JPS63114032U - - Google Patents
Info
- Publication number
- JPS63114032U JPS63114032U JP513287U JP513287U JPS63114032U JP S63114032 U JPS63114032 U JP S63114032U JP 513287 U JP513287 U JP 513287U JP 513287 U JP513287 U JP 513287U JP S63114032 U JPS63114032 U JP S63114032U
- Authority
- JP
- Japan
- Prior art keywords
- rail
- pair
- semiconductor device
- guide
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図はこの考案の一実施例による半導体装置
の案内レールを示す断面図、第２図は従来の半導
体装置の案内レールを示す断面図である。
図中、４は下部案内レール、５は上部案内レー
ル、６は案内空間、４１は下部レール部材、４２
は下部取付部材、５１は上部レール部材、５２は
上部取付部材である。尚、図中同一符号は同一ま
たは相当部分を示す。
FIG. 1 is a sectional view showing a guide rail of a semiconductor device according to an embodiment of the invention, and FIG. 2 is a sectional view showing a guide rail of a conventional semiconductor device. In the figure, 4 is a lower guide rail, 5 is an upper guide rail, 6 is a guide space, 41 is a lower rail member, 42
51 is a lower mounting member, 51 is an upper rail member, and 52 is an upper mounting member. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
保ちながら案内する上下一対の案内レール装置に
おいて、互に対向する端面に半導体装置の形状に
合せて案内空間を形成する一対のレール部材と、
これら一対のレール部材をそれぞれ着脱自在に保
持し、熱供給を行なう一対の取付部材とを備えた
ことを特徴とする半導体装置の案内レール装置。 (2) レール部材は各々Ｌ形に形成され、その一
片をボルトにてそれぞれの取付部材に装着してな
る実用新案登録請求の範囲第１項記載の半導体装
置の案内レール装置。[Scope of Claim for Utility Model Registration] (1) In a pair of upper and lower guide rail devices that guide a semiconductor device while keeping it in a constant posture and at a constant temperature, a guide space is provided on the opposing end surfaces according to the shape of the semiconductor device. a pair of rail members to form;
A guide rail device for a semiconductor device, comprising a pair of mounting members for detachably holding the pair of rail members and supplying heat. (2) The guide rail device for a semiconductor device according to claim 1, wherein each rail member is formed into an L shape, and one piece of the rail member is attached to each mounting member with a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP513287U JPS63114032U (en) | 1987-01-16 | 1987-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP513287U JPS63114032U (en) | 1987-01-16 | 1987-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114032U true JPS63114032U (en) | 1988-07-22 |
Family
ID=30786433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP513287U Pending JPS63114032U (en) | 1987-01-16 | 1987-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114032U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189645A (en) * | 1983-04-12 | 1984-10-27 | Tokyo Seimitsu Co Ltd | Device for heating transportation of semiconductor element |
| JPS625108B2 (en) * | 1979-05-09 | 1987-02-03 | Yamaha Motor Co Ltd |
-
1987
- 1987-01-16 JP JP513287U patent/JPS63114032U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625108B2 (en) * | 1979-05-09 | 1987-02-03 | Yamaha Motor Co Ltd | |
| JPS59189645A (en) * | 1983-04-12 | 1984-10-27 | Tokyo Seimitsu Co Ltd | Device for heating transportation of semiconductor element |