JP4329961B2 - Composite semiconductor device - Google Patents

Composite semiconductor device Download PDF

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JP4329961B2
JP4329961B2 JP32373199A JP32373199A JP4329961B2 JP 4329961 B2 JP4329961 B2 JP 4329961B2 JP 32373199 A JP32373199 A JP 32373199A JP 32373199 A JP32373199 A JP 32373199A JP 4329961 B2 JP4329961 B2 JP 4329961B2
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control terminal
circuit board
semiconductor device
resin case
insulating resin
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JP2001144249A (en
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三郎 森
永吾 福田
力 早坂
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日本インター株式会社
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

PROBLEM TO BE SOLVED: To connect a control terminal with a control circuit substrate, without making any soldering operation at all. SOLUTION: A control terminal stand 16 is formed in the part of a side wall of an insulation resin case 2, and an insert mold is performed, so as to expose an upper end part 4b and a lower end part 4a to this control terminal stand 16, and a control circuit substrate 7 is engaged with a pedestal 13 provided at a top end part of the control terminal stand 16 by spring action, whereby the conductor part of the control circuit substrate 7 is brought into pressure contact with the upper end part of the control terminal 4.

Description

【０００１】
本発明は、複合半導体装置に関し、特にその内部の半導体素子から引き出された制御端子と、制御回路基板との接続構造を改良した複合半導体装置に関するものである。
【０００２】
【従来の技術】
この種、複合半導体装置の構造例を図９乃至図１１に示す。
なお、図９は制御回路基板を取り外した状態の複合半導体装置の概略構造を示す平面図、図１０は図９のＣ−Ｃ線に沿う断面図、図１１は制御回路基板を取り付けた状態の複合半導体装置の正面図である。
【０００３】
これらの図において、複合半導体装置１は両端開口の絶縁樹脂ケース２を備え、この絶縁樹脂ケース２の一方の開口端を閉塞するように放熱板３を有している。該放熱板３上には図示を省略した電気回路基板が固着され、この電気回路基板上に例えば、ＩＧＢＴ、ＭＯＳ ＦＥＴ、サイリスタ、トランジスタ等の半導体素子が単体、あるいはモジュールとして搭載されている。
【０００４】
上記絶縁樹脂ケース２の側壁内には制御端子４がインサートモールドされ、制御端子４の上端は絶縁樹脂ケース２の上部から外部に露出し、制御端子の下端は絶縁樹脂ケース２の内部に露出している（図示省略）。この制御端子４の下端の露出端部と上記半導体素子とはボンディングワイヤによって接続されている（図示省略）。
【０００５】
また、上記絶縁樹脂ケース２の側壁内には、主端子５が上記制御端子４と同様にインサートモールドされている。この主端子５の上端及び下端も上記制御端子４と同様に外部に露出しており、その下端は電気回路基板の導体パターンとボンディングワイヤによって接続されている（図示省略）。
【０００６】
絶縁樹脂ケース２の上面四隅には円柱状のねじ止め台６が設けられ、このねじ止め台６に制御回路基板７がねじ止めされる。
【０００７】
すなわち、図１１に示すように、制御回路基板７の透孔（図示省略）に制御端子４の一端を挿通し、制御回路基板７の上面又は下面に形成した導体パターンと半田８によって固着させるとともに、ねじ９により制御回路基板７がねじ止め台６にねじ止めされている。
【０００８】
なお、主端子５の上面には予め外部導体バー１０が取り付けられ、絶縁樹脂ケース２の上面と制御回路基板７の下面との間に形成された間隙１１から水平方向に引き出される構造となっている。
【０００９】
【発明が解決しようとする課題】
従来の複合半導体装置１は、上記のような構造を有しているため、次のような解決すべき課題があった。
▲１▼制御端子４と制御回路基板７とを接続するのに半田付けを行なっているため、フラックス等の影響、接続不良等で複合半導体装置自体の信頼性に難があった。
▲２▼半田付け作業等、組立て作業が煩雑で工数がかかり、製造コストの低減が困難であった。
