JPS6144445Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a device for mounting electronic components such as transistors and diodes to a heat sink.

As shown in FIGS. 1A and 1B, conventionally,
When attaching a semiconductor component 1 such as a switching transistor or a rectifying diode to the heat sink 2, a hole is made in the mounting base 3 of the semiconductor component 1, and the semiconductor component 1 is fixed to the heat sink 2 with screws 4 and insulating washers 5. 6 is a wiring board to which the semiconductor component 1 is attached. In this conventional configuration, the diameter of the screw 4 used is small, which tends to cause screw defects such as crushing of the hole in the head of the screw 4, and makes it difficult to uniformly apply a pressing force to the contact surface with the heat sink 2. , it is not possible to bring the semiconductor component 1 into close contact with the heat sink 2, and further,
When installing a plurality of parts, each part is installed one at a time, which has the disadvantage that it takes time to install.

This invention seeks to eliminate the drawbacks of such conventional mounting devices.

An embodiment of this invention will be described below with reference to FIGS. 2 and 3. In this example, 2
The semiconductor components 1A and 1B are attached to a heat sink 2. The heat sink 2 is made of aluminum and has a large number of fins 7 integrally. Further, 8 indicates a bag-shaped insulator made of a polymeric material. Two positioning recesses 9A and 9B are formed on the surface of the insulator 8 that comes into contact with the heat sink 2, and the semiconductor components 1A and 1B are inserted into the recesses 9A and 9B, respectively. . Furthermore, a notch 10 is formed on the other surface of the insulator 8, which is diagonally cut from the top. Furthermore, a stopper with a U-shaped cross section indicated by 11 is attached to the insulator 8.
is inserted into the storage section 12 of. A boss 13 having a threaded groove on the inner circumferential surface is integrally formed in the center of the stopper 11.

Then, the stopper 11 is housed in the insulator 8, and the semiconductor components 1A and 1 are placed in the recesses 9A and 9B.
With B inserted, press the insulator 8 against the heat sink 2, insert the screw 16 from the front of the heat sink 2 through the hole 14 of the heat sink 2 and the hole 15 of the insulator 8, and insert it into the boss 13 of the stopper 11. It is made to be screwed on.

Although not shown, semiconductor components 1A and 1B are shown in this way.
The heat sink 2 to which the heat sink 2 is attached is fitted into an opening formed on one surface of a shield case that houses a circuit such as a switching regulator.

4, the heat sink 2 may be fixed by inserting a screw 16 from the back side, i.e., the side of the insulator 8. In this case, the fastener 11 is not provided with a boss 13, but rather a simple insertion hole for the screw 16 is formed, and a thread groove is engraved on the inner peripheral surface of the hole 14 in the heat sink 2.

Note that an insulating sheet may be interposed between the semiconductor components 1A and 1B and the mounting surface of the heat sink 2.

As can be understood from the above explanation, in this invention, the electronic components are not screwed to the heat sink as in the past, but are pressed against the heat sink by an insulator, so there is no undue stress on the electronic components. It is possible to avoid the problems of heat dissipation and screw defects, and by uniformly applying a pressing force, it is possible to make the entire surface of the heat dissipation body come into close contact with the heat dissipation body 2, which improves the heat dissipation effect and improves reliability. It is possible to improve sexual performance. Furthermore, according to this invention, two or more electronic components can be attached to the heat sink at the same time, and since the mounting position of each electronic component can be accurately defined by the insulator, the necessary distance between the components can be reduced. It is possible to shorten the installation work time and reduce the number of parts.

In the above example, the recesses 9A and 9B are used as means for positioning the electronic components, but ribs may be provided in addition to the recesses 9A and 9B.

[Brief explanation of drawings]

Figure 1 is a sectional view and front view used to explain a conventional electronic component mounting device for a heat sink, Figures 2 and 3 are a sectional view and an exploded perspective view of an example of this invention, and Figure 4 is an exploded perspective view of this invention. It is a sectional view of another example. 1, 1A, 1B... Semiconductor component, 2... Heat sink, 8... Bag-shaped insulator, 9A, 9B... Recess, 1
1...stopper, 16...screw.

Claims (1)

[Scope of utility model registration request] An insulator having a positioning means for an electronic component such as a semiconductor electronic component formed on one surface thereof, a stopper disposed in a storage section provided on the other surface of the insulator, and a stopper disposed on the stopper or heat radiator. An electronic component mounting device for a heat radiator, comprising a screwing means for screwing into a female screw portion and fixing the electronic component positioned by the positioning means to the mounting surface of the heat radiator.