KR950000294B1 - Cooling element of heating parts - Google Patents

Cooling element of heating parts Download PDF

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KR950000294B1
KR950000294B1 KR1019890007636A KR890007636A KR950000294B1 KR 950000294 B1 KR950000294 B1 KR 950000294B1 KR 1019890007636 A KR1019890007636 A KR 1019890007636A KR 890007636 A KR890007636 A KR 890007636A KR 950000294 B1 KR950000294 B1 KR 950000294B1
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South Korea
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heat
hole
heat dissipation
plate
parts
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KR1019890007636A
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Korean (ko)
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KR910002321A (en
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김명호
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삼성전기 주식회사
서주인
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Abstract

The apparatus makes heating parts correctly contact with a heat discharge plate, and does not increase the manufacturing processes though a plurality of heating parts exist. It comprises an elastic press part (2a) formed on a fixed plate (2) via a lancing process; a hook (2b) positioned on an end of the plate (2); a hole (2c) formed on the other end of the plate (2); a burring hole (1b) formed coaxially on the same axis of the hole (2c); a screw (S) fastening the parts with the burring hole (1b) via the hole (2c).

Description

발열부품의 방열장치Heat dissipation device for heating parts

제 1 도는 종래의 방열장치를 보인 상면도.1 is a top view showing a conventional heat dissipation device.

제 2 도는 본 발명 방열장치를 분해 사시도.2 is an exploded perspective view of the heat dissipating device of the present invention.

제 3 도는 본 발명 방열장치의 결합과정을 보인 요부사시도.3 is a perspective view showing a coupling process of the heat dissipation device of the present invention.

제 4 도는 본 발명 방열장치의 조립 상태도.4 is an assembled state diagram of the heat dissipation device of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 방열판(放熱板) 1a : 후킹 홀(hooking hole)1: Heat sink 1a: Hooking hole

1b : 버링 홀(burring hole) 2 : 고정판(固定板)1b: burring hole 2: holding plate

2a : 랜싱 스프링(lancing spring) 2b : 훅(hook)2a: lancing spring 2b: hook

T : 발열부품(發熱部品) S : 나사T: Heating element S: Screw

본 발명은 발열부품(發熱部品)의 방열(放熱)장치에 관한 것으로, 더 상세히는 방열판을 이용한 발열부품의 방열장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device for heat generating parts, and more particularly, to a heat dissipation device for heat generating parts using a heat sink.

최근 전자기기는 점차 경박 단소화(輕薄短少化) 되어가고 있는 경향이어서 파워 트랜지스터나 다이오드 등의 각종 반도체 소자도 이에 따라 소형 고용량화 되어가고 있어서 자체 발열리 커져가고 있는데, 반도체 소자는 열에 약한 편이므로 발열부품의 방열문제는 점차 심각해지고 있다.In recent years, electronic devices have become increasingly thin and light, and various semiconductor devices such as power transistors and diodes are also becoming smaller and higher in capacity, and thus are increasing in self-heating. Since semiconductor devices are weak in heat, they generate heat. The heat dissipation problem of components is getting serious.

이와 같은 부품의 발열문제를 해결하기 위하여 전자기기의 내부에 냉각팬(冷却 fan)을 설치하여 강제 공냉을 시킨다던가 케이싱에 방열구멍을 설치하며, 방열을 원활히 시키기 위해 열용량 및 방열면적이 크고 열전달율이 높은 알루미늄 등으로 방열판을 만들어 발열부품의 열을 방출하도록 하고 있다.In order to solve the heat problem of such components, install a cooling fan inside the electronic device to perform forced air cooling, or install a heat dissipation hole in the casing, and in order to facilitate heat dissipation, the heat capacity and the heat dissipation area are large and the heat transfer rate is high. Heat sinks are made of high aluminum to release heat from the heat generating parts.

제 1 도에는 방열판을 이용한 종래의 방열장치의 일례를 보였는데, 이것은 방열판(1')에 발열부품(T)을 접촉시키고 그 상면에 고정판(2')을 덮어 고정판(2')과 방열판(1')을 볼트(B) 및 너트(N)로 체결함으로써 이뤄지는 구성이었다.1 shows an example of a conventional heat dissipation apparatus using a heat dissipation plate. The heat dissipation unit T is brought into contact with the heat dissipation plate 1 'and the fixing plate 2' is covered on the upper surface thereof. 1 ') was made by fastening with the bolt B and the nut N. FIG.

