JPS6276547U - - Google Patents
Info
- Publication number
- JPS6276547U JPS6276547U JP16835685U JP16835685U JPS6276547U JP S6276547 U JPS6276547 U JP S6276547U JP 16835685 U JP16835685 U JP 16835685U JP 16835685 U JP16835685 U JP 16835685U JP S6276547 U JPS6276547 U JP S6276547U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- optical semiconductor
- semiconductor element
- holder
- adhere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Description
第１図は、本考案の一実施例を説明する断面図
、第２図は、従来の光半導体素子パツケージの半
田固定構造を説明する断面図である。
図において、１は光半導体素子パツケージ、２
は光半導体素子、３はホルダ、４は半田、３１，
５１は光半導体素子挿入孔、５２は半田付着部分
、５３は半田が付着し難い部分、をそれぞれ示す
。
FIG. 1 is a sectional view illustrating an embodiment of the present invention, and FIG. 2 is a sectional view illustrating a conventional solder fixing structure for an optical semiconductor element package. In the figure, 1 is an optical semiconductor element package, 2
is an optical semiconductor element, 3 is a holder, 4 is solder, 31,
Reference numeral 51 indicates an optical semiconductor element insertion hole, 52 indicates a portion to which solder is attached, and 53 indicates a portion to which solder is difficult to adhere.
Claims (1)
構造において、 前記ホルダ５の光半導体素子２との半田付着部
分５２を除き、内部の表面処理を除去し半田の付
着し難い部分５３を形成したことを特徴とする光
半導体素子パツケージの半田固定構造。[Claims for Utility Model Registration] In a structure in which the optical semiconductor element 2 is fixed to the holder 5 with solder 4, the internal surface treatment is removed except for the solder attachment part 52 of the holder 5 to the optical semiconductor element 2, and the solder is removed. A solder fixing structure for an optical semiconductor device package, characterized in that a portion 53 that is difficult to adhere to is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985168356U JPH0225238Y2 (en) | 1985-10-30 | 1985-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985168356U JPH0225238Y2 (en) | 1985-10-30 | 1985-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6276547U true JPS6276547U (en) | 1987-05-16 |
| JPH0225238Y2 JPH0225238Y2 (en) | 1990-07-11 |
Family
ID=31101159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985168356U Expired JPH0225238Y2 (en) | 1985-10-30 | 1985-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225238Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897878A (en) * | 1981-12-07 | 1983-06-10 | Nec Corp | Fixing structure of optical part |
-
1985
- 1985-10-30 JP JP1985168356U patent/JPH0225238Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897878A (en) * | 1981-12-07 | 1983-06-10 | Nec Corp | Fixing structure of optical part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225238Y2 (en) | 1990-07-11 |
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