JPS624139U - - Google Patents
Info
- Publication number
- JPS624139U JPS624139U JP9420685U JP9420685U JPS624139U JP S624139 U JPS624139 U JP S624139U JP 9420685 U JP9420685 U JP 9420685U JP 9420685 U JP9420685 U JP 9420685U JP S624139 U JPS624139 U JP S624139U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- semiconductor
- cooling device
- central axis
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Description
第３図は従来の大型Ａｌブロツクによる半導体
冷却装置であり、Ａは側面図、Ｂは平面図、第４
図は従来のヒートパイプ式半導体冷却装置の概略
説明図、第１図及び第２図は本考案ヒートパイプ
式半導体冷却装置の概略説明図である。
１……半導体、２……Ａｌブロツク、３……ヒ
ートパイプ、４……フイン、６……ヒートパイプ
挿入孔、７……Ａｌブロツク。
Figure 3 shows a conventional semiconductor cooling device using a large Al block, where A is a side view, B is a top view, and the fourth
1 is a schematic diagram of a conventional heat pipe type semiconductor cooling device, and FIGS. 1 and 2 are schematic diagrams of a heat pipe type semiconductor cooling device of the present invention. 1... Semiconductor, 2... Al block, 3... Heat pipe, 4... Fin, 6... Heat pipe insertion hole, 7... Al block.
Claims (1)
等の熱伝導性ブロツクを取付け、該半導体面に対
しヒートパイプの中心軸を所望角度に直結し、該
ヒートパイプにより半導体を冷却せしめたことを
特徴とするヒートパイプ式半導体冷却装置。 (2) 半導体面に対しヒートパイプの中心軸との
なす角度を４５°〜９０°の範囲にしたことを特
徴とする実用新案登録請求の範囲第１項記載のヒ
ートパイプ式半導体冷却装置。[Claims for Utility Model Registration] (1) A thermally conductive block made of Al die-cast or Al extruded material is attached to a semiconductor, and the central axis of a heat pipe is directly connected to the semiconductor surface at a desired angle, and the heat pipe A heat pipe type semiconductor cooling device characterized by cooling. (2) The heat pipe type semiconductor cooling device according to claim 1, wherein the angle between the central axis of the heat pipe and the semiconductor surface is in the range of 45° to 90°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9420685U JPS624139U (en) | 1985-06-21 | 1985-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9420685U JPS624139U (en) | 1985-06-21 | 1985-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS624139U true JPS624139U (en) | 1987-01-12 |
Family
ID=30652560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9420685U Pending JPS624139U (en) | 1985-06-21 | 1985-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624139U (en) |
-
1985
- 1985-06-21 JP JP9420685U patent/JPS624139U/ja active Pending