本発明は、上記の課題を解決するためになされたもので、半田付け作業を一切なくし、高信頼性を維持でき、かつ、製造コストを安価にし得る複合半導体装置を提供することを目的とするものである。
【００１０】
【課題を解決するための手段】
請求項１に記載の発明によれば、絶縁樹脂ケース（２）の一方の開口部を閉塞するように絶縁樹脂ケース（２）を放熱板（３）上に固定し、
放熱板（３）上に電気回路基板（１８）が搭載され、
電気回路基板（１８）の導体パターン上に電子部品（１９）を搭載して電気回路が形成され、
電気回路から主端子（５）及び制御端子（４）が引き出される構造の複合半導体装置（１）において、
制御端子（４）の下端部（４ａ）の一部が絶縁樹脂ケース（２）の側壁下端部から露出するように、かつ、制御端子（４）の上端部（４ｂ）が絶縁樹脂ケース（２）の側壁上端部から露出するように、制御端子（４）がインサートモールドされ、
放熱板（３）と所定の間隔を隔てて配置された制御回路基板（７）の導体部と制御端子（４）の上端部（４ｂ）とを、制御端子（４）と一体的に形成された蛇腹状ばね部（１７）によって弾性的に加圧接触させたことを特徴とする複合半導体装置（１）が提供される。
【００１１】
請求項２に記載の発明によれば、絶縁樹脂ケース（２）の一方の開口部を閉塞するように絶縁樹脂ケース（２）を放熱板（３）上に固定し、
放熱板（３）上に電気回路基板（１８）が搭載され、
電気回路基板（１８）の導体パターン上に電子部品（１９）を搭載して電気回路が形成され、
電気回路から主端子（５）及び制御端子（４）が引き出される構造の複合半導体装置（１）において、
制御端子（４）の下端部（４ａ）の一部が絶縁樹脂ケース（２）の側壁下端部から露出するように、かつ、制御端子（４）の上端部（４ｂ）が絶縁樹脂ケース（２）の側壁上端部から露出するように、制御端子（４）がインサートモールドされ、
放熱板（３）と所定の間隔を隔てて配置された制御回路基板（７）の導体部と制御端子（４）の上端部（４ｂ）とを、制御端子（４）とは別材によって形成されたコイルばねを介して加圧接触させたことを特徴とする複合半導体装置（１）が提供される。
【００１２】
請求項３に記載の発明によれば、絶縁樹脂ケース（２）の側壁の一部が、制御回路基板（７）を受け、かつ、固定する台座部（１３）と、制御端子（４）の上端部（４ｂ）を収納する収納部（１４）と、制御端子（４）の下端部（４ａ）をインサートモールドする制御端子モールド部（１５）とから成る制御端子台（１６）として構成されていることを特徴とする請求項１に記載の複合半導体装置（１）が提供される。
【００１３】
請求項４に記載の発明によれば、制御端子台（１１６）上に載置される制御回路基板（７）が、制御端子（４）の先端部（４ｂ）と接触すると共に、制御端子台（１１６）の上面に挿入されたばね止め材（２７）によって上方から押圧固定されることを特徴とする請求項１に記載の複合半導体装置（１）が提供される。
【００１４】
請求項５に記載の発明によれば、制御端子（４）の上端部（４ｂ）を収納する収納部（１４）が、互いに相補形状をなす本体部（２１）と補助板部（２２）とを組み合わせることによって構成されていることを特徴とする請求項１，３，４のいずれか一項に記載の複合半導体装置（１）が提供される。
【００１７】
【実施例】
以下に本発明の実施例を、図を参照して説明する。
図１は、制御回路基板を取り外した状態の本発明の複合半導体装置の平面図、図２は図１のＡ−Ａ線に沿う断面図である。
本発明では、半導体素子の表面電極とボンディングワイヤを介して外部へ引き出す制御端子と制御回路基板との半田付けをなくするため、該制御回路基板を制御端子台の台座部にスプリングアクションを利用して固定する際に、該制御端子と制御回路基板の導体部とが加圧接触するようにしたことを特徴とするものである。
【００１８】
以下に、本発明の実施例を詳細に説明する。本発明の複合半導体装置１では、従来と同様に、絶縁樹脂ケース２の一方の開口部が閉塞されるように、絶縁樹脂ケース２が放熱板３上に固定される。上記放熱板上３には、電気回路基板（図示省略）が搭載され、その導体パターン上に半導体素子等の電子部品が固着されて回路が形成され、該回路からボンディングワイヤを介して主端子５及び制御端子４が引き出される構造となっている。
【００１９】
前記制御端子４は、前記絶縁樹脂ケース２の側壁下端部から該制御端子４の下端部４ａが露出するように、また、前記絶縁樹脂ケース２の側壁上端部から該制御端子４の上端部４ｂが露出するようにインサートモールドされている。
【００２０】
上記主端子５も前記制御端子４と同様に、前記絶縁樹脂ケース２の側壁にその両端部が露出するようにインサートモールドされている。
すなわち、主端子５の下端部５ａは、絶縁樹脂ケース２の側壁下端部から露出するように、また、主端子５の上端部５ｂは絶縁樹脂ケース２の側壁上端部から露出するようにインサートモールドされている。
そして、前記上端部５ｂの直下部には袋ナット１２が収納され、該上端部５ｂが直角に折り曲げられることにより該袋ナット１２の抜け出しを防止する構造となっている。
【００２１】
なお、上記実施例では、主端子５を絶縁樹脂ケース２の側壁にインサートモールドしたが、該主端子５は必ずしもインサートモールドする必要はなく、導体パターンから直接引き出すようにしても良い。
【００２２】
前記制御端子４の上端部４ｂは、絶縁樹脂ケース２の上方に前記放熱板３と所定の間隙１１を隔てて配置された制御回路基板７の導体部（図示省略）に、後述する弾性手段を介して加圧接触せしめられる。
【００２３】
すなわち、図３に示すように、前記絶縁樹脂ケース２の側壁の一部に制御端子台１６を形成する。この制御端子台１６は、前記制御回路基板７を受け、かつ、固定する台座部１３と、前記制御端子４の上端部４ｂを収納する収納部１４と、前記制御端子４の下端部４ａが露出するようにインサートモールドする制御端子モールド部１５とから成る。
【００２４】
上記制御端子台１６の収納部１４内には、制御端子４の上端部４ｂが収納されるが、該上端部４ｂ自体を弾性手段、すなわち、この実施例では蛇腹状ばね１７又はコイルばね（図示省略）とする。
