JPS642440U - - Google Patents

Info

Publication number
JPS642440U
JPS642440U JP9579887U JP9579887U JPS642440U JP S642440 U JPS642440 U JP S642440U JP 9579887 U JP9579887 U JP 9579887U JP 9579887 U JP9579887 U JP 9579887U JP S642440 U JPS642440 U JP S642440U
Authority
JP
Japan
Prior art keywords
semiconductor device
substantially horizontally
runners
mold includes
gates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9579887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9579887U priority Critical patent/JPS642440U/ja
Publication of JPS642440U publication Critical patent/JPS642440U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例を示す斜視図、第
2図はその側面図、第3図は従来装置の斜視図、
第4図はその側面図である。 図中、20は可動金型、30はランナー、35
はゲート、40はキヤビテイ、50はエアーベン
トである。なお、各図中同一符号は同一又は相当
部分を示す。
FIG. 1 is a perspective view showing an embodiment of this invention, FIG. 2 is a side view thereof, and FIG. 3 is a perspective view of a conventional device.
FIG. 4 is a side view thereof. In the figure, 20 is a movable mold, 30 is a runner, and 35
is a gate, 40 is a cavity, and 50 is an air vent. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 略水平に配置された一対の金型を備え、上記金
型には、略水平に形成されたランナーと、このラ
ンナーの上部に夫々ゲートを介して配置された複
数のキヤビテイと、このキヤビテイの上部に設け
られたエアベントとを有した半導体装置の樹脂封
止装置。
The mold includes a pair of molds arranged substantially horizontally, and the mold includes a runner formed substantially horizontally, a plurality of cavities arranged above the runners via gates, and a plurality of cavities disposed above the runners through gates. A resin sealing device for a semiconductor device, which has an air vent provided in the semiconductor device.
JP9579887U 1987-06-22 1987-06-22 Pending JPS642440U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9579887U JPS642440U (en) 1987-06-22 1987-06-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9579887U JPS642440U (en) 1987-06-22 1987-06-22

Publications (1)

Publication Number Publication Date
JPS642440U true JPS642440U (en) 1989-01-09

Family

ID=31320517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9579887U Pending JPS642440U (en) 1987-06-22 1987-06-22

Country Status (1)

Country Link
JP (1) JPS642440U (en)

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