JPS6388413U - - Google Patents
Info
- Publication number
- JPS6388413U JPS6388413U JP18391086U JP18391086U JPS6388413U JP S6388413 U JPS6388413 U JP S6388413U JP 18391086 U JP18391086 U JP 18391086U JP 18391086 U JP18391086 U JP 18391086U JP S6388413 U JPS6388413 U JP S6388413U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- pot
- main runner
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案に係る樹脂封止装置の上型の
平面図、第２図は、同じく本考案に係る樹脂封止
装置の切欠断面図である。
１…金型、２…ポツト、４…主ランナ、４′…
分岐ランナ、５…キヤビテイ、６…プランジヤ、
７…樹脂タブレツト、８…樹脂ストツパー。
FIG. 1 is a plan view of an upper die of a resin sealing device according to the present invention, and FIG. 2 is a cutaway sectional view of the resin sealing device according to the present invention. 1...Mold, 2...Pot, 4...Main runner, 4'...
Branch runner, 5...cavity, 6...plunger,
7...Resin tablet, 8...Resin stopper.
Claims (1)
に、キヤビテイを設けた金型を使用し、ポツト内
の樹脂タブレツトを、プランジヤで押圧しながら
加熱溶融して、キヤビテイに溶融樹脂を送出し、
これを硬化させることにより、キヤビテイ内に成
形体を得るようにした樹脂封止装置において、前
記主ランナ内に、その終端より、出入自在な樹脂
ストツパーを嵌挿したことを特徴とする樹脂封止
装置。 Using a mold with a cavity at the end of the branch runner of the main runner extending from the pot, the resin tablet in the pot is heated and melted while being pressed with a plunger, and the molten resin is sent into the cavity.
A resin sealing device which obtains a molded body in a cavity by curing the resin, characterized in that a resin stopper that can freely move in and out is inserted into the main runner from its terminal end. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18391086U JPS6388413U (en) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18391086U JPS6388413U (en) | 1986-11-28 | 1986-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6388413U true JPS6388413U (en) | 1988-06-08 |
Family
ID=31131081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18391086U Pending JPS6388413U (en) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6388413U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244642A (en) * | 1993-02-16 | 1994-09-02 | Yokogawa Hewlett Packard Ltd | Modulator |
-
1986
- 1986-11-28 JP JP18391086U patent/JPS6388413U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244642A (en) * | 1993-02-16 | 1994-09-02 | Yokogawa Hewlett Packard Ltd | Modulator |