【００２５】
なお、上記弾性手段は、制御端子４とは別材から成るコイルばね等とし、これを収納部１４内に収納するようにしても良い。
【００２６】
上記制御端子台１６の収納部１４内に上端部４ｂが収納され、下端部４ａがインサートモールドされた制御端子４の露出端部は、図３に示すように、放熱板３上の電気回路基板１８上に載置・固定された半導体チップ１９の表面電極とボンディングワイヤ２０により結線される。
また、上端部４ｂと一体となった弾性手段としての蛇腹状ばね１７を収納する収納部１４を樹脂モールドにより一体形成するのは困難であるため、２分割構成とし、補助板部２２を組み合わせるようにしている。
なお、図４は制御端子台１６を上部から見た図であり、図３と同一部分には同一符号が付してある。
【００２７】
次に、図５乃至図７を参照して、制御端子４を制御回路基板７に、いわゆる半田レスで接続する手順を説明する。なお、図５は制御回路基板と制御端子台との係止状態を示す部分断面図、図６は複合半導体装置全体の平面図、図７は図６のＢ−Ｂ線に沿う断面図である。また、制御回路基板７の下面側には、図示を省略したが、所定の導体パターンが形成され、抵抗、コンデンサ等の各種の電気回路部品が搭載固着されている。
【００２８】
上記制御回路基板７の導体パターンが形成された面を下向きにして、制御回路基板７の端部を、台座部１３の傾斜頭部１３ａに沿って滑らせ、該台座部１３内に該台座部１３のスプリングアクションを利用して挿入固定する。
【００２９】
このようにすることにより、制御端子台１６の収納部１４の上端からは制御端子４の先端部が外部に露出しているので、該露出端部を蛇腹状ばね１７のばね力に抗して制御回路基板７が下方に押圧し、該制御回路基板７の導体部と前記制御端子４とがいわゆる半田レスにより電気的に加圧接触する。
【００３０】
最後に、絶縁樹脂ケース２の側壁周縁に設けたねじ止め台６に制御回路基板７の上面側からねじ９をねじ込み、制御回路基板７の固定を確実にする。なお、上記制御回路基板７を制御端子台１６に取り付ける前に、図６及び図７に示すように、複合半導体装置１の水平方向に引き出される外部導体バー１０を主端子５に対して固定しておく。
【００３１】
以上の構成により、制御端子４と制御回路基板７の導体部とが、半田付けすることなく電気的に接続でき、半田付け作業に伴う悪影響を回避でき、高信頼性で、かつ、組立工数の低減により製造コストの安価な複合半導体装置が得られる。
【００３２】
次に、制御端子台の他の実施例を、図８を参照して説明する。
この実施例の制御端子台１１６は、前記実施例と同様に２分割構成の本体部２１と、補助板部２２とから成り、互いに相補形状をなしているが、先の実施例のように頭部に台座部（図３参照）を有していない。
【００３３】
また、前記同様、本体部２１の段部２３に複数（図では３個）の制御端子４の下部がインサートモールドされている。さらに、上記本体部２１には有底孔２４ａ,２４ｂ,２４ｃが設けられている。
【００３４】
一方、前記有底孔２４ａ,２４ｂ,２４ｃに対応して前記補助板部２２の対向面には突起部２５ａ,２５ｂ,２５ｃが設けられ、この突起部２５ａ,２５ｂ,２５ｃを前記有底孔２４ａ,２４ｂ,２４ｃに嵌合させることで、本体部２１と補助板部２２とが一体となった制御端子台１１６を構成するようになっている。
【００３５】
また、補助板部２２には凹陥部２６が形成され、該補助板部２２が前記本体部２１と組み合わせられたときに、該凹陥部２６が制御端子４の上部に形成された弾性手段としての蛇腹状ばね１７の収納部１４となる。
【００３６】
上記本体部２１の上端部には、ばね止め材２７の脚部２８が挿入固定される有底孔２９が設けられている。次に、上記制御端子台１１６に対して、制御回路基板７の係止手順を説明すると、先ず、制御端子４の上端部を若干下方に押圧するようにして制御端子台１１６の上端部に制御回路基板７を載置する。次に、その状態で、ばね止め材２７を有底孔２９に挿入固定することにより、制御回路基板７の下面側に形成した導体部（図示省略）と制御端子４の上端面が圧接する。
【００３７】
なお、制御端子４の上端部はＵ字状に折り曲げて、制御回路基板７の導体回路部との接触をスムーズにしても良い。
以上により前記実施例と同様に半田レスで、かつ、加圧接触状態で制御端子４と制御回路基板７との電気的接続が簡単な手順でなされることとなる。
【００３８】
なお、上記２つの実施例における制御端子台１６,１１６の個数には特に制限されるものではなく、絶縁樹脂ケース２の側壁に複数箇所設けるものであれば、そのいずれれも適用することができる。
【００３９】
【発明の効果】
本発明は、上記のように構成したので、制御端子と制御回路基板とを半田付けすることなく簡単な手順で接続することができ、信頼性の高い複合半導体装置が組立工数を少なくして安価に得られる。
【図面の簡単な説明】
【図１】制御回路基板を取り外した状態の本発明の複合半導体装置の平面図である。
【図２】図１のＡ−Ａ線に沿う断面図である。
【図３】制御端子台の一例を示す部分断面図である。
【図４】上記制御端子台の部分平面図である。
【図５】上記制御端子台に制御回路基板を取り付けた状態の部分断面図である。
【図６】本発明の複合半導体装置全体を示す平面図である。
【図７】図６におけるＢ−Ｂ線に沿う断面図である。
【図８】制御端子台の他の実施例を示す斜視図である。
【図９】制御回路基板を取り外した状態の従来の複合半導体装置の概略構造を示す平面図である。
【図１０】図９のＣ−Ｃ線に沿う断面図である。
【図１１】制御回路基板を取り付けた状態の従来の複合半導体装置の一部を示す正面図である。
【符号の説明】
１ 複合半導体装置
２ 絶縁樹脂ケース
３ 放熱板
４ 制御端子
５ 主端子
６ ねじ止め台
７ 制御回路基板
８ 半田付け
９ ねじ
１０ 外部導体バー
１１ 間隙
１２ 袋ナット
１３ 台座部
１３ａ 傾斜頭部
１４ 収納部
１５ 制御端子モールド部
１６，１１６ 制御端子台
１７ 蛇腹状ばね
１８ 電気回路基板
１９ 半導体チップ
