JPH0226254U - - Google Patents
Info
- Publication number
- JPH0226254U JPH0226254U JP10465488U JP10465488U JPH0226254U JP H0226254 U JPH0226254 U JP H0226254U JP 10465488 U JP10465488 U JP 10465488U JP 10465488 U JP10465488 U JP 10465488U JP H0226254 U JPH0226254 U JP H0226254U
- Authority
- JP
- Japan
- Prior art keywords
- extrusion
- heat dissipation
- dissipation fin
- hole
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図は本考案による放熱フイン装置の一実施例を
示す斜視断面図である。
１１……放熱フイン、１２……被冷却体として
の半導体素子、２０……貫通孔。
The figure is a perspective sectional view showing an embodiment of the heat dissipation fin device according to the present invention. DESCRIPTION OF SYMBOLS 11... Heat dissipation fin, 12... Semiconductor element as a cooled object, 20... Through hole.
Claims (1)
却体に取付けられる放熱フイン装置において、 内部に押し出し加工による成形方向に沿つて貫
通孔を設けたことを特徴とする放熱フイン装置。[Scope of Claim for Utility Model Registration] A heat dissipation fin device formed by extrusion of aluminum material and attached to an object to be cooled, characterized in that a through hole is provided inside along the forming direction by extrusion. Finn device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10465488U JPH0226254U (en) | 1988-08-08 | 1988-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10465488U JPH0226254U (en) | 1988-08-08 | 1988-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226254U true JPH0226254U (en) | 1990-02-21 |
Family
ID=31336570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10465488U Pending JPH0226254U (en) | 1988-08-08 | 1988-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226254U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104592A (en) * | 2010-11-09 | 2012-05-31 | Stanley Electric Co Ltd | Heat sink |
-
1988
- 1988-08-08 JP JP10465488U patent/JPH0226254U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104592A (en) * | 2010-11-09 | 2012-05-31 | Stanley Electric Co Ltd | Heat sink |