JP3278697B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a resin-encapsulated semiconductor device is mounted on a heat sink via an insulating heat conductive spacer.

[0002]

2. Description of the Related Art FIG. 6 is an exploded view of an exploded semiconductor device.
FIG. 7 is an assembly drawing and a view showing a method of assembling a semiconductor device .
5 and 8 are a side view and a plan view of the semiconductor device after assembly. In the figure, reference numeral 1 denotes a resin-shot semiconductor device which is a semiconductor device, 1a to 1c denote lead terminals, 1d denotes a primary heat sink to which a power semiconductor is die-bonded as a part of a lead frame, and a metal portion is sealed with resin. It is exposed to the outside without. Reference numeral 2 denotes a heat radiating plate which is a heat radiating member for radiating heat generated in the resin-encapsulated semiconductor device 1. have. The punches 2a to 2e are obtained by hitting the heat sink 2 from the back. Numeral 3 is provided between the resin-encapsulated semiconductor device 1 and the heat sink 2 to conduct heat generated from the primary heat sink 1d to the heat sink 2 and electrically insulate the primary heat sink 1d from the heat sink 2. It is an insulating heat conductive spacer which is an insulating heat conductive member.
The insulating heat conductive spacer 3 is made of a silicon-based resin having a thickness of 0.3 mm (generally, about 0.2 to 0.8 mm). Reference numeral 4 denotes a screw which is a screw member for attaching the resin-sealed semiconductor device 1 and the insulating heat conductive spacer 3 to the heat sink 2, and is tightened in the direction of arrow A in FIG. The screw 4 penetrates through the mounting hole 1 e provided in the resin-sealed semiconductor device 1 and the first opening 3 a provided in the insulating heat conductive spacer 3 as shown in FIG.
Screw with the screw hole 2f.

Next, an assembling procedure will be described. First,
The insulating heat conductive spacer 3 is placed along the protrusions 2 a to 2 e provided on the heat sink 2. Then, with the primary heat sink 1d side facing the insulating heat conductive spacer 3, the mounting hole 1
The resin-encapsulated semiconductor device 1 is mounted on the insulating heat-conducting spacer 3 such that e coincides with the first opening 3a. Finally, the screw 4 is tightened in the direction of arrow A as shown in FIG.
The semiconductor device completed in this manner has the appearance as shown in FIGS. 8 and 9, and operates by electrically connecting the lead terminals 1a to 1c to an external device.

The semiconductor device configured as described above is used, for example, for switching an inductive load. Incidentally, the power semiconductor is die-bonded to the primary heat sink 1d. Therefore, a potential of several hundred volts is generated in the primary heat sink 1d. Further, heat generated by operating the power semiconductor is accumulated in the primary heat sink 1d. Therefore, in the conventional semiconductor device, a stable operation is obtained by providing the insulating heat conductive spacer 3 having good thermal conductivity and excellent insulating property between the resin-sealed semiconductor device 1 and the heat sink 2. Was.

[0005]

Since the conventional semiconductor device is configured as described above, when the screw 4 is tightened, the resin-encapsulated semiconductor device 1 receives a stress in the rotational direction of the screw 4 and is displaced. There was something. If this displacement occurs, the distance between the primary heat sink 1d and the protrusions 2a to 2e provided on the heat sink 2 becomes short.
As described above, a potential difference of several hundred volts is generated between the primary heat sink 1d and the heat sink 2. For this reason, there is a possibility that the insulation distance is insufficient and the resin-sealed semiconductor device 1 is broken. In addition, there has been a problem that the insulating heat conductive spacer 3 is broken when the resin-sealed semiconductor device 1 rotates.

[0006] The present invention has been made to solve the above problems, there is no and this for positional displacement in mounting the semi-conductor device with a screw, moreover the semiconductor device,
Insulation heat conduction member and heat radiation member can be positioned simultaneously
It is intended to obtain a semiconductor device.

Further, the structure is simple and high-density mounting is possible.
It is intended to obtain a possible semiconductor device.

In addition, mounting a wrong semiconductor device
It is intended to obtain a semiconductor device which does not have any problem.

[0009]

[Means for Solving the Problems] Semiconductor device according to the present invention
The heat dissipating member with screw holes and the
Device having a mounting hole to be mounted on a heat radiating member
A first opening corresponding to the screw hole,
Generated from a semiconductor device interposed between
The heat dissipated to the heat dissipating member and the heat dissipating member
Vise and electrical Heat-insulating member and semiconductor for insulation
Provided within the area where the device is placed, and
The projected protrusion and the recess provided in the semiconductor device are related.
The positioning of the heat dissipating member and the semiconductor device.
Positioning means for performing the mounting, and through the mounting hole and the first opening.
And a screw member that is screwed into the screw hole through
The member has a linear end, and the end is a convex portion of the heat radiating member.
Abut the first opening, mounting holes and screw holes.
Positioning is performed by matching
It is.

Further , the semiconductor device according to the present invention is a semiconductor device.
The position of the positioning means is different for each body device
It is.

[0011]

In the semiconductor device configured as described above, the semiconductor device is positioned on the heat radiating member by the positioning means.
-Decided-fitted, semiconductor devices, insulating heat conducting member and release
The heating members are positioned simultaneously.

Further , since the positioning position of the positioning means is different for each semiconductor device, only the predetermined semiconductor device can be attached.

