JPH0312779B2 - - Google Patents
Info
- Publication number
- JPH0312779B2 JPH0312779B2 JP59191004A JP19100484A JPH0312779B2 JP H0312779 B2 JPH0312779 B2 JP H0312779B2 JP 59191004 A JP59191004 A JP 59191004A JP 19100484 A JP19100484 A JP 19100484A JP H0312779 B2 JPH0312779 B2 JP H0312779B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- radiator
- protrusion
- heat sink
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【発明の詳細な説明】
産業上の利用分野
本発明は民生用、産業用を問わずあらゆる分野
の電源供給装置や制御装置等に使用される、トラ
ンジスタやダイオード等の半導体用放熱装置に関
するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a heat dissipation device for semiconductors such as transistors and diodes, which is used in power supply devices and control devices in all fields, whether for consumer use or industrial use. be.
従来例の構成とその問題点
一般に電源装置や制御装置等に使用するモール
ドタイプのパワー半導体を放熱器に取付ける場合
は第１図及び第２図のようにアルミ材等を用い、
半導体２を取付用ネジ３を用いて放熱器１に設け
たネジ穴ａに取付けている。４は前述の放熱器１
と半導体２を電気的に絶縁するための絶縁板であ
る。又５は放熱をより効果的にするために放熱器
に設けたフインである。以上の構成、つまり半導
体２を放熱器１に取付用ネジ３を介して取付けた
場合、次の欠点がある。先ず工法上では放熱器１
にネジ止めるためのネジ穴ａはドリル又はプレス
加工を行い、後にネジ溝を作るためのタツプ加工
を行い最後にネジ穴ａの反りバリ取り等の複雑な
工程を要する。又放熱器１に半導体２を取付ける
工程も絶縁板４に設けた穴a′を放熱器１のネジ穴
ａに位置合せした後、半導体２を重ね取付用ネジ
３をドライバー等で締付ける。その際取付用ネジ
３の回転方向へ半導体２及び絶縁板４が位置ずれ
を生じないように治具等で半導体２や絶縁板４を
固定しておくことが必要である。従つて構成では
部品の加工上又は組立工程とも生産性上不都合な
面が多かつた。Conventional configuration and its problems Generally, when installing a mold type power semiconductor used in a power supply device or a control device, etc. to a heat sink, aluminum material or the like is used as shown in Figures 1 and 2.
A semiconductor 2 is attached to a screw hole a provided in a heat sink 1 using a mounting screw 3. 4 is the aforementioned heat sink 1
This is an insulating plate for electrically insulating the semiconductor 2 and the semiconductor 2. Further, 5 is a fin provided on the heat radiator to make heat radiation more effective. The above configuration, that is, when the semiconductor 2 is attached to the heat sink 1 via the attachment screws 3, has the following drawbacks. First of all, in terms of construction method, radiator 1
A complicated process is required, such as drilling or press processing to create a screw hole a for screwing, followed by tapping to create a thread groove, and finally deburring the screw hole a. Also, in the step of attaching the semiconductor 2 to the heat sink 1, after aligning the hole a' provided in the insulating plate 4 with the screw hole a of the heat sink 1, the semiconductor 2 is stacked and the mounting screw 3 is tightened with a screwdriver or the like. At this time, it is necessary to fix the semiconductor 2 and the insulating plate 4 with a jig or the like so that the semiconductor 2 and the insulating plate 4 do not shift in the direction of rotation of the mounting screw 3. Therefore, the structure has many disadvantages in terms of productivity, both in the processing of parts and in the assembly process.
発明の目的
本発明は上記従来の欠点に鑑み放熱器の加工及
び半導体組立上有利な半導体用放熱装置を提供す
ることを目的とするものである。OBJECTS OF THE INVENTION In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide a heat radiating device for a semiconductor that is advantageous in terms of heat radiator processing and semiconductor assembly.
