JPH0535658B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a resin molding device for performing resin molding on a manufacturing frame in the manufacturing process of electronic devices such as ICs. The present invention relates to a device configured to improve production efficiency in a resin molding process.

[Conventional technology]

Electronic devices such as ICs and LSIs are produced through a die bonding process in which chips are bonded onto a manufacturing frame such as a rectangular lead frame or a hoop material shaped like an elongated lead frame. It is well known that the device is manufactured through a series of processes, including a wire bonding process to connect the chip and wires, a resin molding process to seal the chip and wires in a resin package, and a dam bar cutting process to remove unnecessary parts such as dam bars. By the way, among these, the above resin molding process is usually performed by the transfer molding method using an automatic molding machine such as a transfer molding machine, and the working process is roughly as follows. .

For example, in the case of a manufacturing process using a lead frame, the lead frame is transported from the pre-process equipment to the automatic mold machine, and the upper mold is placed above the lead frame, and
It is placed at a predetermined molding position of an automatic molding machine with a lower mold placed below. In addition, the tablet, which is a solid resin material, is placed in the lower mold.
It is set in a resin material loading part called a plunger pot, and after the tablet is clamped with the upper mold, the tablet melts and is forced into the cavities of the upper mold and lower mold by pushing it with a plunger. It's becoming like that. After the lead frame is transported to a predetermined position in this way, the upper mold, which is moved up and down by the press, is moved down, and
The upper mold and lower mold are clamped. Thereafter, the upper mold is moved upward to open the mold, and the lead frame with mold packages applied to each predetermined portion is transported from the loading position to the post-processing device. Next, a cleaning unit installed in the automatic mold machine removes resin residue remaining in each cavity and air vent of the upper and lower molds. This cleaning unit is usually equipped with a brush for brushing the inner surface of the cavity, a blower for increasing the brushing effect, and a dust collector for sucking up the resin residue peeled off by brushing. By completely removing resin scum from inside the mold every time after tightening, packaging defects are prevented. After the mold cleaning is completed, the lead frame sent in from the previous process is then conveyed to the predetermined molding position of the automatic mold machine, and
After a tablet is loaded into each plunger pot of the lower mold by a tablet loading machine, the upper mold and lower mold are clamped to apply a mold package to each predetermined portion of the lead frame. By repeating this series of steps, resin molding is continuously performed on the lead frames that are sequentially fed from the previous step.

[Problem that the invention seeks to solve]

By the way, in the resin molding process using the above-mentioned automatic molding machine, it has been pointed out that the production efficiency is low and the quality of the package is easily caused.

In other words, after resin molding for one lead frame is finished, mold cleaning is performed, which is essential to prevent deterioration of the quality of the mold package, and it is not possible to immediately move on to the resin molding process for the next lead frame. As a result, the entire resin molding process took a long time, resulting in poor productivity. In addition, during mold cleaning, the mold is cooled by air blow from the blower of the cleaning unit, so the temperature of the mold does not rise to the appropriate temperature for resin molding when the mold is closed.
For this reason, there was an inconvenience that the package was of inferior quality. The latter problem can be solved by preheating the mold after mold cleaning, but this will accelerate the decline in production efficiency.

The present invention was devised under the above circumstances, and is designed to improve productivity in the resin molding process for electronic devices, etc., and to prevent quality defects in molded packages. The purpose of the present invention is to provide a resin molding device that has the following characteristics.

[Means for solving problems]

In order to solve the above problem, the present invention takes the following technical measures.

That is, the present invention is an apparatus for performing resin molding on a frame for manufacturing electronic components that is conveyed in the longitudinal direction, and is capable of sliding on a bolster of a press machine in a direction perpendicular to the conveyance direction of the frame. First and second lower molds are installed in parallel in the sliding direction on the supported lower mold base, and can be slid in the same direction as the lower mold base with respect to the ram of the press device. By providing first and second upper molds corresponding to the first and second lower molds, respectively, on the supported upper mold base, a second mold consisting of the first lower mold and the first upper mold is formed. A mold position where the first mold unit and the second mold unit consisting of the second lower mold and the second upper mold advance onto the frame conveyance path, and a standby position where they retreat laterally from this mold position. By vertical movement of the ram, it is possible to select between the mold closing state and the mold opening state, and when the first mold unit takes the standby position, the mold opening state can be selected. A first cleaning unit that advances between an upper mold and a lower mold to remove resin residue from these molds, and an upper mold that is in the mold open state when the second mold unit is in the standby position. The present invention is characterized in that second cleaning units that extend between the mold and the lower mold to remove resin waste from these molds are provided on both sides of the frame conveyance path.

