JPH0547474Y2

JPH0547474Y2 -

Info

Publication number: JPH0547474Y2
Application number: JP12881688U
Authority: JP
Priority date: 1988-10-03
Filing date: 1988-10-03
Publication date: 1993-12-14
Anticipated expiration: 2003-10-03
Also published as: JPH0252353U

Description

【考案の詳細な説明】（産業上の利用分野）本考案は、半導体素子用放熱器に関する。[Detailed explanation of the idea] (Industrial application field) The present invention relates to a heat sink for semiconductor devices.

（従来の技術）従来の放熱器本体には、単に半導体素子の挿入
孔が形成されているに過ぎないもので、半導体素
子のストツパ機構の如きは何ら設けられていな
い。(Prior Art) A conventional heatsink main body merely has an insertion hole for a semiconductor element, and is not provided with any stopper mechanism for the semiconductor element.

（考案が解決しようとする課題）しかし、このような従来例によると、ストツパ
機構が配設されていないため、半導体素子を放熱
器本体に挿入するとき、位置決めが不正確とな
り、正確な位置決めには多くの手数を必要とす
る。(Problem to be solved by the invention) However, according to such conventional examples, since a stopper mechanism is not provided, positioning becomes inaccurate when inserting the semiconductor element into the heatsink body, and accurate positioning is not possible. requires a lot of effort.

また従来の放熱器本体の挿入孔部分にはガイド
枠がないため、半導体素子の正しい挿入が行われ
難く、しかも放熱面積の小なることで、放熱作用
が悪い。 Further, since there is no guide frame in the insertion hole portion of the conventional heat sink main body, it is difficult to insert the semiconductor element correctly, and furthermore, the heat radiation effect is poor due to the small heat radiation area.

しかも従来品では、放熱器本体に対する半導体
素子の固定はネジ止めによるもので、装着操作が
面倒であると共に多くの部品点数を必要とする等
の欠点がある。 Moreover, in the conventional products, the semiconductor element is fixed to the heatsink main body by screwing, which has drawbacks such as the installation operation is troublesome and a large number of parts are required.

本考案はこのような問題に鑑みてなされたもの
で、放熱器本体に対する半導体素子の装着および
位置決めが、容易にして正確であり、且つ放熱作
用も優れている半導体素子用放熱器を提供せんと
するものである。 The present invention was developed in view of these problems, and it is an object of the present invention to provide a heatsink for semiconductor devices that allows for easy and accurate mounting and positioning of semiconductor devices on the heatsink body, and that also has excellent heat dissipation properties. It is something to do.

（課題を解決するための手段）このため本考案は、放熱器本体に形成した半導
体素子装着部に位置決め用の突出部およびガイド
枠を配設し、しかも半導体素子固定用の金属板を
装着する溝を設けて成るものである。(Means for Solving the Problem) Therefore, the present invention provides a protrusion for positioning and a guide frame in the semiconductor element mounting portion formed on the heatsink body, and also mounts a metal plate for fixing the semiconductor element. It is made by providing grooves.

（実施例）以下、本考案の実施例を添附図面によつて説明
する。(Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

第１〜５図は本考案の第１実施例を示すもの
で、１は放熱器本体にして、半導体素子用装着部
２が形成され、該装着部２の内底面奥部には半導
体素子位置決め用の突出部３が設けられると共
に、半導体素子装着用のガイド枠４が設けられて
いる。 1 to 5 show a first embodiment of the present invention, in which reference numeral 1 denotes a heatsink body, and a mounting part 2 for a semiconductor element is formed in the inner bottom surface of the mounting part 2. A guide frame 4 for mounting a semiconductor element is also provided.

５は半導体素子固定用の金属板装着用の溝で、
前記したガイド枠４の上部に形成されている。 5 is a groove for attaching a metal plate for fixing a semiconductor element;
It is formed on the upper part of the guide frame 4 described above.

６はプリント基板固定用の金属片であつて、前
記した放熱器本体１の前面部に設けられている。 Reference numeral 6 denotes a metal piece for fixing a printed circuit board, and is provided on the front surface of the heat sink body 1 described above.

７はプリント基板固定用の金属片装着用溝であ
つて、放熱器本体１の底面部に形成されている。 Numeral 7 is a groove for attaching a metal piece for fixing a printed circuit board, and is formed on the bottom surface of the radiator body 1.

８は前記した溝５に装着される半導体素子固定
用金属板であつて、その両側に設けた切込片９に
より溝５内に金属片８は確実に装着され、しかも
該金属片８には半導体素子を案内すると共に下方
へ弾圧する切起片１０が形成されている。 Reference numeral 8 denotes a metal plate for fixing a semiconductor element that is installed in the groove 5 described above, and the metal piece 8 is securely installed in the groove 5 by cut pieces 9 provided on both sides of the metal plate 8. A raised piece 10 is formed that guides the semiconductor element and presses it downward.