発明の構成
放熱用フイン付放熱器で半導体の取付側に半導
体取付面と垂直に２個のＴ字状又はＬ字状の突起
を設け、これらの突起間の前記放熱器面に絶縁体
を介して半導体を設置し、この半導体を固定する
押え金具の内側部分には前記半導体の凹部に挿入
される突起部を形成し、この押え金具の両方の外
側部分には、前記Ｔ字状又はＬ字状の突起に係合
する係合部を形成したものである。Structure of the Invention A radiator with heat dissipation fins has two T-shaped or L-shaped protrusions perpendicular to the semiconductor mounting surface on the mounting side of the semiconductor, and an insulator is provided on the radiator surface between these protrusions. A semiconductor is placed on the semiconductor, and a protrusion that is inserted into the recess of the semiconductor is formed on the inner part of the presser metal fitting that fixes the semiconductor, and a protrusion that is inserted into the recess of the semiconductor is formed on both outer parts of the presser metal fitting. An engaging portion that engages with a shaped projection is formed.
実施例の説明
以下、本発明の実施例を図面第３図〜第６図を
用いて説明する。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIGS. 3 to 6.
第３図で６は半導体７を取付ける放熱器であ
り、この放熱器６には放熱効果を上げるために放
熱用フイン８及び半導体７を固定するための突起
９が設けられ、放熱効果及び加工の容易性等から
アルミの押出材を使用している。 In FIG. 3, reference numeral 6 denotes a heat radiator to which the semiconductor 7 is attached, and the heat radiator 6 is provided with heat radiating fins 8 and protrusions 9 for fixing the semiconductor 7 to improve the heat radiating effect. Extruded aluminum is used because of its ease of use.
１０は半導体７を放熱器６に固定するためのバ
ネ材を使用した押え金具で詳細を第４図に示す。 Reference numeral 10 denotes a holding fitting using a spring material for fixing the semiconductor 7 to the heat sink 6, and the details are shown in FIG.
第３図で絶縁板１１は放熱器６と半導体７を電
気的に絶縁するためのものでマイカ板やシリコン
ゴム等を使用し、寸法は半導体７の接触面積（放
熱器との）よりやや大きくし放熱器６のｂ寸法よ
り若干細く、放熱器６のフインを兼ねた突起９で
位置決めガイドになる。又このＴ字型をした突起
９の内側寸法ｂは半導体７の外径より多少大きく
取り半導体７と放熱器６を組立てる際のガイドで
ある又このＴ字型の突起９の外径ｃは半導体７を
放熱器６に固着するための押え金具１０を固定す
るための突起である。 In Fig. 3, the insulating plate 11 is for electrically insulating the heat sink 6 and the semiconductor 7, and is made of mica plate, silicone rubber, etc., and its dimensions are slightly larger than the contact area of the semiconductor 7 (with the heat sink). The projections 9, which are slightly thinner than dimension b of the heat sink 6 and also serve as fins of the heat sink 6, serve as positioning guides. The inner dimension b of this T-shaped protrusion 9 is slightly larger than the outer diameter of the semiconductor 7 to serve as a guide when assembling the semiconductor 7 and the heat sink 6. The outer diameter c of this T-shaped protrusion 9 is larger than the outer diameter of the semiconductor 7. This is a protrusion for fixing a presser fitting 10 for fixing the heat sink 7 to the heat radiator 6.
