JPS5846457U - Electronic component mounting device for heat sink - Google Patents

Electronic component mounting device for heat sink

Info

Publication number
JPS5846457U
JPS5846457U JP14095081U JP14095081U JPS5846457U JP S5846457 U JPS5846457 U JP S5846457U JP 14095081 U JP14095081 U JP 14095081U JP 14095081 U JP14095081 U JP 14095081U JP S5846457 U JPS5846457 U JP S5846457U
Authority
JP
Japan
Prior art keywords
electronic component
heat sink
mounting device
component mounting
positioning means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14095081U
Other languages
Japanese (ja)
Other versions
JPS6144445Y2 (en
Inventor
光男 林
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP14095081U priority Critical patent/JPS5846457U/en
Publication of JPS5846457U publication Critical patent/JPS5846457U/en
Application granted granted Critical
Publication of JPS6144445Y2 publication Critical patent/JPS6144445Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の放熱体に対する電子部品取付装置の説明
に用いる断面図及び正面図、第2図及び第p図はこの考
案の一例の断面図及びその分解斜視図、第4図はこの考
案の他の例の断面図である。 1、  IA、  IB・・・半導体部品、2・・・放
熱体、8・・・袋状絶縁体、9A、  9B・・・凹部
、11・・・止め金具、16・・・ビス。
Figure 1 is a sectional view and front view used to explain a conventional electronic component mounting device for a heat sink, Figures 2 and P are a sectional view and an exploded perspective view of an example of this invention, and Figure 4 is an exploded perspective view of this invention. It is a sectional view of another example. DESCRIPTION OF SYMBOLS 1, IA, IB... Semiconductor component, 2... Heat sink, 8... Bag-shaped insulator, 9A, 9B... Recessed part, 11... Fastener, 16... Screw.

Claims (1)

【実用新案登録請求の範囲】 半導体電子部品等の電子部品に対する位置決め手段がそ
の一面に形成された絶縁体と、この絶縁体の他面に装置
される止め具と、上記位置決め手段により位置決めされ
た電子部品を放熱体の取付は面に固定させるためのね、
じ止め手段とからなる。 放熱体に対する電子部品取付装置。
[Scope of Claim for Utility Model Registration] An insulator having a positioning means for an electronic component such as a semiconductor electronic component formed on one surface thereof, a stopper installed on the other surface of the insulator, and a positioning means for an electronic component such as a semiconductor electronic component, which is positioned by the positioning means. The mounting of the heat sink for electronic components is to fix it to the surface.
and a locking means. Electronic component mounting device for heat sink.
JP14095081U 1981-09-22 1981-09-22 Electronic component mounting device for heat sink Granted JPS5846457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14095081U JPS5846457U (en) 1981-09-22 1981-09-22 Electronic component mounting device for heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14095081U JPS5846457U (en) 1981-09-22 1981-09-22 Electronic component mounting device for heat sink

Publications (2)

Publication Number Publication Date
JPS5846457U true JPS5846457U (en) 1983-03-29
JPS6144445Y2 JPS6144445Y2 (en) 1986-12-15

Family

ID=29934090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14095081U Granted JPS5846457U (en) 1981-09-22 1981-09-22 Electronic component mounting device for heat sink

Country Status (1)

Country Link
JP (1) JPS5846457U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245472A (en) * 2007-03-28 2008-10-09 Denso Corp Power conversion apparatus
JP2013077607A (en) * 2011-09-29 2013-04-25 Shindengen Electric Mfg Co Ltd Electronic component unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245472A (en) * 2007-03-28 2008-10-09 Denso Corp Power conversion apparatus
JP4600413B2 (en) * 2007-03-28 2010-12-15 株式会社デンソー Power converter
JP2013077607A (en) * 2011-09-29 2013-04-25 Shindengen Electric Mfg Co Ltd Electronic component unit

Also Published As

Publication number Publication date
JPS6144445Y2 (en) 1986-12-15

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