JPH03117846U - - Google Patents
Info
- Publication number
- JPH03117846U JPH03117846U JP2633590U JP2633590U JPH03117846U JP H03117846 U JPH03117846 U JP H03117846U JP 2633590 U JP2633590 U JP 2633590U JP 2633590 U JP2633590 U JP 2633590U JP H03117846 U JPH03117846 U JP H03117846U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- lead
- leads
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図は夫々本考案半導体装置の実
施例を示す正面図、第３図及び第４図は夫々従来
の半導体装置の例を示す正面図、第５図及び第６
図は夫々本考案の説明に供する線図である。
１……パツケージ、７及び８……夫々リードで
ある。
1 and 2 are front views showing an embodiment of the semiconductor device of the present invention, FIGS. 3 and 4 are front views showing examples of a conventional semiconductor device, respectively, and FIGS. 5 and 6 are front views showing an example of a conventional semiconductor device.
Each figure is a diagram for explaining the present invention. 1...Package, 7 and 8...each lead.
Claims (1)
ージの両側よりリードを導出するようにした半導
体装置において、 上記リードを上記リードの上記パツケージのつ
け根部においては上記パツケージの側面より遠ざ
かるようにすると共にその延長部においては上記
パツケージの側面に近づく様に彎曲し、上記リー
ドの形状を略Ｚ字状又は略Ｃ字状としたことを特
徴とする半導体装置。[Claims for Utility Model Registration] In a semiconductor device in which a semiconductor element is covered with a package and leads are led out from both sides of the package, the leads are arranged at a base of the package at a distance from a side surface of the package. What is claimed is: 1. A semiconductor device characterized in that the extended portion of the lead is curved so as to approach a side surface of the package, and the shape of the lead is approximately Z-shaped or approximately C-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2633590U JPH03117846U (en) | 1990-03-15 | 1990-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2633590U JPH03117846U (en) | 1990-03-15 | 1990-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117846U true JPH03117846U (en) | 1991-12-05 |
Family
ID=31529237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2633590U Pending JPH03117846U (en) | 1990-03-15 | 1990-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013058809A (en) * | 2012-12-26 | 2013-03-28 | Mitsubishi Electric Corp | Semiconductor device module |
-
1990
- 1990-03-15 JP JP2633590U patent/JPH03117846U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013058809A (en) * | 2012-12-26 | 2013-03-28 | Mitsubishi Electric Corp | Semiconductor device module |