JPH0332420U - - Google Patents
Info
- Publication number
- JPH0332420U JPH0332420U JP9271789U JP9271789U JPH0332420U JP H0332420 U JPH0332420 U JP H0332420U JP 9271789 U JP9271789 U JP 9271789U JP 9271789 U JP9271789 U JP 9271789U JP H0332420 U JPH0332420 U JP H0332420U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- clip
- heat dissipation
- heat radiator
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図はこの考案の実施例を示す斜視図、第２
図は同断面図、第３図はこの考案の他の実施例を
示す斜視図、第４図はクリツプの一例を示す斜視
図である。
１……半導体装置、２……放熱部材、３……ク
リツプ、６……背面、７……係合部、８……突起
部。
Figure 1 is a perspective view showing an embodiment of this invention;
3 is a perspective view showing another embodiment of the invention, and FIG. 4 is a perspective view showing an example of the clip. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Heat dissipation member, 3... Clip, 6... Back surface, 7... Engagement part, 8... Protrusion part.
Claims (1)
導体装置と前記放熱部材とをバネ状のクリツプで
弾性的にはさんで一体的に固定してなる半導体装
置用放熱装置において、 前記放熱部材に突出部を形成し、また前記クリ
ツプの背部に係合部を設け、前記半導体装置と放
熱部材とを前記クリツプによつて固定した状態に
おいて、前記突出部を係合部に係合してなる 半導体装置用放熱装置。[Claims for Utility Model Registration] A heat radiator for a semiconductor device, in which a heat radiator is disposed on the back side of a semiconductor device, and the semiconductor device and the heat radiator are elastically sandwiched and fixed together with a spring-like clip. In the device, a protrusion is formed on the heat dissipation member, and an engagement part is provided on the back of the clip, and when the semiconductor device and the heat dissipation member are fixed by the clip, the protrusion is connected to the engagement part. A heat dissipation device for a semiconductor device that is engaged with a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9271789U JPH0332420U (en) | 1989-08-07 | 1989-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9271789U JPH0332420U (en) | 1989-08-07 | 1989-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332420U true JPH0332420U (en) | 1991-03-29 |
Family
ID=31642128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9271789U Pending JPH0332420U (en) | 1989-08-07 | 1989-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332420U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033682A (en) * | 2011-08-03 | 2013-02-14 | Mitsubishi Electric Corp | Power source device, and lighting fixture |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130254B2 (en) * | 1981-08-13 | 1986-07-12 | Mitsubishi Paper Mills Ltd |
-
1989
- 1989-08-07 JP JP9271789U patent/JPH0332420U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6130254B2 (en) * | 1981-08-13 | 1986-07-12 | Mitsubishi Paper Mills Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013033682A (en) * | 2011-08-03 | 2013-02-14 | Mitsubishi Electric Corp | Power source device, and lighting fixture |
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