第４図はバネ鋼やリン青銅などのバネ性の材料
を用いた第３図の押え金具１０の詳細図で１０ａ
部分は半導体面を均等に押えられるように平面に
しその一部に半導体７のネジ通し用穴（凹部）に
合う突起部１２を設け半導体７の位置決めをす
る。又先端折曲げ部１３は放熱器６の突起部９の
外径寸法ｃ部にかん合できるようにｄ寸法を多少
ｃ寸法より小さくし、第３図のように放熱器６に
半導体７を組み込んだ状態で押え金具１０のバネ
性で半導体７を常に放熱器６に密着するような押
え金具形状にすることにより従来の第１図のよう
なネジ締付けによる組立上及び放熱器加工上の生
産性が大幅に改善できる。又ネジ締付トルクのバ
ラツキによる半導体と放熱器の密着性のバラツキ
や絶縁板孔位置ズレによる絶縁不良等信頼性上の
問題も一挙に改善が可能である。 FIG. 4 is a detailed view of the presser fitting 10 of FIG. 3, which is made of spring material such as spring steel or phosphor bronze, and is 10a
The portion is made flat so that the semiconductor surface can be held evenly, and a protrusion 12 that fits into a screw hole (recess) of the semiconductor 7 is provided on a portion thereof to position the semiconductor 7. In addition, the bent end portion 13 has its d dimension slightly smaller than the c dimension so that it can be fitted with the outer diameter c portion of the protrusion 9 of the radiator 6, and the semiconductor 7 is incorporated into the radiator 6 as shown in FIG. By shaping the holding fitting so that the semiconductor 7 is always brought into close contact with the heatsink 6 by the spring properties of the holding fitting 10 in the open state, productivity in assembling and processing the heatsink by tightening screws as shown in the conventional figure 1 is improved. can be significantly improved. In addition, reliability problems such as variations in the adhesion between the semiconductor and the heat sink due to variations in the screw tightening torque and poor insulation due to misalignment of holes in the insulating plate can all be improved at once.
第５図、第６図は第３図の同じ放熱器６を使用
して第３図の半導体７より小形の半導体７′を固
着するための押え金具１４を使用したものであ
る。この場合放熱器６のＴ字型突起部９の内側の
先端に押え金具１４の先端折曲げ部１５がかん合
できるようにしたもので押え金具寸法ｅを半導体
７′の外径より多少大きく取り、半導体７′の位置
決めにしている。 5 and 6 use the same heat radiator 6 as shown in FIG. 3, but use a presser metal fitting 14 for fixing a semiconductor 7' smaller than the semiconductor 7 shown in FIG. In this case, the bent end portion 15 of the presser metal fitting 14 is designed to be able to engage with the inner tip of the T-shaped protrusion portion 9 of the heat sink 6, and the size e of the presser metal fitting is set to be slightly larger than the outer diameter of the semiconductor 7'. , for positioning the semiconductor 7'.
発明の効果
以上のように本発明は、放熱用フイン付放熱器
で半導体の取付側に半導体取付面と垂直に２個の
Ｔ字状又はＬ字状の突起を設け、これらの突起間
の前記放熱器面に絶縁体を介して半導体を設置
し、この半導体を固定する押え金具の内側部分に
は前記半導体の凹部に挿入される突起部を形成
し、この押え金具の両方の外側部分には、前記Ｔ
字状又はＬ字状の突起に係合する係合部を形成し
たものである。Effects of the Invention As described above, the present invention provides a heat sink with heat dissipation fins, in which two T-shaped or L-shaped protrusions are provided on the mounting side of the semiconductor perpendicular to the semiconductor mounting surface, and the A semiconductor is installed on the surface of the radiator through an insulator, and the inner part of the holding metal fitting that fixes the semiconductor is formed with a protrusion that is inserted into the recess of the semiconductor, and the outer parts of both of the holding fittings are , the T
An engaging portion that engages with a letter-shaped or L-shaped protrusion is formed.
したがつて、本発明によれば押え金具の内側部
分の突起部を半導体の凹部に挿入し、その外側部
分の係合部を放熱器の突起に係合させるだけで簡
単に半導体の実装が確実に行なえるものとなる。 Therefore, according to the present invention, the semiconductor can be mounted easily and reliably by simply inserting the protrusion on the inner side of the presser into the recess of the semiconductor and engaging the engaging part on the outer side with the protrusion on the heat sink. It becomes something that can be done.
また放熱器には従来のようなビス孔加工を施す
必要がなくなるので、その加工が単純となつてコ
ストの低減が可能となるのである。 Furthermore, since there is no need to process screw holes in the heat sink as in the conventional case, the process becomes simple and costs can be reduced.
