JPS59189645A - Device for heating transportation of semiconductor element - Google Patents

Abstract

PURPOSE:To perform the heating transportation of the elements including an extremely small one properly by feeding the elements through the guide to which heat is transmitted from a heating source successively as well as by opposing a beak part of an upper heating member in which a heat generating source is built, to the elements. CONSTITUTION:Elements 1 are put in a long guide 3 made of Al with stretching leads 2 on the right and left sides. The elements 1 are put on the center projecting part 4 of the guide and are slipped down in the guide 3 successively with being restrained its posture by a click 5. The guide 3 is attached to a heating table 6 with its lower part covered with said table 6. A center of an upper surface of the guide 3 is open in the longitudinal direction and to this opening, a sharp beak 22 of an upper heating member 21 opposes to an upper surface of the element 1. When an air bylinder 28 is operated, the upper heating member 21 rises so that a distance between the element 1 and the beak 22 becomes so wider that the element 1 gets in a state capable of freely descending movement.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for automatically transporting semiconductor elements while heating them, in an apparatus for measuring and inspecting the performance of semiconductor elements, particularly lightweight elements, in a heated state. Some of the elements targeted by the 11th grade test are extremely small, weighing only a few grams, but they must be transported continuously and accurately, and heated during that time to bring them to the measurement position. You need to send them one by one. The present invention provides an apparatus for accurately heating and transporting elements. Conventional devices are relatively large, called DIP type devices, and weigh a certain amount, so they were easily transported by inclined guides. However, the flat-pack type that has been manufactured in recent years is extremely small as described above, and tends to get caught in the middle of the guide, so it is necessary to make the guide slope steeper. 4 may not fall. However, since the element needs to be heated gradually to the measurement temperature via a guide, the guide requires a certain length, but if the guide is set up at a steep slope, the element supply position will be high and operability will be poor. . Therefore, there are restrictions on making the slope steeper, and a mechanism for transporting the objects without impairing operability is required. This invention was originally conceived for this purpose.

In FIGS. 1 and 2, the element 1 is placed in a long aluminum guide 3 with leads 2 extending to the left and right sides. Here, the element 1 rides on the central protrusion 4 of the guide and slides down continuously inside the guide 3 on both sides of the guide 2 with its attitude being regulated by the guide claws 5. Here, the guide 3 is provided at an angle, but in order to simplify the explanation, it is illustrated horizontally and will be explained by referring to the top and bottom of FIG. 1.

The guide 3 is attached with its lower part wrapped in a heating table 6.

The heating table 6 contains an electric heat source 7 and a temperature detector 8 to control the temperature of the heating table 6. The heating table 6 is provided with a guide plate 11 symmetrically on both sides, and a guide wheel 13 that matches the tip shape of the guide plate 11 is attached to the fixed part 12 so as to move the heating table 6 in the longitudinal direction of the guide 3. , that is, the first
In the figure, it is restricted to be movable only in the direction perpendicular to the plane of the paper, and in FIG. 3, it is restricted to be movable only in the left and right directions.

Further, in FIG. 4, a lever 15 is erected on the right side of the heating table 6 with a shaft 16 as a fulcrum, and the heating table 6 is pulled rightward by a spring 14, so that the contact point of the lever 15 is Phi.

An air cylinder 18 is placed horizontally on the upper right side of the lever 15.
is attached, and the lever 15 is rotated counterclockwise by the protrusion and protrusion of the piston rod, thereby moving the heating table 6 to the left. In addition, with a 17°19 hash topper, lever 1
5 rotation width.

In other words, the movement width of the heating table is regulated. In this way, by operating the air cylinder 18 intermittently for short periods of time, the heating table is vibrated in the longitudinal direction.

On the other hand, as shown in FIG.
A thin beak 22 of the element 1 faces the upper surface of the element 1.

This upper heating member 21 is long, as shown in FIG. 3, and is made parallel to the central opening of the guide 3, in which a heat source 24. A temperature detector 23 is included to control the temperature.

- Also, the upper heating member 21 has a plurality of rods 26 passing through the fixing part 25 at its upper part, and a flat plate 26 on the rods.
7 is provided with an air cylinder 28 facing downward. Then, the piston rod 29 of the air cylinder 28 passes through the flat plate 27 and descends.

When protruding, the tip of the rod 29 hits the fixed part 25.

At this point, the entire assembly is installed at an angle, and the air cylinder 28 above the upper heating member 21 is operated.

When the piston rod 29 is allowed to protrude, the upper heating member 21 rises, opening the space between the element 1 and the beak 22, and the element 1 becomes freely movable downward. When the rod 29 of the cylinder 28 is then pulled up, the upper heating element 21 is accordingly lowered by its own weight or by the spring 3o so that the beak 22 rests on the element 1 in the guide 3 and transfers the heat from above. Incidentally, since the rod 26 enters at an angle with respect to the fixed part 25, the lowering of the upper heating member is carried out quietly, and no impact is applied to the element.

On the other hand, on the lower heating table, when the element is ready to move, the air cylinder 18 is operated to apply vibration or shock in the longitudinal direction of the guide 3 to promote the downward conveyance of the element. As explained above, the element is heated from the bottom, left and right sides, and the top, and the upper heating member intermittently rises and becomes free, and the vibration in the direction of movement allows it to move down accurately without getting caught even on a steep slope. I'll go.

Note that the upper and lower heating elements may be provided in succession in several stages as necessary, or a plurality of upper heating elements may be provided for one lower heating element. The heating table may be vibrated by a widely used system that utilizes the attractive force 9 repulsive force of a magnet, or by rotating an eccentric cam by a motor.

In addition, when performing room temperature measurement inspections, the nine devices can be used as they are by turning off the heating source.

In addition, in order to improve thermal efficiency, the part containing the heater and the part related to the movement mechanism should be connected with heat insulating material, and in order to prevent heat from being released to the outside, it should be covered with as much heat insulating material as possible. desirable. In the above explanation, the guide 3 and the note pad 6 are made separately, but even if they are made integrally, the same effect can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of the heating conveyance device of the present invention (l--1 in FIG. 3).
1), FIG. 2 is an enlarged explanatory view showing the structure of the element and guide, and FIG. 3 is a side view. FIG. 4 is a side view showing an example of the vibration mechanism of the heating table. 1: Semiconductor element 3: Guide 6: Heating table 11: Guide plate 13: Guide wheel 15 Nilever 18: Air cylinder 21: Upper heating member 22: Beak part
28: Air cylinder 29: Piston Ronodo patent applicant Tokyo Precision Co., Ltd. Figure 1

Claims (1)

[Claims] (1) In a heating automatic conveyance device for semiconductor elements. The beak Xl5 (22) of the upper heating member (21) which continuously feeds the elements through a guide (3) whose upper surface is open in the longitudinal direction and which can transmit heat from the heating source and which has a built-in heat generating source.
Insert the IS into the opening on the upper guide surface to face the element, and remove the upper IS from the element for a short time when transporting the element.
11L, a heating and transporting device for semiconductor elements that is lowered by the IV# moving guides 9 and 27) during heating. (2. In claim 1, the upper heating member (
21) A heating and transporting device for a semiconductor device which vibrates a lower heating table in the direction of transporting the device in a state where the device is separated from the device and the device is free.