２０ ボンディングワイヤ
２１ 本体部
２２ 補助板部
２３ 段部
２４ａ,２４ｂ,２４ｃ 有底孔
２５ａ，２５ｂ，２５ｃ 突起部
２６ 凹陥部
２７ ばね止め材
２８ 脚部
２９ 有底孔[0001]
The present invention relates to a composite semiconductor device, and more particularly to a composite semiconductor device having an improved connection structure between a control terminal drawn from a semiconductor element inside the composite semiconductor device and a control circuit board.
[0002]
[Prior art]
Structural examples of this type of composite semiconductor device are shown in FIGS.
9 is a plan view showing a schematic structure of the composite semiconductor device with the control circuit board removed, FIG. 10 is a sectional view taken along the line CC of FIG. 9, and FIG. 11 is a state with the control circuit board attached. It is a front view of a composite semiconductor device.
[0003]
In these drawings, the composite semiconductor device 1 includes an insulating resin case 2 having openings at both ends, and has a heat radiating plate 3 so as to close one opening end of the insulating resin case 2. An electric circuit board (not shown) is fixed on the heat radiating plate 3, and semiconductor elements such as IGBTs, MOS FETs, thyristors, and transistors are mounted on the electric circuit board as a single unit or as a module.
[0004]
The control terminal 4 is insert-molded in the side wall of the insulating resin case 2, the upper end of the control terminal 4 is exposed to the outside from the upper part of the insulating resin case 2, and the lower end of the control terminal is exposed to the inside of the insulating resin case 2. (Not shown). Are connected by the bonding wire and the exposed end portion and the semiconductor element at the lower end of the control pin 4 (not shown).
[0005]
The main terminal 5 is insert-molded in the side wall of the insulating resin case 2 in the same manner as the control terminal 4. The upper and lower ends of the main terminals 5 are also exposed to the outside similarly to the control terminal 4, its lower end is connected by the conductor pattern of the electric circuit board and the bonding wire (not shown).
[0006]
Cylindrical screw mounts 6 are provided at the four corners of the upper surface of the insulating resin case 2, and the control circuit board 7 is screwed to the screw mounts 6.
[0007]
That is, as shown in FIG. 11, one end of the control terminal 4 is inserted into a through hole (not shown) of the control circuit board 7 and fixed with a conductor pattern formed on the upper or lower surface of the control circuit board 7 and the solder 8. , the control circuit board 7 is screwed to the screwed base 6 by screws 9.
