JPS6435752U - - Google Patents
Info
- Publication number
- JPS6435752U JPS6435752U JP13075687U JP13075687U JPS6435752U JP S6435752 U JPS6435752 U JP S6435752U JP 13075687 U JP13075687 U JP 13075687U JP 13075687 U JP13075687 U JP 13075687U JP S6435752 U JPS6435752 U JP S6435752U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor device
- insertion groove
- stud
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000010586 diagram Methods 0.000 description 4
Description
第１図は本考案によるＬＳＩのスタツドを説明
するための図、第２図は第１図の平面状のスタツ
ドの挿入溝にヒートパイプを挿入し固定具で固定
したときの図、第３図は本考案の第２図に点線で
示す固定用治具の斜視図、第４図は他の実施例の
突出部を表す図、第５図は従来技術によるＬＳＩ
のスタツドの構造図。
図に於いて、１……ＬＳＩ、２……スタツド、
２ａ……おねじ、２ｂ……挿入溝、２ｃ……スタ
ツドの平板部、３……固定具、４……ヒートパイ
プ、５……固定用取付け具、６……突起、７……
スタツド、７ａ……おねじ、７ｂ……挿入溝、８
……ＬＳＩ。
Figure 1 is a diagram for explaining the LSI stud according to the present invention, Figure 2 is a diagram showing a heat pipe inserted into the insertion groove of the planar stud in Figure 1 and fixed with a fixture, and Figure 3. is a perspective view of the fixing jig shown in dotted lines in FIG. 2 of the present invention, FIG. 4 is a diagram showing a protrusion of another embodiment, and FIG. 5 is an LSI according to the prior art.
Structural diagram of the stud. In the figure, 1...LSI, 2...Stud,
2a...Male thread, 2b...Insertion groove, 2c...Flat plate part of stud, 3...Fixing tool, 4...Heat pipe, 5...Fixing fixture, 6...Protrusion, 7...
Stud, 7a...Male thread, 7b...Insertion groove, 8
...LSI.
Claims (1)
ツケージ外部に延在するスタツド２に棒状の放熱
部材４が取り付けられる半導体素子の放熱構造に
おいて、 放熱部材４の半体外形に合致する挿入溝２ｂを
平板状のスタツド２の上面に設け、 該挿入溝２ｂに棒状の放熱部材４を配置し、 固定手段によつて固定することを特徴とする半
導体素子の放熱構造。 ２ 上記放熱部材はヒートパイプ４から成ること
を特徴とする実用新案登録請求の範囲第１項に記
載の半導体素子の放熱構造。 ３ 上記固定手段は、上記スタツド２に設けられ
た挿入溝２ｂの上に該挿入溝２ｂの部分を取り除
いたおねじと、該おねじにねじ込まれるナツト３
とを含み構成されることを特徴とする実用新案登
録請求の範囲第１項、または第２項に記載の半導
体素子の放熱構造。 ４ 上記ナツト３を上記放熱部材の半体外形に合
致する溝を形成した固定用取付け具５を介して該
突出部にはめ込むことを特徴とする実用新案登録
請求の範囲第３項に記載の半導体素子の放熱構造
。[Claims for Utility Model Registration] 1. In a heat dissipation structure for a semiconductor device in which a rod-shaped heat dissipation member 4 is attached to a stud 2 that is in thermal contact with a chip inside the semiconductor device and extends to the outside of the package, half of the heat dissipation member 4 A heat dissipation structure for a semiconductor device, characterized in that an insertion groove 2b that matches the external shape of the body is provided on the upper surface of the flat stud 2, and a rod-shaped heat dissipation member 4 is placed in the insertion groove 2b and fixed by a fixing means. . 2. The heat dissipation structure for a semiconductor device according to claim 1, wherein the heat dissipation member is comprised of a heat pipe 4. 3 The fixing means includes a male screw on the insertion groove 2b provided in the stud 2 with the insertion groove 2b removed, and a nut 3 screwed into the male screw.
A heat dissipation structure for a semiconductor device according to claim 1 or 2, characterized in that the structure includes: 4. The semiconductor according to claim 3 of the utility model registration, characterized in that the nut 3 is fitted into the protrusion via a fixing fixture 5 formed with a groove that matches the outer shape of the half body of the heat dissipating member. Heat dissipation structure of the element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13075687U JPS6435752U (en) | 1987-08-27 | 1987-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13075687U JPS6435752U (en) | 1987-08-27 | 1987-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435752U true JPS6435752U (en) | 1989-03-03 |
Family
ID=31386206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13075687U Pending JPS6435752U (en) | 1987-08-27 | 1987-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435752U (en) |
-
1987
- 1987-08-27 JP JP13075687U patent/JPS6435752U/ja active Pending