JP2867357B2 - Heat sink for cooling semiconductor elements - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for cooling semiconductor elements such as transistors and diodes used in power supply devices and control devices in all fields, regardless of whether they are for the consumer industry.

[0002]

2. Description of the Related Art When a temperature of a mold type semiconductor device such as a diode rises during use, its performance decreases,
In severe cases, it is destroyed.

Therefore, conventionally, in order to cool a semiconductor element,
As shown in Figs. 3 and 4, aluminum material with good heat transfer
A heat sink 1 integrally formed by extrusion molding is used, and the semiconductor element 2 is attached to the heat sink 1 on the side opposite to the heat radiating portion. And the installation is
This is performed by using a fixing device such as the screw 3 shown in FIG. 3 or the spring fitting 4 shown in FIG.

[0004]

However, when the conventional heat sink 1 is mounted, the screws 3 and the spring fittings 4 are attached as described above.
Since the fixing device requires separate parts, there are many inconveniences in production or use, such as a processing step and an attaching step of the fixing device are required before the completion thereof.

The present invention has been made in view of the above problems of the prior art, and has as its object to provide a heat sink which does not require any fixture for a semiconductor element.

For this reason, the heat sink for cooling a semiconductor element according to the present invention has a guide frame for mounting a semiconductor element formed integrally with the heat sink body by extruding an aluminum material with an extrusion die. In the heat sink for cooling a semiconductor element, a cut-and-raised piece cut and raised inside the frame body is integrally formed on the guide frame by press working.

[0007]

The heat sink according to the present invention is based on the premise that the heat sink body is made of aluminum integrally formed with an aluminum extrusion die together with the guide frame. It can be obtained by forming a cut and raised piece. That is,
The completed body is one piece.

In such a state, if the semiconductor element is fitted into the mounting guide frame, the cut-and-raised piece will repress the semiconductor element, and the semiconductor element will be fixed without a fixture.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific embodiment of the present invention will be described with reference to the drawings. The present invention is not limited to the following examples.

FIG. 1 shows a first embodiment, in which (a) is a perspective view and (b) is a side sectional view.

Reference numeral 1 denotes a metal heat sink body made of aluminum here, and a semiconductor element mounting guide frame 6 is integrally formed on an upper portion thereof (an opposite side of the heat radiating portion) by an aluminum extrusion die.

At the upper two positions of the guide frame 6, cut-and-raised pieces 7 cut and raised inside the frame 6 are formed by pressing. Since the cut and raised piece 7 is made of aluminum formed integrally with the heat sink body 1, it has a certain degree of elasticity.

Reference numeral 2 denotes a semiconductor element, which is fitted into the guide frame 6. In the fitted state, the semiconductor element 2 is elastically pressed downward by the cutting and raising piece 7 and is fixed. Therefore, a fixing device or the like is not required.

FIG. 2 is a perspective view showing a second embodiment. This is one in which the cut-and-raised piece 7 in the first embodiment is formed at only one place. The other configuration is almost the same as that of the first embodiment, and the description thereof is omitted. Also in this embodiment, the semiconductor element 2 is elastically fixed downward by the cut-and-raised piece 7, so that a fixture is not required.

The form of the cut-and-raised piece 7 is not limited to the above embodiment. For example, the cut-and-raised piece 7 may be provided on the side of the guide frame 6 and fixed from the side of the semiconductor element 2. The shape can also be changed as appropriate, such as making the semiconductor element contact portion a curved surface.

[0016]

As described above, according to the heat sink for cooling a semiconductor device according to the present invention, no fixture for fixing the semiconductor device is required, so that it takes time and effort to manufacture the fixture like a conventional heat sink. The work has been shortened and the complexity has been eliminated.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention, wherein (a) is a perspective view and (b) is a side sectional view.

FIG. 2 is a perspective view showing a second embodiment of the present invention.

FIG. 3 is a perspective view showing an example of a conventional heat sink.

FIG. 4 is a perspective view showing another example of a conventional heat sink.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink main body 2 Semiconductor element 6 Guide frame for mounting semiconductor element 7 Cutting piece

Claims (1)

(57) [Claims] 1. A heat sink for cooling a semiconductor element, wherein a guide frame for mounting a semiconductor element is formed integrally with a heat sink body by extruding an aluminum material with an extrusion die. A heat sink for cooling a semiconductor element, wherein a cut-and-raised piece cut and raised inside is integrally formed by press working.