[0008]
In addition, an external conductor bar 10 is attached to the upper surface of the main terminal 5 in advance, and is structured to be drawn out horizontally from a gap 11 formed between the upper surface of the insulating resin case 2 and the lower surface of the control circuit board 7. Yes.
[0009]
[Problems to be solved by the invention]
Since the conventional composite semiconductor device 1 has the above-described structure, there are the following problems to be solved.
{Circle around (1)} Since the soldering is performed to connect the control terminal 4 and the control circuit board 7, the reliability of the composite semiconductor device itself is difficult due to the influence of flux and poor connection.
(2) Assembling work such as soldering work is complicated and time-consuming, and it is difficult to reduce the manufacturing cost.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a composite semiconductor device that can eliminate soldering work, maintain high reliability, and reduce manufacturing costs. Is.
[0010]
[Means for Solving the Problems]
According to the invention described in claim 1, the insulating resin case (2) is fixed on the heat sink (3) so as to close one opening of the insulating resin case (2),
An electric circuit board (18) is mounted on the heat sink (3),
An electronic circuit (19) is mounted on the conductor pattern of the electric circuit board (18) to form an electric circuit,
In the composite semiconductor device (1) having a structure in which the main terminal (5) and the control terminal (4) are drawn from the electric circuit,
A part of the lower end (4a) of the control terminal (4) is exposed from the lower end of the side wall of the insulating resin case (2), and the upper end (4b) of the control terminal (4) is exposed to the insulating resin case (2 The control terminal (4) is insert-molded so as to be exposed from the upper end of the side wall of
The conductor part of the control circuit board (7) and the upper end part (4b) of the control terminal (4) arranged at a predetermined interval from the heat radiating plate (3) are integrally formed with the control terminal (4). There is provided a composite semiconductor device (1) characterized by being elastically pressed and contacted by the bellows-like spring portion (17).
[0011]
According to the invention of claim 2, the insulating resin case (2) is fixed on the heat sink (3) so as to close one opening of the insulating resin case (2),
An electric circuit board (18) is mounted on the heat sink (3),
An electronic circuit (19) is mounted on the conductor pattern of the electric circuit board (18) to form an electric circuit,
In the composite semiconductor device (1) having a structure in which the main terminal (5) and the control terminal (4) are drawn from the electric circuit,
A part of the lower end (4a) of the control terminal (4) is exposed from the lower end of the side wall of the insulating resin case (2), and the upper end (4b) of the control terminal (4) is exposed to the insulating resin case (2 The control terminal (4) is insert-molded so as to be exposed from the upper end of the side wall of
The conductor part of the control circuit board (7) and the upper end part (4b) of the control terminal (4) arranged at a predetermined interval from the heat radiating plate (3) are formed of different materials from the control terminal (4). There is provided a composite semiconductor device (1) characterized in that it is brought into pressure contact via a coil spring formed.
[0012]
According to the invention described in claim 3, a part of the side wall of the insulating resin case (2) receives and fixes the control circuit board (7), and the control terminal (4) The control terminal block (16) is composed of a storage part (14) for storing the upper end part (4b) and a control terminal mold part (15) for insert molding the lower end part (4a) of the control terminal (4). A composite semiconductor device (1) according to claim 1 is provided.
[0013]
According to the fourth aspect of the present invention, the control circuit board (7) placed on the control terminal block (116) is in contact with the front end (4b) of the control terminal (4), and the control terminal block (4). The composite semiconductor device (1) according to claim 1, wherein the composite semiconductor device (1) is pressed and fixed from above by a spring stopper (27) inserted on an upper surface of (116).
[0014]
According to the fifth aspect of the present invention, the storage portion (14) for storing the upper end portion (4b) of the control terminal (4) includes the main body portion (21) and the auxiliary plate portion (22) which are complementary to each other. A composite semiconductor device (1) according to any one of claims 1, 3, and 4 is provided.
[0017]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view of the composite semiconductor device of the present invention with the control circuit board removed, and FIG. 2 is a cross-sectional view taken along the line AA of FIG.
In the present invention, in order to eliminate the soldering of the control circuit board and the control terminal drawn out to the outside through the surface electrode of the semiconductor element and the bonding wire, the control circuit board is used as a pedestal portion of the control terminal block. In this case, the control terminal and the conductor portion of the control circuit board are in pressure contact with each other.
[0018]
Examples of the present invention will be described in detail below. The composite semiconductor device 1 of the present invention, as with traditional, as one opening of the insulating resin case 2 is closed, the insulating resin case 2 is fixed on the heat dissipation plate 3. The aforementioned heat radiating board 3, is an electric circuit board (not shown) is mounted, the electronic component is fixed circuit such as a semiconductor element on a conductor pattern is shape formed, main terminals through bonding wires from the circuit 5 and the control terminal 4 are drawn out.