[0013]

[Embodiment 1] Hereinafter, embodiments of the present invention will be described. FIG. 1 is a rear view of a resin-sealed semiconductor device 1 according to the first embodiment, FIG. 2 is a plan view in which an insulating heat conductive spacer 3 is mounted on a heat sink 2 according to the first embodiment, and FIG. FIG. 4 is a plan view of the semiconductor device, and FIG. 4 is a side view of the semiconductor device according to the first embodiment.
In the drawings, the same reference numerals as those of the conventional semiconductor device indicate the same or corresponding parts as those of the conventional semiconductor device.

In the first embodiment, the projections 2g and 2h, which are convex portions provided on the heat sink 2, and the rear surface of the resin-sealed semiconductor device 1 is engaged with or fitted to the projections 2g and 2h at the time of mounting. Provided recesses 1f, 1g
Is newly provided. The stamps 2g, 2h and the recesses 1f, 1g constitute positioning means. The mounting hole 1e, the first opening 3a and the screw hole 2f are
The insulating heat conductive spacer 3 is placed along the stamps 2a to 2e, and the resin-sealed semiconductor device 1 is further arranged so that the stamps 2g, 2h and the recesses 1f, 1g are engaged or fitted.
Are arranged so as to coincide with each other.

[0015] Next, a description is given of a method of assembling the semiconductor device of the first embodiment. First, as shown in FIG.
The insulating heat conductive spacer 3 is placed along a to 2e.
Next, the recesses 1 f and 1 g provided on the back surface of the resin-encapsulated semiconductor device 1 are formed by embossing 2 g and 2
h, the resin-encapsulated semiconductor device 1 is mounted. The screw 4 is attached to the mounting hole 1 e of the resin-sealed semiconductor device 1 and the first opening 3 of the insulating heat conductive spacer 3.
a and is screwed into the screw hole 2 f of the heat sink 2.

At this time, even if a stress in the rotational direction of the screw 4 is applied to the resin-encapsulated semiconductor device 1, the resin-encapsulated semiconductor device 1 still has the recesses 1f, 1g and the projections 2g,
Positioning is performed by 2f and there is no displacement. Therefore, the resin-sealed semiconductor device 1 can be accurately positioned and fixed to the heat sink 2.

Embodiment 2 FIG . In the above embodiment, the position of the positioning means may be different depending on the resin-sealed semiconductor device to be mounted. This can prevent incorrect mounting of the resin-sealed semiconductor device. Examples of different installation positions include different intervals between the launches 2g and 2h. Needless to say, in the case of changing the installation position of the launch it is also changing the installation position of the recessed portions corresponding thereto.

Embodiment 3 FIG . In the above embodiment, launch, is provided with the concave portion 2 sets,
These may be one set. That is, in the first embodiment, the resin-encapsulated semiconductor device 1 includes the screw 4
g and recess 1g, or screw 4 and punch 2h and recess 1
Positioning is performed at two points of f, so there is no displacement.
No.

[0019]

Since the present invention is configured as described above, it has the following effects.

A semiconductor that does not shift when a semiconductor device is mounted with screws, and that can simultaneously position a semiconductor device, an insulating heat conducting member, and a heat radiating member.
A device can be obtained. In addition, the configuration is simple, and
High-density mounting is possible.

[0021] Since with different installation positions of the positioning means for each semiconductor device, without misalignment when mounting the semiconductor device on the screw, yet is not possible to attach the wrong semiconductor device.

[Brief description of the drawings]

FIG. 1 is a rear view of a resin-encapsulated semiconductor device according to Embodiment 1 of the present invention.

FIG. 2 is a plan view in which an insulating heat conductive spacer is mounted on a heat sink according to the first embodiment of the present invention.

FIG. 3 is a plan view of the semiconductor device according to the first embodiment of the present invention.

FIG. 4 is a side view of the semiconductor device according to the first embodiment of the present invention.

FIG. 5 is a side view of a conventional semiconductor device.

FIG. 6 is an exploded view of a conventional semiconductor device.

FIG. 7 is an assembly view of a general semiconductor device.

FIG. 8 is a plan view of a conventional semiconductor device .

[Explanation of symbols]

REFERENCE SIGNS LIST 1 resin-encapsulated semiconductor device 1 a to 1 c lead terminal 1 d primary heat sink 1 e mounting hole 1 f, 1 g recess 1 j, 1 k recess 2 heat sink 2 a to 2 e punch 2 f screw hole 2 g, 2 h punch 3 insulating heat conductive spacer 3 a first opening 4 root Ji

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor: Mitsuru Koiwa 840 Chiyoda-cho, Himeji City Mitsubishi Electric Corporation Himeji Works (56) References JP, U)

Claims (2)

(57) [Claims] 1. A heat radiating member having a screw hole , a semiconductor device having a mounting hole corresponding to the screw hole , mounted on the heat radiating member, and a first opening corresponding to the screw hole. An insulating heat conducting member interposed between the heat dissipating member and the semiconductor device to conduct heat generated from the semiconductor device to the heat dissipating member and electrically insulate the heat dissipating member from the semiconductor device And the semiconductor device
Is provided within a range in which the heat radiation member is mounted .
Between the convex portion formed and the concave portion provided in the semiconductor device.
Comprising a positioning means for positioning said and said heat radiating member semiconductor device by coupling, and a screw member extending through the mounting hole and the first opening is engaged with the screw hole, the insulating heat conducting The member has a straight end
The end of the heat dissipating member contacts the convex portion of the heat dissipating member.
Match the first opening, the mounting hole and the screw hole
A semiconductor device characterized in that positioning is performed by the following . 2. The positioning device according to claim 1 , wherein the positioning means is provided for each semiconductor device.
2. The installation position of the device is changed.
Semiconductor device.