JPS62114440U - - Google Patents
Info
- Publication number
- JPS62114440U JPS62114440U JP146686U JP146686U JPS62114440U JP S62114440 U JPS62114440 U JP S62114440U JP 146686 U JP146686 U JP 146686U JP 146686 U JP146686 U JP 146686U JP S62114440 U JPS62114440 U JP S62114440U
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- mold structure
- mold
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図はこの考案の実施例によるトランスフア
成形用金型構造の平断面図、第２図は第１図に対
応する従来の金型構造の平断面図、第３図は第２
図の矢視―断面図、第４図に第２図の金型で
モールド成形された樹脂パツケージの外形図、第
５図はＴＯ外形の樹脂モールド型半導体装置の外
形平面図、第６図は第５図の矢視―断面図、
第７図は半導体装置のモールド成形前における回
路組立体の平面図である。各図において、
１：半導体装置の樹脂パツケージ、２：リード
端子、３，４：回路部品、５：樹脂パツケージの
取付けねじ穴、６：リードフレーム、７：金型、
７１：上型、７２：下型、７３：キヤビテイ、７
４：ランナ、７５，７６：ゲート、７７，７８：
ねじ穴に対応する中子。
FIG. 1 is a plan sectional view of a transfer molding mold structure according to an embodiment of this invention, FIG. 2 is a plan sectional view of a conventional mold structure corresponding to FIG. 1, and FIG.
4 is an external view of a resin package molded with the mold shown in FIG. 2, FIG. 5 is an external plan view of a TO external resin molded semiconductor device, and FIG. Arrow view in Figure 5 - sectional view,
FIG. 7 is a plan view of the circuit assembly before molding the semiconductor device. In each figure, 1: resin package of semiconductor device, 2: lead terminal, 3, 4: circuit components, 5: mounting screw hole of resin package, 6: lead frame, 7: mold,
71: Upper mold, 72: Lower mold, 73: Cavity, 7
4: Runner, 75, 76: Gate, 77, 78:
Core that corresponds to the screw hole.
Claims (1)
パツケージのトランスフア成形用金型構造であり
、かつ該金型に２箇所以上のゲートを設けたもの
において、前記各ゲートがそれぞれ異なる断面積
に設定されて成ることを特徴とする樹脂パツケー
ジのトランスフア成形用金型構造。 (2) 実用新案登録請求の範囲第１項記載の金型
構造において、樹脂パツケージの形状が略方形状
をなし、かつそのセンタ位置には半導体装置取付
け用のねじ穴が開口したものであり、かつ該樹脂
パツケージの形状に対応して金型のゲートキヤビ
テイの一側に並べてその左右両端の２箇所に開口
設置されていることを特徴とする樹脂パツケージ
のトランスフア成形用金型構造。 (3) 実用新案登録請求の範囲第２項記載の金型
構造において、左右２箇所に開口する各ゲートの
断面積比が１対１．５以上であることを特徴とす
る樹脂パツケージのトランスフア成形用金型構造
。[Scope of Claim for Utility Model Registration] (1) A mold structure for transfer molding of a resin package for resin-sealing circuit elements of a semiconductor device, and the mold is provided with two or more gates, A mold structure for transfer molding a resin package, characterized in that each of the gates has a different cross-sectional area. (2) In the mold structure described in claim 1 of the utility model registration claim, the resin package has a substantially rectangular shape, and a screw hole for mounting a semiconductor device is opened at the center position, A mold structure for transfer molding a resin package, characterized in that a gate cavity of the mold is lined up on one side and openings are provided at two locations on both left and right ends of the gate cavity corresponding to the shape of the resin package. (3) In the mold structure described in claim 2 of the utility model registration claim, a resin package transfer characterized in that the cross-sectional area ratio of each gate opening on the left and right sides is 1:1.5 or more. Molding mold structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP146686U JPS62114440U (en) | 1986-01-09 | 1986-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP146686U JPS62114440U (en) | 1986-01-09 | 1986-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62114440U true JPS62114440U (en) | 1987-07-21 |
Family
ID=30779401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP146686U Pending JPS62114440U (en) | 1986-01-09 | 1986-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62114440U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020068166A (en) * | 2018-10-26 | 2020-04-30 | 矢崎総業株式会社 | Shield connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181024A (en) * | 1983-03-30 | 1984-10-15 | Nec Corp | Resin sealing device of semiconductor device |
| JPS601836A (en) * | 1983-06-20 | 1985-01-08 | Hitachi Ltd | Die for resin sealing |
-
1986
- 1986-01-09 JP JP146686U patent/JPS62114440U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59181024A (en) * | 1983-03-30 | 1984-10-15 | Nec Corp | Resin sealing device of semiconductor device |
| JPS601836A (en) * | 1983-06-20 | 1985-01-08 | Hitachi Ltd | Die for resin sealing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020068166A (en) * | 2018-10-26 | 2020-04-30 | 矢崎総業株式会社 | Shield connector |
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