[0019]
The control terminal 4 is exposed such that the lower end portion 4a of the control terminal 4 is exposed from the lower end portion of the side wall of the insulating resin case 2, and the upper end portion 4b of the control terminal 4 from the upper end portion of the side wall of the insulating resin case 2. Is insert-molded so as to be exposed.
[0020]
Similarly to the control terminal 4, the main terminal 5 is insert-molded so that both ends thereof are exposed on the side wall of the insulating resin case 2.
That is, the insert molding is performed so that the lower end portion 5 a of the main terminal 5 is exposed from the lower end portion of the side wall of the insulating resin case 2, and the upper end portion 5 b of the main terminal 5 is exposed from the upper end portion of the side wall of the insulating resin case 2. Has been.
A cap nut 12 is housed immediately below the upper end portion 5b, and the upper end portion 5b is bent at a right angle to prevent the cap nut 12 from coming off.
[0021]
In the above embodiment, the main terminal 5 is insert-molded on the side wall of the insulating resin case 2. However, the main terminal 5 does not necessarily need to be insert-molded, and may be drawn directly from the conductor pattern.
[0022]
The upper end 4b of the control terminal 4, the conductor portion of the control circuit board 7 which is arranged at the radiating plate 3 and predetermined between gap 11 above the insulating resin case 2 (not shown), which will be described later resilient means Ru is contacted under pressure through.
[0023]
That is, as shown in FIG. 3, the control terminal block 16 is formed on a part of the side wall of the insulating resin case 2. The control terminal block 16 receives the control circuit board 7 and fixes the pedestal portion 13, the storage portion 14 for storing the upper end portion 4 b of the control terminal 4, and the lower end portion 4 a of the control terminal 4 exposed. And a control terminal mold part 15 for insert molding.
[0024]
The upper end portion 4b of the control terminal 4 is accommodated in the accommodating portion 14 of the control terminal block 16, and the upper end portion 4b itself is elastic means, that is, in this embodiment, a bellows-like spring 17 or a coil spring (illustrated). (Omitted).
[0025]
The elastic means may be a coil spring or the like made of a different material from the control terminal 4 and stored in the storage portion 14.
[0026]
The exposed end portion of the control terminal 4 in which the upper end portion 4b is accommodated in the accommodating portion 14 of the control terminal block 16 and the lower end portion 4a is insert-molded is an electric circuit board on the heat sink 3 as shown in FIG. The surface electrode of the semiconductor chip 19 placed and fixed on the substrate 18 is connected to the bonding wire 20.
Further, since it is difficult to integrally form the storage portion 14 for storing the bellows-like spring 17 as an elastic means integrated with the upper end portion 4b by a resin mold, a two-part configuration is used and the auxiliary plate portion 22 is combined. I have to.
FIG. 4 is a view of the control terminal block 16 as viewed from above, and the same parts as those in FIG.
[0027]
Next, a procedure for connecting the control terminal 4 to the control circuit board 7 without soldering will be described with reference to FIGS. Note that FIG. 5 is a partial sectional view showing a locking state between the control terminal board and the control circuit board, Figure 6 is a sectional view taken along a plan view of the entire composite semiconductor device, FIG. 7 is a line B-B in FIG. 6 . Although not shown, a predetermined conductor pattern is formed on the lower surface side of the control circuit board 7, and various electric circuit components such as resistors and capacitors are mounted and fixed thereon.
[0028]
The end of the control circuit board 7 is slid along the inclined head 13a of the pedestal part 13 with the surface of the control circuit board 7 on which the conductor pattern is formed facing downward, and the pedestal part is inserted into the pedestal part 13 Insert and fix using 13 spring actions.
[0029]
By doing in this way, since the front-end | tip part of the control terminal 4 is exposed outside from the upper end of the accommodating part 14 of the control terminal block 16, this exposed end part resists the spring force of the bellows-like spring 17. The control circuit board 7 is pressed downward, and the conductor portion of the control circuit board 7 and the control terminal 4 are in electrical pressure contact without soldering.
[0030]
Finally, the screw 9 is screwed into the screw base 6 provided on the peripheral edge of the side wall of the insulating resin case 2 from the upper surface side of the control circuit board 7 to ensure the fixing of the control circuit board 7. Before attaching the control circuit board 7 to the control terminal block 16, the external conductor bar 10 drawn out in the horizontal direction of the composite semiconductor device 1 is fixed to the main terminal 5 as shown in FIGS. 6 and 7. Keep it.
[0031]
With the above configuration, the control terminal 4 and the conductor portion of the control circuit board 7 can be electrically connected without soldering, the adverse effects associated with the soldering operation can be avoided, high reliability, and the number of assembly steps can be reduced. By the reduction, a composite semiconductor device with a low manufacturing cost can be obtained.
[0032]
Next, another embodiment of the control terminal block will be described with reference to FIG.
The control terminal block 116 of this embodiment is composed of a two-part main body 21 and an auxiliary plate 22 as in the previous embodiment, and has a complementary shape to each other. Does not have a pedestal (see FIG. 3).
