JPS6169156A - Heat-dissipating device for semiconductor - Google Patents

Abstract

PURPOSE:To process and assemble the titled parts easily by forming two T-shaped or L-shaped projections in the direction vertical to a mounting surface on the fitting side of a semiconductor, positioning the semiconductor by a fin on the inside and fixing a hold-down fitting for fastening the semiconductor by a fin on the outside. CONSTITUTION:Fine 8 for dissipating heat and projections 9 fixing a semiconductor 7 are formed to a radiator 6, and the projections 9 functioning as fins for the radiator 6 in combination are used as positioning guides. The outer width (c) of the T-shaped projection 9 serves as a projection for fastening a hold-down fitting 10 for fixing the radiator 6 for the semiconductor 7. A section 10a in the hold-down fitting 10 is formed in a plane so as to uniformly hold down a semiconductor surface, and a projecting section 12 coinciding with a hole for inserting a screw for the semiconductor 7 is shaped to one part of the section 10a, thus positioning the semiconductor 7. The hold-down fitting 10 is formed to a hold-down fitting shape so that the semiconductor 7 is fast stuck to the radiator 6 at all times by the resiliency of itself under the state in which the semiconductor 7 is incorporated into the radiator 6, thus largely improving productivity. Problems on reliability such as defective insulation due to positional displacement can also be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION Fields of Industrial Application The present invention is applicable to all fields, both consumer and industrial.

Conventional configuration and its problems When attaching a molded power semiconductor used for power supply devices, control devices, etc. to a heat sink, the semiconductor 2 is attached using aluminum material, etc., as shown in Figures 1 and 2. It is attached to the screw hole a provided in the heat sink 1 using screws 3.

4 is an insulating plate for electrically insulating the heat sink 1 and the semiconductor 2 described above. Further, 6 is a fin provided on the heat radiator to make heat radiation more effective. In the above configuration, that is, when the semiconductor 2 is attached to the heatsink 1 via the mounting screw 3,
It has the following drawbacks. In terms of the construction method, first, the screw holes a for screwing into the radiator 1 are drilled or pressed, then tapped to create thread grooves, and finally, complicated processes such as deburring the screw holes a are required. . Also, in the process of attaching the heatsink IK semiconductor 2, after aligning the hole a' provided in the insulating plate 4 with the screw hole a of the heatsink 1, the semiconductors 2 are stacked and the mounting screws 3 are tightened with a screwdriver or the like. At that time, the mounting screw 3
It is necessary to fix the semiconductor 2 and the insulating plate 4 with a jig or the like so that the semiconductor 2 and the insulating plate 4 do not shift in position in the zero rotation direction. Therefore, the structure has many disadvantages in terms of productivity, both in the processing of parts and in the assembly process.

OBJECTS OF THE INVENTION In view of the above-mentioned conventional drawbacks, the present invention aims to process a heat sink.

Structure of the Invention In order to achieve the above object, the present invention provides a heat radiator with heat dissipation fins, in which two T's are installed perpendicularly to the semiconductor mounting surface on the mounting side of the semiconductor.
The structure is such that a protrusion in the shape of a letter or L is provided, the inner fins are used to position the semiconductor, and the outer fins are used to fix a presser metal fitting for fixing the semiconductor.With this structure, processing and assembly of the parts are facilitated. becomes easier.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIGS. 3 to 6 of the drawings.

In FIG. 3, reference numeral 6 denotes a heat sink to which the semiconductor 7 is attached, and the heat sink 6 is provided with heat radiation fins 8 and protrusions 9 for fixing the semiconductor 7 to improve the heat radiation effect, and to improve the heat radiation effect and processing. Extruded aluminum is used because of its ease of use.

1o is a holding fitting using a spring material for fixing the semiconductor 7 to the heat radiator 6, the details of which are shown in FIG.

In Fig. 3, the insulating plate 11 is used to electrically insulate the heat sink 6 and the semiconductor 7, and is made of mica plate, silicone rubber, etc., and its dimensions are slightly larger than the contact area of the semiconductor 7 (with the heat sink). The protrusions 9, which are slightly thinner than dimension 5 of the heat sink 6 and also serve as fins of the heat sink 6, serve as positioning guides. The inner dimension of this T-shaped protrusion 9 is slightly larger than the outer diameter of the semiconductor 7 to serve as a guide when assembling the semiconductor 7 and the heat sink 6. This is a protrusion for fixing a presser metal fitting 10 for fixing the heat sink 7 to the heat radiator 6.

FIG. 4 is a detailed view of the presser fitting 10 shown in FIG. 3, which is made of a spring material such as spring steel or phosphor bronze. The portion 10a is flat so that the semiconductor surface can be held evenly, and a part of the holding fitting 10 is made flat so that the semiconductor surface can be evenly pressed.
The semiconductor 7 is positioned by providing a protrusion 12 that fits into the screw hole. Further, the tip bent portion 13 is connected to the protruding portion 9 of the radiator 6.
6 dimension is slightly smaller than C dimension so that it can fit onto the outer diameter dimension C of the comb. With the semiconductor 7 assembled in the heatsink 6 as shown in FIG. The shape of the holding fitting should always be in close contact with the heat sink 6.
The productivity in assembling and processing the radiator by tightening screws as shown in the conventional method shown in FIG. 1 can be greatly improved. In addition, reliability problems such as variations in the adhesion between the semiconductor and the heat sink due to variations in the screw tightening torque and poor insulation due to misalignment of holes in the insulating plate can all be improved at once.

Figure 6, Figure 6 shows a third unit using the same heatsink 6 in Figure 3.
A presser metal fitting 14 is used for fixing a semiconductor 7' which is smaller than the semiconductor 7 shown in the figure.

In this case, the diameter of the presser metal fitting 14 is set to be K so that the bent end portion 15 of the presser metal fitting 14 can be engaged with the inner tip of the T-shaped protrusion portion 9 of the heat sink 6, and the size e of the presser metal fitting is set to be slightly larger than the outer diameter of the semiconductor 7'. The semiconductor 7' is positioned.

Effects of the Invention Since the semiconductor heat dissipation device of the present invention is constructed as described above, the heat dissipation device can be constructed from extruded aluminum material, and the holding fitting can be easily and inexpensively manufactured by pressing or bending a spring material. Assembling is easy and reliable as the protrusions on the mounting side of the semiconductor can be used to position the semiconductor, and only the presser fittings need to be installed.The adhesion between the semiconductor and the heatsink is stable, heat dissipation is stable, and insulation is improved. It has the following advantages and is of great industrial value.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional semiconductor heat dissipation device, FIG. 2 is an exploded perspective view of the main parts, FIG. 3 is a perspective view showing an embodiment of the semiconductor heat dissipation device of the present invention, and FIG. 4 is a perspective view of a conventional semiconductor heat dissipation device. FIG. 5 is a perspective view of another embodiment, and FIG. 6 is a perspective view of a presser fitting used in the same apparatus. 6... Heat sink, 7.7'... Semiconductor,
8... Heat dissipation fin, 9... Protrusion, 1
0... Presser metal fitting, 11... Insulating plate, 1
2... Protrusion, 13... Tip bent part,
14... Presser metal fitting, 16... Tip bent part. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] A radiator with heat dissipation fins has two T-shaped or L-shaped protrusions perpendicular to the semiconductor mounting surface on the mounting side of the semiconductor, and the inner fins are used to position the semiconductor, and the outer fins are used to secure the semiconductor. A heat dissipation device for semiconductors configured to fix a presser metal fitting.