JPH0220868Y2 - - Google Patents
Info
- Publication number
- JPH0220868Y2 JPH0220868Y2 JP1983155865U JP15586583U JPH0220868Y2 JP H0220868 Y2 JPH0220868 Y2 JP H0220868Y2 JP 1983155865 U JP1983155865 U JP 1983155865U JP 15586583 U JP15586583 U JP 15586583U JP H0220868 Y2 JPH0220868 Y2 JP H0220868Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- case
- heat sink
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、放熱板の取付けられたプリント回路
基板をケースに固定してなる電子機器に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic device in which a printed circuit board to which a heat sink is attached is fixed to a case.
（従来技術）
従来のスイツチング電源等の電子機器において
は、放熱板とプリント回路基板とをねじ止めし、
このプリント回路基板をケースにねじ止めして組
立てるようにしていた。(Prior art) In conventional electronic devices such as switching power supplies, the heat sink and printed circuit board are screwed together.
This printed circuit board was assembled by screwing it into the case.
（考案が解決しようとする問題点）
そのため、複数のねじ止め工程が必要となり、
工程が煩雑になつてコスト的にも不利になるとい
う問題があつた。(Problem that the invention attempts to solve) Therefore, multiple screw-fastening processes are required,
There was a problem that the process became complicated and it became disadvantageous in terms of cost.
（問題点を解決するための手段）
本考案は、このような点に鑑みてなされたもの
で、ねじ止め工程を簡略化して組立てを容易にし
た電子機器を提供することを目的とする。(Means for Solving the Problems) The present invention has been made in view of the above points, and an object thereof is to provide an electronic device that is easy to assemble by simplifying the screw fastening process.
（実施例）
以下に本考案の一実施例を図面を参照して詳細
に説明する。(Example) An example of the present invention will be described below in detail with reference to the drawings.
図において、１は絶縁樹脂等からなる第１のケ
ース部、２，３はこの第１ケース部の内壁面に一
体形成された突壁である。この突壁は、図示のよ
うに複数個に分割されたものに限らず、連続した
枠状に形成されたものでもよい。４はこの突壁
２，３上に当接して配置された第１のプリント回
路基板で、一面にスイツチング電源回路等を構成
する複数個の電子部品（図示省略）が取付けら
れ、他面に所定の配線パターンが形成され、その
他面側が第１のケース部の内壁面に向くように配
置されたものである。５はコ字状に形成されたア
ルミニウム等からなる放熱板で、前記プリント回
路基板４上に取付けられる面を有する。この放熱
板５は、ここに取付けられたトランジスタ、IC
等の半導体素子（図示省略）を良好に冷却するも
のである。 In the figure, 1 is a first case part made of insulating resin or the like, and 2 and 3 are projecting walls integrally formed on the inner wall surface of this first case part. This projecting wall is not limited to being divided into a plurality of pieces as shown in the figure, but may be formed in a continuous frame shape. Reference numeral 4 denotes a first printed circuit board placed in contact with the projecting walls 2 and 3, on one side of which a plurality of electronic components (not shown) constituting a switching power supply circuit etc. are attached, and on the other side with predetermined circuit boards. A wiring pattern is formed thereon, and the other surface is arranged so as to face the inner wall surface of the first case part. Reference numeral 5 denotes a U-shaped heat sink made of aluminum or the like, and has a surface to be mounted on the printed circuit board 4. This heat sink 5 is used for transistors and ICs installed here.
This is to effectively cool semiconductor devices such as (not shown).