[0033]
Similarly to the above, the lower part of a plurality (three in the figure) of the control terminals 4 is insert-molded on the step part 23 of the main body part 21. Further, the main body portion 21 is provided with bottomed holes 24a, 24b, and 24c.
[0034]
On the other hand, corresponding to the bottomed holes 24a, 24b, 24c, protrusions 25a, 25b, 25c are provided on the opposing surface of the auxiliary plate part 22, and these protrusions 25a, 25b, 25c are connected to the bottomed holes 24a. , 24b, and 24c, the control terminal block 116 in which the main body portion 21 and the auxiliary plate portion 22 are integrated is configured.
[0035]
The auxiliary plate portion 22 is provided with a concave portion 26, and when the auxiliary plate portion 22 is combined with the main body portion 21, the concave portion 26 is formed as an elastic means formed on the upper portion of the control terminal 4. It becomes the accommodating part 14 of the bellows-like spring 17.
[0036]
A bottomed hole 29 into which the leg portion 28 of the spring stopper 27 is inserted and fixed is provided at the upper end portion of the main body portion 21. Next, a procedure for locking the control circuit board 7 with respect to the control terminal block 116 will be described. First, the upper end portion of the control terminal 4 is controlled to the upper end portion of the control terminal block 116 so as to be pressed slightly downward. The circuit board 7 is placed. Next, in this state, the spring stopper 27 is inserted and fixed in the bottomed hole 29 so that the conductor portion (not shown) formed on the lower surface side of the control circuit board 7 and the upper end surface of the control terminal 4 are in pressure contact.
[0037]
Note that the upper end portion of the control terminal 4 may be bent in a U shape to make the contact with the conductor circuit portion of the control circuit board 7 smooth.
As described above, similarly to the above embodiment, the electrical connection between the control terminal 4 and the control circuit board 7 can be performed in a simple procedure without soldering and in a pressure contact state.
[0038]
The number of the control terminal blocks 16 and 116 in the above two embodiments is not particularly limited, and any of them can be applied as long as it is provided at a plurality of locations on the side wall of the insulating resin case 2. .
[0039]
【The invention's effect】
Since the present invention is configured as described above, the control terminal and the control circuit board can be connected in a simple procedure without soldering, and a highly reliable composite semiconductor device can be manufactured at low cost by reducing the number of assembly steps. Is obtained.
[Brief description of the drawings]
FIG. 1 is a plan view of a composite semiconductor device of the present invention with a control circuit board removed.
FIG. 2 is a cross-sectional view taken along line AA in FIG.
FIG. 3 is a partial cross-sectional view showing an example of a control terminal block.
FIG. 4 is a partial plan view of the control terminal block.
FIG. 5 is a partial cross-sectional view of a state in which a control circuit board is attached to the control terminal block.
FIG. 6 is a plan view showing the entire composite semiconductor device of the present invention.
7 is a cross-sectional view taken along line BB in FIG.
FIG. 8 is a perspective view showing another embodiment of the control terminal block.
FIG. 9 is a plan view showing a schematic structure of a conventional composite semiconductor device with a control circuit board removed.
10 is a cross-sectional view taken along the line CC of FIG.
FIG. 11 is a front view showing a part of a conventional composite semiconductor device with a control circuit board attached.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Composite semiconductor device 2 Insulating resin case 3 Heat sink 4 Control terminal 5 Main terminal 6 Screw stop 7 Control circuit board 8 Solder 9 Screw 10 External conductor bar 11 Gap 12 Cap nut 13 Base part 13a Inclined head 14 Storage part 15 Control terminal mold parts 16, 116 Control terminal block 17 Bellows spring 18 Electric circuit board 19 Semiconductor chip 20 Bonding wire 21 Main body part 22 Auxiliary plate part 23 Step parts 24a, 24b, 24c Bottomed holes 25a, 25b, 25c Protrusion part 26 Recessed part 27 Spring stopper 28 Leg part 29 Bottomed hole

Claims (5)

絶縁樹脂ケース（２）の一方の開口部を閉塞するように絶縁樹脂ケース（２）を放熱板（３）上に固定し、
放熱板（３）上に電気回路基板（１８）が搭載され、
電気回路基板（１８）の導体パターン上に電子部品（１９）を搭載して電気回路が形成され、
