JPH01293544A - Semiconductor device - Google Patents

Abstract

PURPOSE:To effectively mount externally by clamping with a screw and to eliminate the damage of a resin case by the clamping with the screw by providing a specific resin case, a metal plate and a metal ring. CONSTITUTION:A resin case 1 with a first mounting hole 1a storing a semiconductor element and, a metal plate 4 with a second mounting hole 4a corresponding to the hole 1a, and a metal ring 2 passing between the holes 1 of the case 1 and the hole 4a of the heat sink 4 and having a first engaging recess 5a with the case 1 on the upper outer periphery and a second engaging recess 5b with the heat sink 4 on the lower outer periphery are provided. For example, in order to be easily engaged with the heat sink 4, the recess 5b of the ring 2 is tapered in the lower part of a protrusion 2D, and divided into four. The ring 2 is so insert molded into the case 1 as to be engaged with the recess 5a and the hole 1a.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device having a resin case housing a semiconductor element.

[Conventional technology]

FIG. 4 is a perspective view showing a conventional power semiconductor device, and FIG. 5 is a sectional view showing the vicinity of the mounting hole. Figures 4 and 5
As shown in the figure, the metal ring 2 is press-fitted into the mounting hole 1a of the resin case 1, and the mounting holes 1a and 4a are bonded with adhesive 3.
It is bonded to the heat dissipation plate 4 made of metal so that they match. Note that FIGS. 6(a), 6(b), and 6(c) are a top view, a side view, and a back view of the metal ring 2, respectively.

Attachment for fixing such a power semiconductor device is performed by passing a screw having a washer (not shown) into the metal ring 2 and tightening it.

[Problem to be solved by the invention]

A conventional semiconductor device is constructed as described above, and is mounted to the outside by tightening a screw passed through a metal ring 2 inserted between mounting holes 1a of a resin case 1. When tightening, the force was applied to the metal ring 2 and the resin case 1.

Furthermore, if the resin case 1 is warped or the adhesive 3 is improperly applied, a gap will occur between the resin case 1 and the heat sink 4 near the mounting hole 1a (4a). If the screw is tightened through the metal ring 2 in this state, the force due to tightening the screw will be applied to the resin case 1 in excess of the above-mentioned gap, causing a problem that the resin case 1 near the mounting hole 1a will crack.

Further, if a positional shift occurs when the resin case 1 and the heat sink 4 are bonded together, the mounting holes 1a and 4a do not match, and there is a problem in that the screws passing through the metal ring 2 cannot be tightened.

This invention was made to solve the above-mentioned problems, and its purpose is to provide a semiconductor device that can be securely attached to the outside by tightening screws, and whose resin case will not be destroyed by tightening the screws. shall be.

[Means to solve the problem]

A semiconductor device according to the present invention stores a semiconductor element,
a resin case in which a first mounting hole is formed; a metal plate in which a second mounting hole is formed in correspondence with the first mounting hole;
The first mounting hole of the resin case and the second mounting hole of the metal plate are penetrated, and the upper outer periphery has a first engagement recess with the resin case, and the lower outer periphery has the heat radiation. and a metal ring having a second engagement recess with the plate.

[Effect]

The metal ring in this invention has a first engagement recess with the resin case on the upper outer periphery, and a second engagement recess with the metal plate on the lower outer periphery.
Since the resin case and the metal plate have the engagement recessed portion, it is possible to bond the resin case and the metal plate through this metal ring without causing any positional shift or gap.

〔Example〕

FIG. 1 is a sectional view showing the vicinity of a mounting hole of a power semiconductor device according to an embodiment of the present invention. As shown in the figure, the metal ring 2 is inserted between the mounting hole 1a of the resin case 1 and the mounting hole 48 of the heat sink 4. This metal ring 2 forms an engagement recess 5a with the resin case 1 with the protrusions 2A, 2B and the upper outer periphery 2C, and an engagement recess 5b with the heat dissipation plate 4 with the protrusions 2B, 2D and the lower outer periphery 2E. ing.