여기서 발열부품(T)의 냉각기구를 간단히 살펴보면, 발열부품(T)에서 발생된 열은 주로 방열판(1')과의 접촉부에서 전도(傳導) 형식으로 전달되어 방열판(1')의 표면에서 복사되는 것이므로, 발열부품(T)과 방열판(1')의 접촉면적이 방열성능에 매우 중요한 인자임을 알 수 있다.Here, a brief look at the cooling mechanism of the heat generating part (T), the heat generated from the heat generating part (T) is mainly transmitted in a conductive form at the contact portion with the heat sink (1 ') radiated from the surface of the heat sink (1'). Therefore, it can be seen that the contact area of the heat generating part T and the heat sink 1 'is a very important factor for the heat dissipation performance.

그런데 전술한 종래의 방열장치에 있어서는 볼트(B) 및 너트(N)의 체결력에 의해 고정판(2')이 도면의 점선과 같이 벤딩(bending)되므로 외측의 발열부품(T)은 방열판(1')과 충분히 접촉하지 못하여 이에 따라 방열이 충분히 이뤄지지 못하게 된다. 이를 해결하기 위해서 고정판(2')의 두께를 증가시키면 재료비가 증대되며, 고정판(2')의 양측을 방열판(1')측으로 절곡 성형하면 불필요한 공정과 공수가 추가되며, 고정판 (2')의 양측에 볼트(B) 및 너트(N)를 추가 체결하면 재료비뿐 아니라 작업공수가 현저히 증대되는 문제점이 있었다.However, in the above-described conventional heat dissipation device, the fixing plate 2 'is bent by the fastening force of the bolt B and the nut N as shown by the dotted line in the drawing, so that the heat generating part T of the outside is the heat sink 1'. ) Is not in sufficient contact with each other, and thus heat dissipation is insufficient. In order to solve this problem, increasing the thickness of the fixing plate 2 'increases the material cost, and bending both sides of the fixing plate 2' to the heat sink 1 'side adds unnecessary processes and man-hours. If the bolt (B) and the nut (N) is additionally fastened on both sides, there is a problem that the work cost is significantly increased as well as the material cost.

뿐만 아니라 체결될 볼트(B) 및 너트(N)가 설치될 발열부품(T)의 수효에 따라 증가하여 많은 조립공수가 소요되는 문제점도 있었다.In addition, there is a problem in that a large number of assembly labor is required as the number of heat generating parts (T) to be installed bolts (B) and nuts (N) to be fastened.

상술한 종래의 문제점을 감안하여 본 발명의 목적은 발열부품을 방열판에 확실히 접촉시킬 수 있으며, 발열부품이 다수가 되어도 조립공수가 증가되지 않는 발열부품의 방열장치를 제공하는 것이다.It is an object of the present invention to provide a heat dissipating device for heat generating parts that can make sure that the heat generating parts are in contact with the heat sink, and that the number of assembly parts is not increased even when there are many heat generating parts.

이와 같은 목적을 달성하기 위한 본 발명 발열부품의 방열장치는 발열부품을 고정판으로 방열판에 접속시켜 되는 발열부품의 방열장치에 있어서, 상기 고정판이 그 일부를 ㄷ자형으로 절개 및 절곡하여 된 랜싱 스프링을 하나 또는 복수로 구비하며, 상기 방열판상에 배열된 하나 또는 복수의 발열부품을 각각 상기 랜싱 스프링이 탄성적으로 눌러주도록 상기 방열판과 상기 고정판을 결합수단으로 결합하여 되는 것을 특징으로 한다.In the heat dissipating device of the heat generating part of the present invention for achieving the above object, in the heat dissipating device of the heat generating part is to connect the heat generating parts to the heat dissipating plate by a fixed plate, the fixing plate is cut a portion of the lancing spring bent and bent in a c-shape It is provided with one or a plurality, characterized in that the one or a plurality of heat generating parts arranged on the heat sink is coupled to the heat sink and the fixing plate by the coupling means so that the lancing spring is elastically pressed respectively.

이하에 본 발명의 한 바람직한 실시예를 첨부된 도면에 의거하여 상세히 설명한다.Hereinafter, one preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

제 2 도에 보인 본 발명 방열부품의 방열장치는 알루미늄 등 열전도성이 크고 설치될 발열부품(T)에 비해 충분히 큰 열용량과 방열면적을 가져서 발열원(heat source)인 발열부품에 대해 흡열원(heat sink) 역할을 하게 되는 방열판(1)과, 이 방열판(1)에 대해 발열부품(T)을 밀착시켜 주는 고정판(2)으로 구성된다.The heat dissipation device of the heat dissipation part of the present invention shown in FIG. 2 has a heat capacity and heat dissipation area sufficiently large compared to the heat dissipation part T, which is large in thermal conductivity, such as aluminum, and is a heat source for heat generating parts that are heat sources. The heat sink 1 which acts as a sink, and the stationary plate 2 which keeps the heat generating part T against the heat sink 1 are comprised.

