JPH0292942U - - Google Patents
Info
- Publication number
- JPH0292942U JPH0292942U JP300189U JP300189U JPH0292942U JP H0292942 U JPH0292942 U JP H0292942U JP 300189 U JP300189 U JP 300189U JP 300189 U JP300189 U JP 300189U JP H0292942 U JPH0292942 U JP H0292942U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- island
- recess
- lead frame
- opposite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図Ａ，Ｂは本考案のリードフレームの第１
の実施例の断面図と平面図、第２図Ａ，Ｂは本考
案の第２の実施例の断面図と平面図、第３図Ａ，
Ｂは従来例の断面図と平面図である。
１……アイランド、１ａ，１ｂ，１ｃ……凹部
、２……ステツチ、３……ボンデイングワイヤ、
４……半導体チツプ。
Figure 1 A and B show the first lead frame of the present invention.
A sectional view and a plan view of the second embodiment of the present invention, FIGS. 2A and B are a sectional view and a plan view of the second embodiment of the present invention, and FIGS.
B is a sectional view and a plan view of a conventional example. 1... Island, 1a, 1b, 1c... Recess, 2... Stitch, 3... Bonding wire,
4...Semiconductor chip.
Claims (1)
うちの少なくとも、半導体チツプマウント時の半
導体チツプの振幅方向の対向する二辺に沿つてア
イランドに凹部が形成されていることを特徴とす
るリードフレーム。 1. A lead frame characterized in that a recess is formed in the island along at least two of the four sides of the island that are opposite to each other in the amplitude direction of the semiconductor chip when the semiconductor chip is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP300189U JPH0292942U (en) | 1989-01-12 | 1989-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP300189U JPH0292942U (en) | 1989-01-12 | 1989-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292942U true JPH0292942U (en) | 1990-07-24 |
Family
ID=31204255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP300189U Pending JPH0292942U (en) | 1989-01-12 | 1989-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292942U (en) |
-
1989
- 1989-01-12 JP JP300189U patent/JPH0292942U/ja active Pending