電気回路から主端子（５）及び制御端子（４）が引き出される構造の複合半導体装置（１）において、
制御端子（４）の下端部（４ａ）の一部が絶縁樹脂ケース（２）の側壁下端部から露出するように、かつ、制御端子（４）の上端部（４ｂ）が絶縁樹脂ケース（２）の側壁上端部から露出するように、制御端子（４）がインサートモールドされ、
放熱板（３）と所定の間隔を隔てて配置された制御回路基板（７）の導体部と制御端子（４）の上端部（４ｂ）とを、制御端子（４）と一体的に形成された蛇腹状ばね部（１７）によって弾性的に加圧接触させたことを特徴とする複合半導体装置（１）。 An insulating resin case (2) so as to close the one opening of insulation resin case (2) is fixed on the heat dissipation plate (3),
Hot plate release (3) an electric circuit board on (18) are mounted,
An electrical circuit is formed by mounting electronic components (19) on the conductor pattern of the electric circuit board (18),
In the composite semiconductor device having a structure where the main terminal (5) and a control terminal (4) is pull out from the electrical circuit (1),
Control terminal as the lower end (4) is part of (4a) is exposed from the side wall lower end portion of the insulating resin case (2), and an upper end (4b) is an insulating resin case of the control terminal (4) ( The control terminal (4) is insert-molded so as to be exposed from the upper end of the side wall of 2) ,
Hot plate release (3) and integrally formed with the upper end portion and (4b), a control terminal (4) of the conductor portion and the control terminal of the control circuit board disposed at a predetermined interval (7) (4) A composite semiconductor device (1) characterized by being elastically pressed and contacted by the bellows-like spring portion (17 ) . 絶縁樹脂ケース（２）の一方の開口部を閉塞するように絶縁樹脂ケース（２）を放熱板（３）上に固定し、
放熱板（３）上に電気回路基板（１８）が搭載され、
電気回路基板（１８）の導体パターン上に電子部品（１９）を搭載して電気回路が形成され、
電気回路から主端子（５）及び制御端子（４）が引き出される構造の複合半導体装置（１）において、
制御端子（４）の下端部（４ａ）の一部が絶縁樹脂ケース（２）の側壁下端部から露出するように、かつ、制御端子（４）の上端部（４ｂ）が絶縁樹脂ケース（２）の側壁上端部から露出するように、制御端子（４）がインサートモールドされ、
放熱板（３）と所定の間隔を隔てて配置された制御回路基板（７）の導体部と制御端子（４）の上端部（４ｂ）とを、制御端子（４）とは別材によって形成されたコイルばねを介して加圧接触させたことを特徴とする複合半導体装置（１）。 Fixing the insulating resin case (2) on the heat sink (3) so as to close one opening of the insulating resin case (2);
An electric circuit board (18) is mounted on the heat sink (3),
An electronic circuit (19) is mounted on the conductor pattern of the electric circuit board (18) to form an electric circuit,
In the composite semiconductor device (1) having a structure in which the main terminal (5) and the control terminal (4) are drawn from the electric circuit,
A part of the lower end (4a) of the control terminal (4) is exposed from the lower end of the side wall of the insulating resin case (2), and the upper end (4b) of the control terminal (4) is exposed to the insulating resin case (2 The control terminal (4) is insert-molded so as to be exposed from the upper end of the side wall of
The conductor part of the control circuit board (7) and the upper end part (4b) of the control terminal (4) arranged at a predetermined interval from the heat radiating plate (3) are formed of different materials from the control terminal (4). A composite semiconductor device (1) characterized in that it is brought into pressure contact through a coil spring formed . 絶縁樹脂ケース（２）の側壁の一部が、制御回路基板（７）を受け、かつ、固定する台座部（１３）と、制御端子（４）の上端部（４ｂ）を収納する収納部（１４）と、制御端子（４）の下端部（４ａ）をインサートモールドする制御端子モールド部（１５）とから成る制御端子台（１６）として構成されていることを特徴とする請求項１に記載の複合半導体装置（１）。 Part of the side wall of the insulating resin case (2) receives and fixes the control circuit board (7) and a storage part (13) for storing the base part (13) and the upper end part (4b) of the control terminal (4). and 14), according to claim 1, characterized in that it is constituted lower end of the control terminal (4) and (4a) as a control terminal mold part for insert molding (15) from the composed control terminal block (16) Compound semiconductor device (1) . 制御端子台（１１６）上に載置される制御回路基板（７）が、制御端子（４）の先端部（４ｂ）と接触すると共に、制御端子台（１１６）の上面に挿入されたばね止め材（２７）によって上方から押圧固定されることを特徴とする請求項１に記載の複合半導体装置（１）。 The control circuit board (7) placed on the control terminal block (116) is in contact with the tip (4b) of the control terminal (4) and is inserted into the upper surface of the control terminal block (116). The composite semiconductor device (1) according to claim 1, wherein the composite semiconductor device (1) is pressed and fixed from above by (27 ) . 制御端子（４）の上端部（４ｂ）を収納する収納部（１４）が、互いに相補形状をなす本体部（２１）と補助板部（２２）とを組み合わせることによって構成されていることを特徴とする請求項１，３，４のいずれか一項に記載の複合半導体装置（１）。 The storage portion (14) for storing the upper end portion (4b) of the control terminal (4) is configured by combining a main body portion (21) and an auxiliary plate portion (22) that are complementary to each other. The composite semiconductor device (1) according to any one of claims 1, 3, and 4 .
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