JPS62157143U - - Google Patents

Info

Publication number
JPS62157143U
JPS62157143U JP4425286U JP4425286U JPS62157143U JP S62157143 U JPS62157143 U JP S62157143U JP 4425286 U JP4425286 U JP 4425286U JP 4425286 U JP4425286 U JP 4425286U JP S62157143 U JPS62157143 U JP S62157143U
Authority
JP
Japan
Prior art keywords
resin
pots
mold
resin sealing
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4425286U
Other languages
English (en)
Other versions
JPH0340579Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986044252U priority Critical patent/JPH0340579Y2/ja
Publication of JPS62157143U publication Critical patent/JPS62157143U/ja
Application granted granted Critical
Publication of JPH0340579Y2 publication Critical patent/JPH0340579Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す正断面図、第
2図は成形品の平面図である。 1……上金型、3……下金型、5……ポツト、
6……プランジヤ、7……プレート、8……トラ
ンスフアシリンダ、9……ランナー、10……リ
ードフレーム、11……合成樹脂、12……樹脂
封止部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個のポツト内の合成樹脂を、1個のトラン
    スフアシリンダに連結された夫々対応するプラン
    ジヤにより加圧して、複数個の成形型に溶融樹脂
    を同時に注入するようにした樹脂封止用金型にお
    いて、前記各ポツトをランナーにより互に連通さ
    せたことを特徴とする樹脂封止用金型。
JP1986044252U 1986-03-26 1986-03-26 Expired JPH0340579Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986044252U JPH0340579Y2 (ja) 1986-03-26 1986-03-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986044252U JPH0340579Y2 (ja) 1986-03-26 1986-03-26

Publications (2)

Publication Number Publication Date
JPS62157143U true JPS62157143U (ja) 1987-10-06
JPH0340579Y2 JPH0340579Y2 (ja) 1991-08-27

Family

ID=30861883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986044252U Expired JPH0340579Y2 (ja) 1986-03-26 1986-03-26

Country Status (1)

Country Link
JP (1) JPH0340579Y2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235340A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 半導体樹脂封止装置
JPH01257338A (ja) * 1988-04-07 1989-10-13 Hitachi Ltd 半導体装置の製造方法
CN114103017A (zh) * 2020-08-28 2022-03-01 东和株式会社 树脂成形装置及树脂成形品的制造方法
CN114102981A (zh) * 2020-08-28 2022-03-01 东和株式会社 树脂成形装置及树脂成形品的制造方法
JP2022039810A (ja) * 2020-08-28 2022-03-10 Towa株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225913A (ja) * 1983-06-08 1984-12-19 Y K C:Kk 複数のプランジヤにて複数の成形型に同時に合成樹脂を注入成形する方法および装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225913A (ja) * 1983-06-08 1984-12-19 Y K C:Kk 複数のプランジヤにて複数の成形型に同時に合成樹脂を注入成形する方法および装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235340A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 半導体樹脂封止装置
JPH01257338A (ja) * 1988-04-07 1989-10-13 Hitachi Ltd 半導体装置の製造方法
CN114103017A (zh) * 2020-08-28 2022-03-01 东和株式会社 树脂成形装置及树脂成形品的制造方法
CN114102981A (zh) * 2020-08-28 2022-03-01 东和株式会社 树脂成形装置及树脂成形品的制造方法
JP2022039811A (ja) * 2020-08-28 2022-03-10 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2022039709A (ja) * 2020-08-28 2022-03-10 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP2022039810A (ja) * 2020-08-28 2022-03-10 Towa株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法

Also Published As

Publication number Publication date
JPH0340579Y2 (ja) 1991-08-27

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