고정판(2)은 띠(band)형의 탄성재질, 바람직하기로는 금속재질로 구성되며, 본 발명 특징에 따라 소재의 일부를 ㄷ자형으로 블랭킹(blanking)하여 (소위 랜싱(lancing)하여) 형성한 랜싱 스프링(lancing spring : 2a)을, 설치될 발열부품(T)의 수효에 따라 하나 또는 복수로 구비하고 있다.The fixing plate 2 is made of a band-shaped elastic material, preferably a metal material, and is formed by blanking a part of the material in a U-shape (so-called lancing) according to the characteristics of the present invention. One or more lancing springs 2a are provided depending on the number of heat generating parts T to be installed.

고정판(2)과 방열판(1)간의 결합수단으로 바람직한 구성은 고정판(2)의 일측에 ㄱ자형의 훅(hook ; 2b)을 형성하고 타측에 관통구멍(2c)을 형성하며, 방열판(1)의 일측에 고정판(2)의 훅(2b)이 걸리는 후킹 홀(hooking hole ; 1a)을 형성하고, 타측에 고정판(2)과 동축으로 버링 홀(burring hole ; 1b)을 형성하여 되는 것이다. 여기서 관통구멍(2c)과 버링 홀(1b)을 볼트 및 너트로 체결하거나 버링 홀(1b)에 탭(tap)을 내고 나사(S)는 일반 볼트형의 것을 체결할 수도 있으나, 이 경우 볼트 체결이나 탭 형성에 추가적인 공수가 소요되므로 나사(S)를 탭라이트(tap tite) 형으로 하여 고정판(2)과 방열판(1)의 결합시 나사산이 형성되며 체결되도록 하는 것이 바람직하다.The preferred configuration as a coupling means between the fixing plate 2 and the heat sink 1 is to form a hook (2b) of the L-shape on one side of the fixing plate 2 and to form a through hole (2c) on the other side, the heat sink (1) The hooking hole 1a on which the hook 2b of the fixing plate 2 is caught is formed on one side thereof, and the burring hole 1b is formed coaxially with the fixing plate 2 on the other side thereof. Here, the through-hole 2c and the burring hole 1b may be fastened with bolts and nuts, or a tap may be made in the burring hole 1b and the screw S may be fastened with a general bolt type. In addition, since additional labor is required to form the tab, it is preferable that the screw S is formed in a tap tite type so that a screw thread is formed and coupled when the fixing plate 2 and the heat sink 1 are coupled to each other.

이와 같은 본 발명 방열장치의 조립과정은 다음과 같은 바, 제 3 도에 보인 바와 같이 방열판(1)의 표면에 설치될 발열부품(T)을 배치한 뒤, 고정판(2)의 훅(2b)을 방열판(2)의 후킹 홀(1a)에 걸어맞추고, 다음 고정판(2)을 도면의 화살표 방향으로 회전시킨다. 그 다음 나사(S)를 고정판(2)의 관통구멍(2c)을 통해 방열판(1)의 버링 홀(1b)에 결합하면 제 4 도와 같이 본 고안 방열장치의 조립이 완료된다.The assembly process of the heat dissipating device of the present invention is as follows. As shown in FIG. 3, the heat generating part T to be installed on the surface of the heat dissipating plate 1 is disposed, and then the hook 2b of the fixing plate 2 is disposed. Is engaged with the hooking hole 1a of the heat sink 2, and the next fixing plate 2 is rotated in the direction of the arrow in the figure. Then, when the screw S is coupled to the burring hole 1b of the heat dissipation plate 1 through the through hole 2c of the fixing plate 2, the assembly of the inventive heat dissipation device is completed as shown in FIG.

이 상태에서 각 발열부품(T)은 랜싱 스프링(2a)의 탄성에 의해 방열판(1)의 표면에 눌리워지므로 그 측면 전체가 방열판과 접촉하게 된다. 또 고정판(2)이 제작중이나 이송중의 외력에 의해 또는 나사(S)의 체결력에 의해 변형된다 하더라도 각 발열부품(T) 하나 하나를 각각의 랜싱 스프링(2a)이 탄성적으로 누르고 있으므로 접촉 불량 등의 문제는 발생하지 않게 된다.In this state, each of the heat generating parts T is pressed on the surface of the heat sink 1 by the elasticity of the lancing spring 2a, so that the whole side surface thereof comes into contact with the heat sink. In addition, even if the fixing plate 2 is deformed by external force during manufacture or conveyance or by the fastening force of the screw S, each lancing spring 2a elastically depresses each one of the heating parts T, so that the contact is poor. This problem does not occur.

