JPH01135054A - Semiconductor device - Google Patents

Abstract

PURPOSE:To mount a semiconductor device on a radiation fin firmly and closely with good thermal conductivity by fitting protrusions formed on a metal substrate to be brought into contact with a radiation fin, to recesses of the radiation fin formed corresponding thereto. CONSTITUTION:Groove shaped uniform recesses 9 are provided on a surface of a radiation fin 8 whereon a metal substrate 2 of a semiconductor device 1 is fixed so that they fit to protrusions 7 formed on the metal substrate 2. Protrusions 7 of a metal substrate 2 of a semiconductor device 1 are fitted to the recesses 9 of the radiation fin 8 by sliding from a side of the radiation fin. The semiconductor device can be easily mounted thereby on the radiation fin firmly in good thermal conductivity without using another component such as a screw. The absence of a fitting hole as well as a fixing section can reduce the size of the semiconductor device 1 as much.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor devices such as insulated power modules and power transistor modules.

[Conventional technology]

A side view of an example of this type of semiconductor device is shown in FIG. In FIG. 3, the semiconductor device 1 is in a state in which semiconductor chips and other electrical components are electrically insulated.

For example, a resin molded case 3 is bonded to a metal substrate 2 that is fixed via an insulating plate (these are not shown), and the mounting is done so that the outer surface of the metal substrate 2 contacts the heat dissipation fins through holes 4. It is attached and used using screws.

[Problem that the invention seeks to solve]

In the conventional semiconductor device as described above, it is necessary to provide a mounting portion 6 for attaching the semiconductor device to the heat dissipation fin with screws, which increases the size of the semiconductor device and the mounting area. . In addition, the number of parts required for installation is large, including screws, spring washers, and flat washers, and the installation requires a large number of man-hours.

The present invention eliminates the above-mentioned drawbacks, and provides a semiconductor device that can be miniaturized by eliminating parts for attachment to a heat dissipation fin, and that can be easily attached to the heat dissipation fin without using parts such as screws. The purpose is to

[Means for solving problems]

In order to achieve the above object, the present invention provides a semiconductor device in which a semiconductor piece is insulated and fixed to one main surface of a flat metal substrate, and a radiation fin is attached to the other main surface. A semiconductor device is provided in which a protrusion that engages with a recess of a radiation fin is formed on the other main surface of a metal substrate.

[Effect]

As described above, by engaging the protrusion formed on the surface of the metal substrate that is to be brought into contact with the heat dissipation fin of the semiconductor device into the corresponding recess of the heat dissipation fin, the semiconductor device can be attached to a screw, etc. It can be firmly and closely attached to the radiation fin with good thermal conductivity without using separate parts.

〔Example〕

FIG. 1 shows a side view of a semiconductor device according to an embodiment of the present invention, and parts common to those of the conventional example shown in FIG. 3 are given the same numbers. In FIG. 1, a semiconductor device 1 is a metal substrate 2 on which semiconductor pieces, electrode plates, and other electrical parts (not shown) are fixed via an insulating plate, and a resin molded case is constructed to house these fixed parts. are joined together, and an external lead-out terminal 5 is led out from the upper surface of the case. Two protrusions 7 according to the present invention are formed on the lower surface of the metal substrate 2 in a trapezoidal cross section and in the form of ridges in a direction perpendicular to the plane of the paper.

FIG. 2 is a side view of a main part of the radiation fin to which the semiconductor device shown in FIG. A groove-shaped recess 9 having the same shape is formed so that the protrusion 7 that is formed in the recess 9 is engaged with the protrusion 7 .

The protrusion 7 of the metal substrate 2 of the semiconductor device 1 is slid from the side of the heat dissipation fin 8 into the recess 9 of the heat dissipation fin 8.
By engaging with the semiconductor device, the semiconductor device can be easily attached to the radiation fin firmly and in a state with good heat conduction without using separate parts such as screws. Furthermore, in this case, not only the mounting hole 4 shown in FIG. 3 but also the mounting portion 6 are not required, so that the semiconductor device 1 is made smaller accordingly, as seen in FIG. 1.

It goes without saying that the shape and number of the protrusions on the metal substrate in the present invention, and therefore the number and shape of the recesses on the surface of the radiation fins formed correspondingly, are not limited to those of this embodiment.

〔Effect of the invention〕

According to the present invention, a protrusion is formed on the surface of the metal substrate of the semiconductor device that comes into contact with the heat dissipation fin, and the semiconductor device is firmly attached to the heat dissipation fin with good thermal conductivity using the protrusion of the metal substrate. In this way, it is unnecessary to separately form a mounting section with holes for mounting a heat sink on a semiconductor device such as an insulated power module as in the past, and the semiconductor device can be made smaller. Furthermore, parts such as screws for attachment are no longer required, and by engaging the protrusion of the metal substrate with the recess on the surface of the radiation fin, the semiconductor device can be easily attached to the radiation fin with less man-hours.

[Brief explanation of the drawing]

FIG. 1 is a side view of a semiconductor device according to an embodiment of the present invention, and FIG.
The figure is a side view of a main part of a radiation fin to which the semiconductor device of FIG. 1 is attached, and FIG. 3 is a side view of a conventional semiconductor device. 1 semiconductor element, 2 metal substrate, 7 protrusion. Figure 2

Claims (1)

[Claims] (1) In a semiconductor device in which a semiconductor piece is insulated and fixed to one principal surface of a flat metal substrate, and a radiation fin is attached to the other principal surface, a recess of the radiation fin is provided on the other principal surface of the metal substrate. A semiconductor device characterized in that a protrusion is formed to engage with the semiconductor device.