JPH0477236U - - Google Patents
Info
- Publication number
- JPH0477236U JPH0477236U JP12051590U JP12051590U JPH0477236U JP H0477236 U JPH0477236 U JP H0477236U JP 12051590 U JP12051590 U JP 12051590U JP 12051590 U JP12051590 U JP 12051590U JP H0477236 U JPH0477236 U JP H0477236U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mold cavity
- resin
- cavities
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Description
第１図は本考案の一実施例を示す樹脂封止金型
の断面図、第２図はその下型の斜視図、第３図は
従来の樹脂封止金型の断面図、第４図はその下型
の斜視図を示す。
１……上型、２，２ａ……下型、３，３ａ……
ゲート、４，４ａ……キヤビテイ、５……ワイヤ
ー、６……かみ合せ位置の差、７……ランナー、
８……アイランド。
Fig. 1 is a sectional view of a resin-sealed mold showing an embodiment of the present invention, Fig. 2 is a perspective view of its lower mold, Fig. 3 is a sectional view of a conventional resin-sealed mold, and Fig. 4 shows a perspective view of the lower die. 1... Upper mold, 2, 2a... Lower mold, 3, 3a...
Gate, 4, 4a...Cavity, 5...Wire, 6...Difference in engagement position, 7...Runner,
8...Island.
Claims (1)
のキヤビテイの合せ位置よりゲート部が下型キヤ
ビテイ内に突出し、且つゲート口が上型キヤビテ
イ内に向けて開口されていることを特徴とする半
導体装置用樹脂封止金型。 A resin-sealed mold for a semiconductor device, characterized in that a gate portion protrudes into the lower mold cavity from a matching position of the cavities of the upper and lower molds, and a gate opening is opened toward the inside of the upper mold cavity. Resin sealing mold for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12051590U JPH0477236U (en) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12051590U JPH0477236U (en) | 1990-11-16 | 1990-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477236U true JPH0477236U (en) | 1992-07-06 |
Family
ID=31868417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12051590U Pending JPH0477236U (en) | 1990-11-16 | 1990-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477236U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (en) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | Mold package and its manufacture method |
-
1990
- 1990-11-16 JP JP12051590U patent/JPH0477236U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114696A (en) * | 2003-11-28 | 2004-04-15 | Oki Electric Ind Co Ltd | Mold package and its manufacture method |