showing an embodiment of this invention, and FIG. 2 is an enlarged sectional view taken along the line -- in FIG. DESCRIPTION OF SYMBOLS 1... Plate material, 2... Sealed cavity part, 6... Narrow width part, 7... Condensable fluid, C... Circuit.
Claims (1)
内部に有しかつ凝縮・蒸発を行なつて循環流動す
ることによつて熱輸送を行なう凝縮性流体のみを
封入された複数の密閉空洞部が、回路を設ける箇
所を中心に放射状に形成されていることを特徴と
する熱伝動性の良い集積回路用基板。 A plurality of sealed cavities each having internal narrow portions sufficient to generate capillary pressure and containing only a condensable fluid that carries out heat transfer by condensation and evaporation and circulating flow. , an integrated circuit board with good thermal conductivity, characterized in that it is formed radially around a location where a circuit is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16253385U JPH0338838Y2 (en) | 1985-10-23 | 1985-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16253385U JPH0338838Y2 (en) | 1985-10-23 | 1985-10-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6270447U true JPS6270447U (en) | 1987-05-02 |
| JPH0338838Y2 JPH0338838Y2 (en) | 1991-08-15 |
Family
ID=31089883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16253385U Expired JPH0338838Y2 (en) | 1985-10-23 | 1985-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338838Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100423235B1 (en) * | 2001-10-11 | 2004-03-18 | 엘지전선 주식회사 | Heat spreader for the cooling of electronic devices |
| JP2009024933A (en) * | 2007-07-19 | 2009-02-05 | Sony Corp | Thermal diffusion device and manufacturing method for it |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4714434B2 (en) * | 2004-07-20 | 2011-06-29 | 古河スカイ株式会社 | Heat pipe heat sink |
-
1985
- 1985-10-23 JP JP16253385U patent/JPH0338838Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100423235B1 (en) * | 2001-10-11 | 2004-03-18 | 엘지전선 주식회사 | Heat spreader for the cooling of electronic devices |
| JP2009024933A (en) * | 2007-07-19 | 2009-02-05 | Sony Corp | Thermal diffusion device and manufacturing method for it |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0338838Y2 (en) | 1991-08-15 |