JPS6230350U - - Google Patents

Info

Publication number
JPS6230350U
JPS6230350U JP1985122919U JP12291985U JPS6230350U JP S6230350 U JPS6230350 U JP S6230350U JP 1985122919 U JP1985122919 U JP 1985122919U JP 12291985 U JP12291985 U JP 12291985U JP S6230350 U JPS6230350 U JP S6230350U
Authority
JP
Japan
Prior art keywords
heat dissipation
substrate
dissipation base
semiconductor device
section made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985122919U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985122919U priority Critical patent/JPS6230350U/ja
Publication of JPS6230350U publication Critical patent/JPS6230350U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例による半導体装置
の概略断面図、第２図は従来の半導体装置を示す
概略断面図である。 １…基板、２…放熱基体、２１…放熱部、２２
…取付部、２３…取付穴。 FIG. 1 is a schematic sectional view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a schematic sectional view showing a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Heat dissipation base, 21... Heat dissipation part, 22
...Mounting part, 23...Mounting hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を装着した基板と、該基板を支持す
る放熱基体を備え、この放熱基体を取付部材へ取
付けてなる半導体装置において、前記放熱基体は
、前記基板よりの発生熱を放熱する熱伝導性の良
い金属からなる放熱部と、前記取付部材へ取付け
可能に形成された前記放熱部より軽い材料からな
る取付部とから構成したことを特徴とする半導体
装置。 In a semiconductor device comprising a substrate on which a semiconductor element is mounted, a heat dissipation base supporting the substrate, and the heat dissipation base attached to a mounting member, the heat dissipation base is a thermally conductive material that dissipates heat generated from the substrate. 1. A semiconductor device comprising: a heat dissipation section made of a good metal; and a mounting section made of a lighter material than the heat dissipation section, which is formed so as to be attachable to the attachment member.
JP1985122919U 1985-08-07 1985-08-07 Pending JPS6230350U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985122919U JPS6230350U (en) 1985-08-07 1985-08-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985122919U JPS6230350U (en) 1985-08-07 1985-08-07

Publications (1)

Publication Number Publication Date
JPS6230350U true JPS6230350U (en) 1987-02-24

Family

ID=31013557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985122919U Pending JPS6230350U (en) 1985-08-07 1985-08-07

Country Status (1)

Country Link
JP (1) JPS6230350U (en)

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