JPS62160550U - - Google Patents
Info
- Publication number
- JPS62160550U JPS62160550U JP1986049201U JP4920186U JPS62160550U JP S62160550 U JPS62160550 U JP S62160550U JP 1986049201 U JP1986049201 U JP 1986049201U JP 4920186 U JP4920186 U JP 4920186U JP S62160550 U JPS62160550 U JP S62160550U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- good thermal
- semiconductor chip
- package
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第１図は本考案の半導体装置の縦断面図、第２
図は従来の半導体装置の縦断面図。
１……半導体集積回路、２……キヤツプ、３…
…パツケージ、４……充填層、５……熱伝導体。
FIG. 1 is a vertical cross-sectional view of the semiconductor device of the present invention, and FIG.
The figure is a longitudinal cross-sectional view of a conventional semiconductor device. 1...Semiconductor integrated circuit, 2...Cap, 3...
...Package, 4...Filled layer, 5...Heat conductor.
Claims (1)
伝導率の良い物質を充填し、かつ半導体チツプを
実装するパツケージのマウント部分を熱伝導率の
良い物質で作り、放熱効率を良くしたことを特徴
とする半導体装置。 It is characterized by providing a recess on the back side of the semiconductor chip, filling it with a material with good thermal conductivity, and making the mounting part of the package in which the semiconductor chip is mounted using a material with good thermal conductivity to improve heat dissipation efficiency. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986049201U JPS62160550U (en) | 1986-04-01 | 1986-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986049201U JPS62160550U (en) | 1986-04-01 | 1986-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160550U true JPS62160550U (en) | 1987-10-13 |
Family
ID=30871432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986049201U Pending JPS62160550U (en) | 1986-04-01 | 1986-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160550U (en) |
-
1986
- 1986-04-01 JP JP1986049201U patent/JPS62160550U/ja active Pending