６は第１のタツピンねじで、前記第１ケース部
１に形成された貫通孔７および前記第１のプリン
ト回路基板４に形成された貫通孔８に第１ケース
部１外部から挿入され、放熱板５の前記第１のプ
リント回路基板４に取付けられる面にねじ込まれ
たものである。第１のプリント回路基板４は、第
１のタツピンねじの放熱板５へのねじ込みによつ
て、放熱板５により突壁２，３上に押圧され、固
定される。これにより、放熱板５も第１のプリン
ト回路基板４上に固定されることになる。第１の
タツピンねじ６の放熱板５へのねじ込みを容易に
するため、放熱板５にはあらかじめ小径の孔が形
成されている。９は絶縁樹脂等からなる、前記第
１のケース部１に対する蓋としての機能を有する
第２のケース部、１０，１１は第２ケース部の、
前記第１ケース部１内部に配置された第１のプリ
ント回路基板４と対向する内壁面に一体形成され
た、第１のケース部１に形成された突壁２，３と
同様の突壁、１２はこの突壁１０，１１上に当接
して配置された、第１のプリント回路基板４と同
様の第２のプリント回路基板である。１３は第２
のタツピンねじで、第２のプリント回路基板１２
および第２ケース部９が放熱板５上に載置された
状態で、第２ケース部９に形成された貫通孔１４
およびプリント回路基板１２に形成された貫通孔
１５に第２ケース部９外部から挿入され、放熱板
５の第２のプリント回路基板１２に取付けられる
面にねじ込まれたものである。第２のプリント回
路基板１２および第２ケース部９は、第２のタツ
ピンねじ１３の放熱板５へのねじ込みによつて、
放熱板５上に固定される。この時、第１ケース部
１と第２ケース部９も固定され、ケースを構成す
ることとなる。第２のタツピンねじ１３の放熱板
５へのねじ込みを容易にするため、放熱板５には
あらかじめ小径の孔が形成されている。 Reference numeral 6 denotes a first tuft pin screw, which is inserted from the outside of the first case part 1 into a through hole 7 formed in the first case part 1 and a through hole 8 formed in the first printed circuit board 4 to dissipate heat. It is screwed into the surface of the plate 5 that is attached to the first printed circuit board 4. The first printed circuit board 4 is pressed and fixed onto the projecting walls 2 and 3 by the heat sink 5 by screwing the first tuft pin screw into the heat sink 5. Thereby, the heat sink 5 is also fixed onto the first printed circuit board 4. In order to facilitate screwing the first tuft pin screw 6 into the heat sink 5, a small diameter hole is formed in the heat sink 5 in advance. Reference numeral 9 denotes a second case part made of insulating resin or the like, which functions as a lid for the first case part 1; 10 and 11 are the second case parts;
A protruding wall similar to the protruding walls 2 and 3 formed in the first case part 1, integrally formed on an inner wall surface facing the first printed circuit board 4 disposed inside the first case part 1; Reference numeral 12 designates a second printed circuit board similar to the first printed circuit board 4, which is disposed in contact with the projecting walls 10 and 11. 13 is the second
With the tuft pin screws of the second printed circuit board 12
and a through hole 14 formed in the second case part 9 with the second case part 9 placed on the heat sink 5.
It is inserted from the outside of the second case part 9 into a through hole 15 formed in the printed circuit board 12 and screwed into the surface of the heat sink 5 to be attached to the second printed circuit board 12. The second printed circuit board 12 and the second case part 9 are assembled by screwing the second pin screw 13 into the heat sink 5.
It is fixed on the heat sink 5. At this time, the first case part 1 and the second case part 9 are also fixed to form a case. In order to facilitate the screwing of the second pin screw 13 into the heat sink 5, a small diameter hole is formed in the heat sink 5 in advance.
本考案の電源等を構成する電子機器は以上のよ
うに構成されるが、必ずしも上記の構成に限定さ
れるものではなく、要旨を逸脱しない範囲での
種々の改変が可能である。 Although the electronic device constituting the power source and the like of the present invention is configured as described above, it is not necessarily limited to the above configuration, and various modifications can be made without departing from the gist.
（考案の効果）
本考案の電子機器は以上のように、第１および
第２のケース部および第１および第２のプリント
回路基板を貫通する貫通孔にケース外部から挿入
された第１および第２のタツピンねじを、放熱板
の各プリント回路基板に取付けられる面にそれぞ
れねじ込むことにより、前記各ケース部内壁面の
突壁上に当接された前記各プリント回路基板が、
ケース内壁面の突壁上に固定されるようにしたの
で、第１および第２のタツピンねじのねじ止め作
業で各ケース部、各プリント回路基板および放熱
板の３者が同時に固定されるとともに、第１およ
び第２のケース部が固定されることとなり、電子
機器の組立てがきわめて容易になるというすぐれ
た効果を奏する。(Effects of the Invention) As described above, the electronic device of the present invention has the first and second case portions and the first and second printed circuit boards inserted from outside the case into the through holes passing through the first and second case parts and the first and second printed circuit boards. By screwing the No. 2 tuft pin screws into the surfaces of the heat sink to be attached to the respective printed circuit boards, each of the printed circuit boards abutted on the projecting wall of the inner wall surface of each of the case parts,
Since it is fixed on the projecting wall of the inner wall of the case, each case part, each printed circuit board, and the heat sink are simultaneously fixed by tightening the first and second pin screws, and Since the first and second case parts are fixed, this has the excellent effect of making it extremely easy to assemble the electronic device.