이와 같이 본 발명 발열부품의 방열장치에 있어서는 각 발열부품이 방열판에 대해 확실히 접촉되므로 접촉면적이 커서 방열성능이 매우 뛰어날 뿐 아니라, 다수의 발열부품을 설치하는 경우에도 일측의 훅과 타측의 나사만을 결합하면 되므로 설치될 발열부품수가 증가하여도 방열장치의 조립공수는 전혀 증가되지 않는 이점이 있다.Thus, in the heat dissipation device of the heat generating part of the present invention, since each heat generating part is firmly in contact with the heat sink, the contact area is large, so the heat dissipation performance is very excellent, and in the case of installing a plurality of heat generating parts, only one hook and the other screw are used. Since it is combined, even if the number of heating parts to be installed is increased, the assembly labor of the heat radiation device does not increase at all.

또한 전자기기내의 설치공간이 협소한 경우에도 조립이 용이하며, 본 발명은 전자기기의 조립공수를 절감시키고, 작동의 신뢰도와 수명을 향상 및 연장시킬 수 있는 매우 유용한 발명인 것이다.In addition, the assembly is easy even when the installation space in the electronic device is narrow, the present invention is a very useful invention that can reduce the assembly labor of the electronic device, improve and extend the life and reliability of operation.

Claims (2)

복수의 발열부품을 탄력적으로 가압하는 복수의 탄성가압부가 형성된 고정판과, 이 고정판을 방열판에 고정시키는 결합수단을 구비하는 발열부품의 방열장치에 있어서, 상기 탄성가압부(2a)는 상기 고정판(2)을 랜싱 가공하여 형성된 것을 특징으로 하는 발열부품의 방열장치.In the heat dissipation device of a heat generating part having a fixed plate formed with a plurality of elastic pressing portion for elastically pressing the plurality of heat generating parts, and the coupling means for fixing the fixing plate to the heat sink, the elastic pressing portion (2a) is the fixed plate (2) Heat dissipation device, characterized in that formed by lancing. 제 1 항에 있어서, 상기 결합수단이, 상기 고정판(2)의 일측에 ㄱ자형의 훅(2b)을 형성하고 타측에 관통구멍(2c)을 형성하며, 상기 방열판(1)의 일측에 상기 훅(2b)이 걸어 맞춤되는 후킹 홀(1a)을 형성하고 타측에 상기 관통구멍(2c)과 동축의 버링 홀(1b)을 형성하여, 상기 하나 또는 복수의 발열부품(T)을 상기 방열판(1)상에 배열한 뒤 상기 훅(2b)을 후킹 홀(1a)에 걸어 맞춤하고, 상기 관통구멍(2c)을 통해 나사(S)를 상기 버링 홀(1b)에 체결하여 되는 것을 특징으로 하는 발열부품의 방열장치.The hook according to claim 1, wherein the coupling means forms an L-shaped hook 2b on one side of the fixing plate 2 and a through hole 2c on the other side thereof, and the hook on one side of the heat sink 1 The hooking hole 1a to which the 2b is engaged is formed, and a burring hole 1b coaxial with the through hole 2c is formed on the other side, so that the one or more heat generating parts T are connected to the heat sink 1. And hooking the hook 2b to the hooking hole 1a, and fastening the screw S to the burring hole 1b through the through hole 2c. Heat dissipation of parts.
KR1019890007636A 1989-06-02 1989-06-02 Cooling element of heating parts KR950000294B1 (en)

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KR1019890007636A KR950000294B1 (en) 1989-06-02 1989-06-02 Cooling element of heating parts

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KR910002321A KR910002321A (en) 1991-01-31
KR950000294B1 true KR950000294B1 (en) 1995-01-12

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KR1019890007636A KR950000294B1 (en) 1989-06-02 1989-06-02 Cooling element of heating parts

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101328940B1 (en) * 2007-02-12 2013-11-14 엘지전자 주식회사 Cooling device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100891994B1 (en) * 2002-06-20 2009-04-08 삼성전자주식회사 Heatsink fixing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101328940B1 (en) * 2007-02-12 2013-11-14 엘지전자 주식회사 Cooling device

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KR910002321A (en) 1991-01-31

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