FIGS. 2(a) to 2(C) are top views of the metal ring 2, respectively.

They are a side view and a back view. As shown in the figure, in order to facilitate engagement with the heat dissipation plate 4, the engagement recess 5b of the metal ring 2 is
A tapered portion is provided at the lower part of the protrusion 2D, and the protrusion 2D is divided into four parts.

In addition, as shown in FIG. 1, in order to facilitate fitting of the resin case 1 and the heat sink 4, a stepped portion 1b is provided near the mounting hole 18.4a on both sides.
, 4b.

The power semiconductor device shown in FIG. 1 is assembled as follows.

First, the metal ring 2 is processed as shown in FIG. 2, and then, as shown in FIG. 3, it is insert molded into the resin case 1 so that the engagement recess 5a and the mounting hole 1a are engaged. At this time, from the bottom surface of the protrusion 2B of the metal ring 2,
It is desirable to form the resin case 1 so that the stepped portion 1b is located approximately 0.2 ms+ above, and to provide the adhesive 3 insertion region.

As shown in FIG. Glue case 1.

The engagement recesses 5a and 5b of the metal ring 2 cause the metal ring 2 to
Since the resin case 1 and the heat sink 4 are engaged with each other, the resin case 1 and the heat sink 4 are reliably fitted together by the adhesive 3. Therefore, most of the warpage of the resin case 1 is corrected at this time, and no gap is created between the resin case 1 and the heat sink 4.

At this time, since the resin case 1 has not yet hardened, the resin case 1 will not be cracked by the straightening.

In addition, if the adhesive 3 is applied unevenly or the resin case 1
Even if a gap occurs between the resin case 1 and the heat sink 4 due to warping, the heat sink 4 is engaged by the engagement recess 5b of the metal ring 2, so the screws cannot be tightened through the metal ring 2. Most of the force can be received by the sturdy heat sink 4, and only a small amount of force is received by the resin case 1.
It can be said that there is no possibility that the resin case 1 will break.

Furthermore, since the fitting recesses 5a, 5b of the metal ring 2 position the mounting holes 1a, 4a of the resin case 1 and the heat sink 4, no misalignment of the holes 1a, 4a occurs during installation.

From the above points, the assembly process can be streamlined, and a power semiconductor device that is inexpensive, highly accurate, and highly reliable can be obtained.

Although this example describes a power semiconductor device, other semiconductor devices and other fields can also be used with a configuration in which a resin case is glued to a metal plate and the metal plate is attached to the outside with screws. This invention can be applied to any product.

〔Effect of the invention〕

As explained above, according to the present invention, the metal ring has a first engagement recess with the resin case on its upper outer periphery, and a second engagement recess with the metal plate on its lower outer periphery. Therefore, it can be mounted externally by securely tightening the screws.
Tightening these screws will not break the resin case.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the vicinity of the mounting hole of a power semiconductor device according to an embodiment of the present invention, and FIGS. 2(a), (b),
C) is a top view, side view, and back view of the metal ring 2 in the power semiconductor device shown in FIG. 1, and FIG. 3 is a sectional view for explaining the assembly of the power semiconductor device shown in FIG. 1, FIG. 4 is a perspective view showing a conventional power semiconductor device, FIG. 5 is a sectional view showing the vicinity of a mounting hole of the conventional power semiconductor device, and FIGS. 6(a) and (b). (C) are a top view, a side view, and a back view of the metal ring 2 in the power semiconductor device shown in FIG. 5, respectively. In the figure, 1 is a resin case, 2 is a metal ring, 4 is a heat sink, 1a and 4a are mounting holes, and 5a and 5b are engaging recesses. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) A resin case housing a semiconductor element and having a first mounting hole formed therein; a metal plate having a second mounting hole formed therein corresponding to the first mounting hole; and the resin case. and a second mounting hole of the metal plate, a first engagement recess with the resin case on its upper outer periphery, and a first engagement recess with the metal plate on its lower outer periphery. A semiconductor device comprising: a metal ring having two engaging recesses.