図は本考案の一実施例の電子機器の縦断面図で
ある。
１，９……ケース部、２，３，１０，１１……
突壁、４，１２……プリント回路基板、５……放
熱板、６，１３……タツピンねじ。
The figure is a longitudinal sectional view of an electronic device according to an embodiment of the present invention. 1, 9... Case part, 2, 3, 10, 11...
Projection wall, 4, 12... Printed circuit board, 5... Heat sink, 6, 13... Tatsupin screw.
Claims (1)
に第１および第２のプリント回路基板ならびに放
熱板が配置されてなる電子機器であつて、 前記第１ケース部の内壁面に突壁を形成し、こ
の突壁に当接して第１のプリント回路基板を配置
するとともに、この第１ケース部上に配置される
第２ケース部の、前記第１ケース部内に配置され
た第１のプリント回路基板と対向する内壁面に突
壁を形成し、この突壁に当接して第２のプリント
回路基板を配置し、 これらの第１および第２のプリント回路基板に
それぞれ取付けられる面を有する放熱板を、これ
らの基板間に配置し、各々のケース部に設けた貫
通孔および各々のプリント回路基板に設けた貫通
孔を貫通する第１および第２のタツピンねじを、
前記放熱板の各プリント回路基板に取付けられる
面にねじ込むことにより、前記各プリント回路基
板が各ケース部の突壁上に固定されるとともに、
前記第１および第２のケース部を固定するように
したことを特徴とする電子機器。[Claims for Utility Model Registration] An electronic device in which first and second printed circuit boards and a heat sink are disposed inside a case consisting of a first and second case part, wherein the first case part A projecting wall is formed on the inner wall surface, a first printed circuit board is disposed in contact with the projecting wall, and a second case section disposed on the first case section is disposed within the first case section. A projecting wall is formed on the inner wall surface facing the first printed circuit board, and a second printed circuit board is disposed in contact with the projecting wall, and a projecting wall is formed on each of the first and second printed circuit boards. A heat sink having a mounting surface is disposed between these boards, and first and second pin screws are inserted through the through holes provided in each case portion and the through holes provided in each printed circuit board.
By screwing into the surface of the heat sink that is attached to each printed circuit board, each of the printed circuit boards is fixed onto the projecting wall of each case part, and
An electronic device characterized in that the first and second case parts are fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15586583U JPS6063994U (en) | 1983-10-06 | 1983-10-06 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15586583U JPS6063994U (en) | 1983-10-06 | 1983-10-06 | Electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6063994U JPS6063994U (en) | 1985-05-07 |
| JPH0220868Y2 true JPH0220868Y2 (en) | 1990-06-06 |
Family
ID=30344104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15586583U Granted JPS6063994U (en) | 1983-10-06 | 1983-10-06 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063994U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069648A (en) * | 2010-09-22 | 2012-04-05 | Hitachi Automotive Systems Ltd | Electronic control device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5750897B2 (en) * | 1978-08-03 | 1982-10-29 | ||
| JPS5840950B2 (en) * | 1978-01-03 | 1983-09-08 | エシル コ−ポレ−シヨン | 2↓-Method for producing benzimidazole carbamate compound |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52144604U (en) * | 1976-04-26 | 1977-11-02 | ||
| JPS608480Y2 (en) * | 1980-09-05 | 1985-03-25 | 三洋電機株式会社 | small electrical equipment |
| JPS5840950U (en) * | 1981-09-11 | 1983-03-17 | 三洋電機株式会社 | Tuner mounting device |
-
1983
- 1983-10-06 JP JP15586583U patent/JPS6063994U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5840950B2 (en) * | 1978-01-03 | 1983-09-08 | エシル コ−ポレ−シヨン | 2↓-Method for producing benzimidazole carbamate compound |
| JPS5750897B2 (en) * | 1978-08-03 | 1982-10-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6063994U (en) | 1985-05-07 |
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