さらに押え金具は、その突起部を半導体の凹部
に挿入し、その状態でその両方の外側の係合部を
放熱器の突起に係合させて放熱器への装着を完了
させるので、この装着時に押え金具が半導体上を
摺動して傷を付け、損傷させることもなくなる。 Furthermore, the projection of the presser metal fitting is inserted into the recess of the semiconductor, and in this state, both of its outer engaging portions are engaged with the projections of the radiator to complete installation on the radiator. The presser metal fitting will no longer slide on the semiconductor and cause damage.
第１図は従来の半導体用放熱装置の斜視図、第
２図は同要部の分解斜視図、第３図は本発明の半
導体用放熱装置の一実施例を示す斜視図、第４図
は同装置に用いる押え金具の斜視図、第５図は他
の実施例の斜視図、第６図は同装置に用いる押え
金具の斜視図である。
６……放熱器、７，７′……半導体、８……放
熱用フイン、９……突起、１０……押え金具、１
１……絶縁板、１２……突部、１３……先端折曲
げ部、１４……押え金具、１５……先端折曲げ
部。
FIG. 1 is a perspective view of a conventional semiconductor heat dissipation device, FIG. 2 is an exploded perspective view of the main parts, FIG. 3 is a perspective view showing an embodiment of the semiconductor heat dissipation device of the present invention, and FIG. 4 is a perspective view of a conventional semiconductor heat dissipation device. FIG. 5 is a perspective view of another embodiment, and FIG. 6 is a perspective view of a presser fitting used in the same apparatus. 6... Heat sink, 7, 7'... Semiconductor, 8... Heat radiation fin, 9... Protrusion, 10... Holding metal fitting, 1
DESCRIPTION OF SYMBOLS 1...Insulating plate, 12...Protrusion, 13...Tip bent part, 14...Press fitting, 15...Tip bent part.
Claims (1)
導体取付面と垂直に２個のＴ字状又はＬ字状の突
起を設け、これらの突起間の前記放熱器面に絶縁
体を介して半導体を設置し、この半導体を固定す
る押え金具の内側部分には前記半導体の凹部に挿
入される突起部を形成し、この押え金具の両方の
外側部分には、前記Ｔ字状又はＬ字状の突起に係
合する係合部を形成した半導体用放熱装置。1 A radiator with heat dissipation fins has two T-shaped or L-shaped protrusions perpendicular to the semiconductor mounting surface on the mounting side of the semiconductor, and the semiconductor is attached to the surface of the radiator between these protrusions via an insulator. A protrusion to be inserted into the recess of the semiconductor is formed on the inner part of the presser metal fitting for fixing the semiconductor, and the T-shaped or L-shaped plate is formed on both outer parts of the presser metal fitting. A semiconductor heat dissipation device that has an engaging portion that engages with a protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19100484A JPS6169156A (en) | 1984-09-12 | 1984-09-12 | Heat-dissipating device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19100484A JPS6169156A (en) | 1984-09-12 | 1984-09-12 | Heat-dissipating device for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6169156A JPS6169156A (en) | 1986-04-09 |
| JPH0312779B2 true JPH0312779B2 (en) | 1991-02-21 |
Family
ID=16267267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19100484A Granted JPS6169156A (en) | 1984-09-12 | 1984-09-12 | Heat-dissipating device for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169156A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6380853U (en) * | 1986-11-14 | 1988-05-27 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574238B2 (en) * | 1978-11-30 | 1982-01-25 | ||
| JPS5886752A (en) * | 1981-11-18 | 1983-05-24 | Matsushita Electric Ind Co Ltd | Mounting device for heating part |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5252794Y2 (en) * | 1974-07-08 | 1977-11-30 | ||
| JPS574238U (en) * | 1980-06-06 | 1982-01-09 |
-
1984
- 1984-09-12 JP JP19100484A patent/JPS6169156A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574238B2 (en) * | 1978-11-30 | 1982-01-25 | ||
| JPS5886752A (en) * | 1981-11-18 | 1983-05-24 | Matsushita Electric Ind Co Ltd | Mounting device for heating part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6169156A (en) | 1986-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |