JP5779066B2 - Electronic component unit - Google Patents

Description

  The present invention relates to an electronic component unit.

  In the present specification, the “specific electronic component” refers to an electronic component that belongs to a predetermined electronic component group among a plurality of electronic component groups and is attached to the case in an aligned state.

  2. Description of the Related Art Conventionally, a method for attaching a specific electronic component that is attached to a mounting surface in a state where a plurality of specific electronic components are arranged is known (for example, see Patent Document 1).

  FIG. 8 is a diagram showing an electronic component unit in which a plurality of specific electronic components are attached by a conventional method of attaching specific electronic components.

  As shown in FIG. 8, the conventional specific electronic component mounting method includes a step of positioning a plurality of specific electronic components 920 using a positioning jig (not shown) and a state in which the plurality of specific electronic components 920 are arranged. In this order, the step of attaching to the attachment surface 931, the step of fixing the plurality of specific electronic components 920 for each specific electronic component using the fixing member 950, and the step of removing the positioning jig (not shown). Including. By this method, a plurality of specific electronic components 920 can be attached to the attachment surface 931 in a state where they are arranged.

  According to the electronic component unit 900 in which the specific electronic component is mounted by the conventional specific electronic component mounting method, the plurality of specific electronic components 920 are fixed using the fixing member 950 for each specific electronic component. The specific electronic component 920 can be stably fixed to the attachment surface 931.

JP 2007-311538 A

  However, in the conventional specific electronic component mounting method, a plurality of specific electronic components 920 are fixed using the fixing member 950 for each specific electronic component, which takes time and labor, and increases productivity. Have difficulty.

  In addition, in an electronic component unit to which a plurality of specific electronic components are attached, the amount of heat generated from the plurality of specific electronic components increases as the number of specific electronic components increases. There is a risk that the amount of heat generated from the heat source will increase and the operating performance will deteriorate. For this reason, it is also an important subject to efficiently dissipate heat from the specific electronic component.

  Therefore, the present invention has been made in view of the above-described circumstances, and can fix a plurality of specific electronic components to the mounting surface with high productivity, and efficiently generate heat generated from the plurality of specific electronic components. An object is to provide an electronic component unit having a structure capable of radiating heat.

[1] An electronic component unit of the present invention belongs to a case main body for accommodating electronic components belonging to a plurality of electronic component groups for each electronic component group, and to a predetermined electronic component group among the plurality of electronic component groups. A plurality of specific electronic components, an electronic component mounting portion provided on the case body and having a mounting surface for mounting the plurality of specific electronic components in an aligned state, and in contact with the plurality of specific electronic components And a pressing plate for simultaneously fixing the plurality of specific electronic components to the mounting surface by pressing the plurality of specific electronic components.

[2] In the electronic component unit of the present invention, the mounting surface is provided with a first protrusion for positioning each specific electronic component when the plurality of specific electronic components are mounted, The electronic component is preferably attached to the attachment surface in contact with the first protrusion.

[3] In the electronic component unit of the present invention, it is preferable that the first protrusion is provided corresponding to each of the individual specific electronic components.

[4] In the electronic component unit of the present invention, it is preferable that the first protrusion is provided so that adjacent specific electronic components among the specific electronic components are shared.

[5] In the electronic component unit of the present invention, the pressing plate is provided with a second protrusion for positioning the specific electronic components when the specific electronic components are attached. The specific electronic component is preferably attached to the attachment surface in contact with the second protrusion.

[6] In the electronic component unit of the present invention, it is preferable that the second protrusion is provided corresponding to each of the specific electronic components.

[7] In the electronic component unit of the present invention, it is preferable that the second protrusion is provided so as to be shared by adjacent specific electronic components among the individual specific electronic components.

[8] In the electronic component unit of the present invention, the electronic component mounting portion includes a pedestal portion provided on the bottom surface of the case body, and a plate-like portion erected from the pedestal portion, It is preferable that the attachment surface is provided on a plate surface of the plate-like portion, and the plurality of specific electronic components are attached to the attachment surface in contact with the pedestal portion.

[9] In the electronic component unit of the present invention, it is preferable that the plate-like portion, the pedestal portion, and the case main body are integrally formed.

[10] In the electronic component unit of the present invention, the electronic component mounting portion is formed as a plate-like portion standing on the bottom surface of the case main body, and the pressing plate is formed of the plurality of specific electronic components. A third projection for positioning in a height direction from the bottom surface of the case body; and the plurality of specific electronic components are attached to the attachment surface in contact with the third projection. preferable.

  According to the electronic component unit of the present invention, since a plurality of specific electronic components can be simultaneously fixed to the mounting surface with a single pressing plate, there is no need to fix the plurality of specific electronic components for each specific electronic component. . As a result, a plurality of specific electronic components can be fixed to the mounting surface with high productivity.

  In addition, according to the electronic component unit of the present invention, since the holding plate holds down the plurality of specific electronic components in contact with the plurality of specific electronic components, the heat generated from the plurality of specific electronic components is efficiently passed through the holding plate. It is possible to dissipate heat well.

It is a figure shown in order to demonstrate the electronic component unit 100 which concerns on Embodiment 1. FIG. It is a figure shown in order to demonstrate the electronic component attachment part 130 in Embodiment 1. FIG. It is a figure shown in order to demonstrate the pressing plate 140 in Embodiment 1. FIG. FIG. 3 is a diagram for explaining a method for attaching a specific electronic component in the first embodiment. It is a figure shown in order to demonstrate the electronic component attachment part 230 in Embodiment 2. FIG. It is a figure shown in order to demonstrate the pressing plate 340 in Embodiment 3. It is a figure shown in order to demonstrate the electronic component unit 400 which concerns on Embodiment 4. FIG. It is a figure shown in order to demonstrate the conventional electronic component unit 900. FIG.

  Hereinafter, the electronic component unit and the pressing plate of the present invention will be described based on the embodiments shown in the drawings.

[Embodiment 1]
1. Configuration of Electronic Component Unit 100 According to Embodiment 1 First, the configuration of the electronic component unit 100 according to Embodiment 1 will be described.
FIG. 1 is a view for explaining an electronic component unit 100 according to the first embodiment. FIG. 1A is a perspective view of the electronic component unit 100 according to the first embodiment, and FIG. 1B is a diagram further enlarging the range indicated by A in FIG. In FIG. 1A, illustration of electronic component groups not related to the present invention is omitted.
FIG. 2 is a diagram for explaining the electronic component mounting portion 130 according to the first embodiment. 2A is a front view of the electronic component mounting portion 130 before the specific electronic component mounting step is performed, and FIG. 2B is a side view of the electronic component mounting portion 130 before the specific electronic component mounting step is performed. FIG. 2C is a front view of the electronic component mounting portion 130 after performing the specific electronic component mounting step, and FIG. 2D is an electronic component mounting after performing the specific electronic component mounting step. FIG.
FIG. 3 is a view for explaining the presser plate 140 according to the first embodiment.

  As illustrated in FIG. 1A, the electronic component unit 100 according to the first embodiment includes a case main body 110, a plurality of specific electronic components 120, an electronic component mounting portion 130, and a pressing plate 140.

  As shown in FIG. 1B, the electronic component unit 100 according to the first embodiment is mounted in a state where a plurality of specific electronic components 120 belonging to a predetermined electronic component group are arranged on the mounting surface 131, and the plurality of specific electronic components The plurality of specific electronic components 120 are simultaneously fixed to the mounting surface 131 by the pressing plate 140 while being in contact with 120.

  The case body 110 is a housing for housing electronic components belonging to a plurality of electronic component groups for each electronic component group. The case main body 110 protects the electronic device from surrounding impacts and radiates heat generated inside. As a material of the case body 110, for example, a metal such as aluminum or a plastic such as polybutylene terephthalate (PBT) can be used.

  The plurality of specific electronic components 120 belong to a predetermined electronic component group among the plurality of electronic component groups, and are attached in a line. Examples of the specific electronic component 120 include a transistor and a diode.

  As shown in FIG. 2, the electronic component mounting part 130 is provided on the case main body 110 and has a mounting surface 131 for mounting a plurality of specific electronic components 120 in a state where they are arranged. In the present embodiment, the electronic component mounting portion 130 has a pedestal portion 132 provided on the bottom surface of the case body 110 and a plate-like portion 133 erected from the pedestal portion 132, and the mounting surface 131 is a plate The plurality of specific electronic components 120 are attached to the attachment surface 131 in contact with the pedestal portion 132. The electronic component mounting part 130 has a fixing part (not shown) for fixing to the case main body 110.

  As shown in FIG. 2, the mounting surface 131 is provided with first protrusions 134 for positioning the specific electronic components 120 when the specific electronic components 120 are attached. The first protrusion 134 is attached to the attachment surface 131 in contact with the first protrusion 134. The mounting surface 131 is provided with a female screw portion 135 for fixing a presser plate 140 described later at a predetermined position.

  The first protrusion 134 is provided corresponding to each individual electronic component 120. The first protrusion 134 comes into contact with a pressing plate 140 described later when fixing the plurality of specific electronic components 120.

  As shown in FIG. 3, the holding plate 140 is made of a plate-like metal and has a screw hole 142 at a position corresponding to the female screw portion 135. While pressing the plurality of specific electronic components 120 in a state where they are in contact with the plurality of specific electronic components 120 by the holding plate 140, the screws 150 pass through the screw holes 142 and are screwed into the female screw portions 135, thereby The component 120 is fixed to the mounting surface 131 at the same time.

2. Next, a method for attaching a plurality of specific electronic components according to Embodiment 1 will be described.
FIG. 4 is a view for explaining a method of attaching the specific electronic component in the first embodiment. 4A to 4C are process diagrams.

  The method for attaching a plurality of specific electronic components in the first embodiment includes an electronic component attachment portion preparation step, a specific electronic component attachment step, and a pressing plate attachment step in this order.

(1) Electronic component attachment part preparation process First, the electronic component attachment part 130 which has the attachment surface 131, the base part 132, the plate-shaped part 133, the 1st protrusion 134, and the internal thread part 135 is prepared. In this embodiment, the electronic component attachment part 130 is made by mold molding. At this time, an attachment region corresponding to each specific electronic component 120 to be attached is installed so as to surround three sides by the two first protrusions 134 and the pedestal portion 132 (see FIG. 4A).

(2) Specific Electronic Component Attaching Step Next, the specific electronic components 120 are attached in a state where they are arranged on the attachment surface 131. Specifically, each specific electronic component 120 is attached to the attachment surface 131 in a state in which the specific electronic component 120 is in contact with the first protrusion 134 in an attachment region corresponding to each specific electronic component 120 and in contact with the pedestal portion 132 (FIG. 4B). reference.).

(3) Holding plate attachment process Next, the plurality of specific electronic components 120 are simultaneously attached to the mounting surface 131 by pressing the plurality of specific electronic components 120 in contact with the plurality of specific electronic components 120 attached in a line. Fix it. Specifically, while holding down the plurality of specific electronic components 120 with the holding plate 140, the screw 150 passes through the screw hole 142 in the holding plate 140 and is screwed into the female screw portion 135. As a result, the plurality of specific electronic components 120 are simultaneously fixed to the mounting surface 131 by the holding plate 140. (See FIG. 4C.)
In this manner, the electronic component mounting portion 130 to which the plurality of specific electronic components 120 are mounted is fixed to the case main body 110 by the fixing portion (not shown).

  Hereinafter, effects of the electronic component unit 100 according to Embodiment 1 will be described.

  According to the electronic component unit 100 according to the first embodiment, since a plurality of specific electronic components can be simultaneously fixed to the mounting surface with one pressing plate, the plurality of specific electronic components are fixed for each specific electronic component. There is no need. As a result, a plurality of specific electronic components can be fixed to the mounting surface with high productivity.

  In addition, according to the electronic component unit 100 according to the first embodiment, the pressing plate presses the heat generated from the plurality of specific electronic components in order to press the plurality of specific electronic components while being in contact with the plurality of specific electronic components. Therefore, it is possible to efficiently dissipate heat.

  In addition, since the electronic component unit 100 according to the first embodiment has the first protrusion and the pedestal portion, the plurality of specific electronic components can be positioned only by attaching the plurality of specific electronic components to a predetermined attachment region on the attachment surface. can do. As a result, it is possible to easily position a plurality of specific electronic components without using a positioning jig, and it is possible to improve workability when attaching the plurality of specific electronic components.

  Moreover, according to the electronic component unit 100 according to the first embodiment, since the first protrusion and the pedestal portion are included, the specific electronic component can be accurately positioned without using a positioning jig, and the positioning process or positioning can be performed. The process of removing the jig can be omitted. As a result, time and labor are not required, and the electronic component unit can be manufactured with higher productivity.

  In addition, according to the electronic component unit 100 according to the first embodiment, the plurality of specific electronic components are attached to the attachment surface in contact with the first protrusion and the pedestal portion, and thus generate heat generated from the plurality of specific electronic components. Heat can be efficiently radiated through the first protrusion and the pedestal.

  Further, according to the electronic component unit 100 according to the first embodiment, since the first protrusion and the pressing plate are in contact with each other, the heat conducted from the plurality of specific electronic components to the pressing plate is efficiently transmitted through the first protrusion. It is possible to dissipate heat well.

[Embodiment 2]
FIG. 5 is a diagram for explaining the electronic component mounting portion 230 according to the second embodiment. Fig.5 (a) is a front view of the electronic component attachment part 230 before implementing a specific electronic component attachment process, FIG.5 (b) is the side surface of the electronic component attachment part 230 before implementing a specific electronic component attachment process. FIG. 5C is a front view of the electronic component mounting portion 230 after performing the specific electronic component mounting step, and FIG. 5D is an electronic component mounting after performing the specific electronic component mounting step. FIG.

  The electronic component unit 200 according to the second embodiment basically has the same configuration as that of the electronic component unit 100 according to the first embodiment, but the configuration of the first protrusion is the case of the electronic component unit 100 according to the first embodiment. Different. That is, as shown in FIG. 5, the first protrusion in the second embodiment is provided so as to be shared by adjacent specific electronic components among the individual specific electronic components 120.

  As shown in FIGS. 5A and 5B, the electronic component mounting portion 230 in the second embodiment is provided so that adjacent specific electronic components among the specific electronic components 120 are shared. A first protrusion 234 is provided. The first protrusions 236 without adjacent specific electronic components are provided corresponding to the individual specific electronic components 120. The first protrusion 234 is provided with a female screw portion 235.

  Similarly to the electronic component unit 100 according to the first embodiment, the electronic component unit 200 according to the second embodiment can simultaneously fix a plurality of specific electronic components 120 on the mounting surface with a single pressing plate, so that a plurality of specific electronic components can be fixed. There is no need to fix the components for each specific electronic component. As a result, a plurality of specific electronic components can be fixed to the mounting surface with high productivity. In addition, it is possible to efficiently dissipate heat generated from a plurality of specific electronic components via the pressing plate.

  Further, according to the electronic component unit 200 according to the second embodiment, the first protrusions are provided so as to be shared by the adjacent specific electronic components among the individual specific electronic components. Even when the interval is short, it is possible to position the plurality of specific electronic components only by attaching the plurality of specific electronic components to a predetermined attachment region on the attachment surface. As a result, since it is possible to easily position a plurality of specific electronic components without using a positioning jig, it is possible to improve workability when attaching the plurality of specific electronic components.

  Further, according to the electronic component unit 200 according to the second embodiment, the first protrusions are provided so as to be shared by the adjacent specific electronic components among the individual specific electronic components. Even when the distance between the two is short, since the first protrusion and the pedestal portion are provided, the specific electronic component can be accurately positioned without using a positioning jig, and the positioning process or the positioning jig removal process Can be omitted. As a result, time and labor are not required, and an electronic component unit can be manufactured with high productivity also from this viewpoint.

  As described above, the electronic component unit 200 according to the second embodiment is different from the electronic component unit 100 according to the first embodiment in the configuration of the first protrusion, but is different from that of the first protrusion in the second embodiment. Since the electronic component unit 200 has the same configuration as the electronic component unit 200, the electronic component unit 200 according to the second embodiment has a corresponding effect.

[Embodiment 3]
FIG. 6 is a view for explaining the pressing plate 340 in the third embodiment. 6A is a front view of the pressing plate 340 as viewed from the side opposite to the surface that contacts the specific electronic component 320, and FIG. 6B illustrates the side of the pressing plate 340 that contacts the specific electronic component 320. It is the rear view seen from.

  The electronic component unit 300 according to the third embodiment basically has the same configuration as the electronic component unit 100 according to the first embodiment, but the configuration of the holding plate is different from that of the electronic component unit 100 according to the first embodiment. . That is, the holding plate 340 in the third embodiment is provided with the second protrusion 344 and the third protrusion 346 as shown in FIG.

  As shown in FIG. 6B, the pressing plate 340 has a contact area corresponding to each specific electronic component 120 to be attached on the surface side of the pressing plate 330 that contacts the specific electronic component 120. The contact area is provided so as to surround three sides by the two second protrusions 344 and the third protrusion 346.

  The second protrusions 344 can position each specific electronic component 120 when attaching the plurality of specific electronic components 120, and the plurality of specific electronic components 120 are attached to the mounting surface in contact with the second protrusions. It is done. The second protrusion 344 is provided corresponding to each specific electronic component 120. In the present embodiment, the second protrusion 344 is a rectangular parallelepiped protrusion that is erected on the pressing plate 340 and comes into contact with the mounting surface when a plurality of specific electronic components are fixed.

  The third protrusion 346 performs positioning in the height direction from the bottom surface of the case body in the plurality of specific electronic components. The plurality of specific electronic components 120 are attached to the attachment surface in contact with the third protrusions 346. In the present embodiment, the third protrusion 346 is a rectangular parallelepiped protrusion erected on the pressing plate 340, and comes into contact with the mounting surface when a plurality of specific electronic components are fixed.

  Similarly to the electronic component unit 100 according to the first embodiment, the electronic component unit 300 according to the third embodiment can simultaneously fix a plurality of specific electronic components to the mounting surface with a single pressing plate. Need not be fixed for each specific electronic component. As a result, it is possible to stably fix a plurality of specific electronic components to the mounting surface with high productivity. In addition, it is possible to efficiently dissipate heat generated from a plurality of specific electronic components via the pressing plate.

  Further, according to the electronic component unit 300 according to the third embodiment, since the second protrusion and the third protrusion are provided, the plurality of specific electronic components can be simply attached to a predetermined contact area of the holding plate. Can be positioned. As a result, since it is possible to easily position a plurality of specific electronic components without using a positioning jig, it is possible to improve workability when attaching the plurality of specific electronic components.

  Further, according to the electronic component unit 300 according to the third embodiment, since the second protrusion and the third protrusion are included, the specific electronic component can be accurately positioned without using a positioning jig, The process of removing the positioning jig can be omitted. As a result, time and labor are not required, and the electronic component unit can be manufactured with higher productivity.

  In addition, according to the electronic component unit 300 according to the third embodiment, since the plurality of specific electronic components are attached to the attachment surface in contact with the second protrusion and the third protrusion, heat generated from the plurality of specific electronic components. Can be efficiently radiated through the second and third protrusions.

  Further, according to the electronic component unit 300 according to the third embodiment, since the second protrusion and the third protrusion are provided on the holding plate, it is necessary to attach different specific electronic components to the mounting surface due to a design change or the like. Even so, it is possible to easily cope with this by simply remanufacturing the holding plate.

  As described above, the electronic component unit 300 according to the third embodiment is different from the electronic component unit 100 according to the first embodiment in the configuration of the pressing plate, but the electronic component unit 300 according to the first embodiment is different from the configuration of the pressing plate. Since it has the same configuration as that of the component unit 100, it has a corresponding effect among the effects of the electronic component unit 100 according to the first embodiment.

[Embodiment 4]
FIG. 7 is a view for explaining the electronic component unit 400 according to the fourth embodiment.

  The electronic component unit 400 according to the fourth embodiment basically has the same configuration as the electronic component unit 100 according to the first embodiment, but the configuration of the electronic component mounting portion is the electronic component unit 100 according to the first embodiment. And different. That is, in the electronic component unit 400 according to the fourth embodiment, as shown in FIG. 7, a plate-like portion, a pedestal portion, and a case main body are integrally formed.

  In the electronic component unit 400 according to the fourth embodiment, the plate-like portion, the pedestal portion, and the case main body are integrally formed by die molding so as to form an inverted T shape from the bottom surface portion of the case main body.

  According to the electronic component unit 400 according to the fourth embodiment, since the plate-like portion, the pedestal portion, and the case main body are integrally formed, the step of attaching the electronic component attaching portion to the case main body by a fixing portion (not shown). It can be omitted and workability is improved.

  Further, according to the electronic component unit 400 according to the fourth embodiment, since the plate-like portion, the pedestal portion, and the case main body are integrally formed, the thermal conductivity from the electronic component mounting portion to the case main body is improved. As a result, it is possible to improve the heat dissipation efficiency of the heat generated from the specific electronic component.

  As described above, the electronic component unit 400 according to the fourth embodiment is different from the electronic component unit 100 according to the first embodiment in the configuration of the electronic component mounting portion, but is different from the configuration of the electronic component mounting portion in the embodiment. 1 has the same configuration as that of the electronic component unit 100 according to the first embodiment, and thus has a corresponding effect among the effects of the electronic component unit 100 according to the first embodiment.

  As mentioned above, although this invention was demonstrated based on said embodiment, this invention is not limited to said embodiment. The present invention can be implemented in various modes without departing from the spirit thereof, and for example, the following modifications are possible.

(1) The number, positional relationship, and size of each component in each of the above embodiments are examples, and the present invention is not limited to this.

(2) In Embodiment 3 described above, the second protrusion 344 is provided corresponding to each specific electronic component 320, but the present invention is not limited to this. For example, adjacent specific electronic components among individual specific electronic components may be provided so as to be shared.

(3) In each of the above embodiments, a plate-like pressing plate is used, but the present invention is not limited to this. For example, you may provide the leg which contacts an attachment surface in the edge part of a pressing plate. With such a configuration, it is possible to radiate heat from the holding plate to the case body via the electronic component mounting portion.

(4) In the first and second embodiments, the first protrusion in contact with the pressing plate is used, but the present invention is not limited to this. A first protrusion that is not in contact with the pressing plate may be used.

(5) In the third embodiment, the second protrusion and the third protrusion that are in contact with the mounting surface are used. However, the present invention is not limited to this. You may use the 2nd protrusion and the 3rd protrusion which are not in contact with the pressing plate.

100, 200, 300, 400, 900 ... Electronic component unit, 110, 910 ... Case main body, 120, 220, 920 ... Specific electronic component, 130, 230, 330, 430, 930 ... Electronic component mounting part, 131, 231 331, 431 ... Electronic component mounting surface, 132, 232, 332, 432 ... Pedestal part, 133, 233, 333, 433 ... Plate-like part, 134, 234 ... First projection, 135, 235, 435 ... Female thread part, 140 ... holding plate, 142, 342 ... screw hole, 344 ... second protrusion, 346 ... third protrusion, 150, 950 ... screw

Claims (9)

A case body for accommodating electronic components belonging to a plurality of electronic component groups for each electronic component group;
A plurality of specific electronic components belonging to a predetermined electronic component group of the plurality of electronic component groups;
An electronic component mounting portion provided on the case body and having a mounting surface for mounting the plurality of specific electronic components side by side;
Possess a pressing plate for simultaneously securing a plurality of specific electronic components on the mounting surface by pressing said plurality of specific electronic components in contact with the plurality of specific electronic device,
The electronic component mounting portion has a pedestal portion provided on the bottom surface of the case body, and a plate-like portion erected from the pedestal portion,
The attachment surface is provided on a plate surface of the plate-like portion,
The electronic component unit, wherein the plurality of specific electronic components are attached to the attachment surface in contact with the pedestal portion . The electronic component unit according to claim 1,
The plate-like portion, the pedestal portion, and the case main body are integrally formed.   A case body for accommodating electronic components belonging to a plurality of electronic component groups for each electronic component group;
  A plurality of specific electronic components belonging to a predetermined electronic component group of the plurality of electronic component groups;
  An electronic component mounting portion provided on the case body and having a mounting surface for mounting the plurality of specific electronic components side by side;
  A pressing plate that simultaneously fixes the plurality of specific electronic components to the mounting surface by pressing the plurality of specific electronic components in a state in contact with the plurality of specific electronic components;
  The electronic component mounting portion is formed as a plate-like portion standing on the bottom surface of the case body,
  The pressing plate further includes a third protrusion for positioning in the height direction from the bottom surface of the case body in the plurality of specific electronic components,
  The plurality of specific electronic components are attached to the attachment surface in a state where the third protrusion and the plurality of specific electronic components are in contact with each other. In the electronic component unit according to any one of claims 1 to 3 ,
The mounting surface is provided with a first protrusion for positioning each specific electronic component when mounting the plurality of specific electronic components,
The electronic component unit, wherein the plurality of specific electronic components are attached to the attachment surface in contact with the first protrusions. The electronic component unit according to claim 4 ,
The first protrusion is provided corresponding to each of the individual specific electronic components. The electronic component unit according to claim 4 ,
The first protrusion is provided so as to be shared by adjacent specific electronic components among the individual specific electronic components. In the electronic component unit according to any one of claims 1 to 6 ,
The pressing plate is provided with a second protrusion for positioning the individual specific electronic components when the plurality of specific electronic components are attached.
The electronic component unit, wherein the plurality of specific electronic components are attached to the attachment surface in contact with the second protrusions. In the electronic component unit according to claim 7 ,
The electronic component unit, wherein the second protrusion is provided corresponding to each of the specific electronic components. In the electronic component unit according to claim 7 ,
The second protrusion is provided so as to be shared by adjacent specific electronic components among the individual specific electronic components.

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