JPS631342U - - Google Patents

Info

Publication number
JPS631342U
JPS631342U JP9322186U JP9322186U JPS631342U JP S631342 U JPS631342 U JP S631342U JP 9322186 U JP9322186 U JP 9322186U JP 9322186 U JP9322186 U JP 9322186U JP S631342 U JPS631342 U JP S631342U
Authority
JP
Japan
Prior art keywords
semiconductor
attached
cooling device
cooling fin
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9322186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9322186U priority Critical patent/JPS631342U/ja
Publication of JPS631342U publication Critical patent/JPS631342U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は第2図の本考案による半導体冷却装置
のA―A′線またはB―B′線断面側面図、第2
図は本考案による半導体冷却装置の平面図、第3
図Aおよび第3図Bは従来の半導体冷却装置の断
面側面図である。 1…半導体、2,3,4…冷却フイン。
1 is a cross-sectional side view taken along line A-A' or B-B' of the semiconductor cooling device according to the present invention shown in FIG.
The figure is a plan view of the semiconductor cooling device according to the present invention.
Figures A and 3B are cross-sectional side views of a conventional semiconductor cooling device. 1... Semiconductor, 2, 3, 4... Cooling fin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体が冷却フインに取り付けられ低温の液体
または気体によつて半導体が冷却されるようにな
つている半導体冷却装置において、前記冷却フイ
ンは半導体が取り付けられている部分に比して取
り付けられていない部分の肉厚が厚くなつている
ことを特徴とする半導体冷却装置。
In a semiconductor cooling device in which a semiconductor is attached to a cooling fin and the semiconductor is cooled by low-temperature liquid or gas, a portion where the cooling fin is not attached is compared to a portion where the semiconductor is attached. A semiconductor cooling device characterized by a thicker wall.
JP9322186U 1986-06-20 1986-06-20 Pending JPS631342U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9322186U JPS631342U (en) 1986-06-20 1986-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9322186U JPS631342U (en) 1986-06-20 1986-06-20

Publications (1)

Publication Number Publication Date
JPS631342U true JPS631342U (en) 1988-01-07

Family

ID=30955617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9322186U Pending JPS631342U (en) 1986-06-20 1986-06-20

Country Status (1)

Country Link
JP (1) JPS631342U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461284U (en) * 1990-09-28 1992-05-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461284U (en) * 1990-09-28 1992-05-26

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