１１は前記した放熱器本体の装着部２に装着さ
れる半導体素子である。 Reference numeral 11 denotes a semiconductor element mounted on the mounting portion 2 of the heat sink body described above.

次に第６〜１０図は本考案の第２実施例を示す
もので、半導体素子位置決め用の突出部３ａを、
第１実施例の放熱器本体１に代えて半導体素子固
定用金属片８の下面奥部に配設したものであり、
その他は同じであるのでその説明は省略する。 Next, FIGS. 6 to 10 show a second embodiment of the present invention, in which a protrusion 3a for positioning a semiconductor element is
Instead of the heatsink main body 1 of the first embodiment, a metal piece 8 for fixing a semiconductor element is disposed deep inside the lower surface,
Since the other details are the same, their explanation will be omitted.

（考案の効果）上記したような本考案によると、放熱器本体へ
の半導体素子の装着は、ガイド枠によつて単に装
入するのみで適正に行わしめられ、且つ半導体の
装入の位置決めは、放熱器本体又は金属片８に設
けたストツパ機構たる突出部３，３ａによつて格
別の操作をすることなく、確実に位置決めがなさ
れるもので、従つて半導体素子の放熱器本体への
取付けは単に装入するワンタツチ操作で行われる
から、従来のネジ止めするものに比してきわめて
容易である。(Effects of the invention) According to the invention as described above, the semiconductor element can be properly mounted on the heatsink body by simply inserting it using the guide frame, and the positioning of the semiconductor element can be easily positioned. The protrusions 3 and 3a, which are stopper mechanisms provided on the heatsink body or the metal piece 8, allow for reliable positioning without any special operations, and therefore, the semiconductor element can be mounted on the heatsink body. This is done with a simple one-touch operation, which is extremely easy compared to conventional screw-fastening methods.

しかも放熱器本体の半導体素子の装着部分にガ
イド枠を配設したので、前記したように半導体素
子の装入が容易確実になされると共に、このガイ
ド枠によつて放熱面積がその分だけ大となり、放
熱効果上も良好である等、実用性に優れた考案で
ある。 Moreover, since a guide frame is provided in the part of the heatsink main body where the semiconductor element is mounted, the semiconductor element can be inserted easily and reliably as described above, and the guide frame also increases the heat dissipation area accordingly. It is a highly practical idea with good heat dissipation effects.

[Brief explanation of the drawing]

第１〜５図は本考案の第１実施例を示し、第１
図はその分解斜面図、第２図は放熱器本体に金属
板を組込んだ状態の斜面図、第３図は放熱器本体
に金属板と半導体素子を組込んだ状態の正面図、
第４図はその中央断面図、第５図はその背面図で
ある。第６〜１０図は本考案の第２実施例を示
し、第６図はその分解斜面図、第７図は放熱器本
体に金属板を組込んだ状態の斜面図、第８図は放
熱器本体に金属板と半導体素子を組込んだ状態の
正面図、第９図はその中央断面図、第１０図はそ
の背面図である。図中、１……放熱器本体、２……装着部、３，
３ａ……突出部、４……ガイド枠、５……溝、８
……金属板、１０……切起片、１１……半導体素
子。 1 to 5 show a first embodiment of the present invention.
The figure is an exploded perspective view, Figure 2 is a perspective view of the metal plate assembled into the heatsink body, and Figure 3 is a front view of the heatsink body with the metal plate and semiconductor element assembled.
FIG. 4 is a central sectional view thereof, and FIG. 5 is a rear view thereof. 6 to 10 show a second embodiment of the present invention, FIG. 6 is an exploded perspective view thereof, FIG. 7 is a perspective view of the radiator body with the metal plate assembled, and FIG. 8 is the radiator body. FIG. 9 is a front view of the main body with the metal plate and semiconductor element assembled therein, FIG. 9 is a central sectional view thereof, and FIG. 10 is a rear view thereof. In the figure, 1... Heatsink main body, 2... Mounting part, 3,
3a...Protrusion, 4...Guide frame, 5...Groove, 8
...Metal plate, 10... Cut and cut piece, 11... Semiconductor element.

Claims

[Claims for Utility Model Registration] 1. A radiator body has a guide frame for mounting a semiconductor element, and a protrusion is provided in the inner part of the mounting part, and a groove formed in the guide frame is provided with a downwardly extending groove. A heatsink for semiconductor devices, which is equipped with a metal plate having cut and raised pieces. 2. A semiconductor device, which constitutes a mounting part for a semiconductor element having a guide frame in a heatsink body, and a metal plate that is mounted in a groove formed in the guide frame has a protrusion on the lower surface of the back of the metal plate along with a downwardly cut piece. Heat sink for elements.