[Effect]

The first mold unit is caused to clamp the upper mold and the lower mold by the mold clamping device at the molding position, and completes the resin molding of the workpiece.
When the upper mold and the lower mold are moved to the standby position after being opened, the second mold unit that was waiting at the standby position is moved to the molding position instead. Then, while the resin material is being supplied to the second mold unit located at the molding position, the cleaning unit removes resin scum from the upper mold and the lower mold of the first mold unit. Then, after this, the second mold unit
The upper mold and the lower mold are clamped by the mold clamping device, and resin molding is performed on a new workpiece that is subsequently conveyed to the molding position after the molded workpiece. Next, when the second mold unit finishes resin molding the workpiece and returns to the standby position, the first mold unit moves to the molding position in its place, and the first mold unit located at this molding position While the resin material is being supplied, the second mold unit is in the standby position, and the cleaning unit removes resin scum from the upper mold and the lower mold. After the supply of the resin material to the first mold unit is completed, the first mold unit molds the workpiece with resin, and after this, the same series of operations as described above are carried out. Resin molding is continuously performed on the workpiece repeatedly.

In the present invention, in order to reciprocate the first and second mold units between the molding position and the standby position, in particular, both lower molds are supported so as to be slidable on the bolster of the press machine. Both upper molds are also provided on the upper mold base supported so as to be slidable relative to the ram of the press device. In other words, by simply sliding the lower mold base and the upper mold base against the bolster or ram of the press machine, the process can be completed instantly without any troublesome operations such as changing molds. Both mold units can be moved between the molding position and the standby position.

〔effect〕

As described above, in the resin molding apparatus of the present invention, the first mold unit and the second mold unit alternately perform resin molding on the workpiece located at the molding position. Resin molding is performed continuously. Mold cleaning to remove resin residue from the mold is performed while resin material is being supplied to one mold unit, and conventional mold cleaning is performed during the molding process for the next workpiece. You can migrate without waiting for mold cleaning.

Therefore, if the resin molding apparatus of the present invention is used in a molding process for, for example, an electronic device, the time required for one molding process can be shortened compared to the conventional method, and productivity can be improved.
In addition, in order to prevent quality deterioration of the mold package due to the mold being cooled during mold cleaning by the air blow from the blower device installed in the cleaning unit to blow out the resin scum, we have prepared a spare mold. Even if a measure is taken to apply heat, this can be done while the mold unit is in a standby position, so it does not lead to an increase in the time required for one molding process. Therefore, preheating of the mold can be proactively performed, which can ultimately contribute to improving the quality of electronic devices.

[Explanation of Examples]

Hereinafter, one embodiment of the present invention will be specifically described with reference to the drawings.

In this example, the resin molding device of the present invention is
This figure shows a case where the hoop material W is used in a resin molding process, which is one of the manufacturing processes of electronic devices such as transistors and transistors, and also shows a case where an electronic device is manufactured using the hoop material W.

The resin molding device of this example is composed of a first upper mold 2 and a first lower mold 3, and the first upper mold 2 and the first lower mold 3 are placed above and below the hoop material W transported to a predetermined molding position. A mold position where the lower mold 3 is positioned to perform resin molding on the hoop material W, and a standby position where the lower mold 3 is retreated from this mold position in a direction perpendicular to the hoop material feeding direction after the resin molding is completed. It is composed of a first mold unit, a second upper mold 5 and a second lower mold 6 similar to the first mold unit 1, and when the first mold unit 1 takes the molding position, it is in the standby position. A second mold unit 4 is provided which assumes the molding position when the first mold unit takes the standby position.

As shown in FIGS. 1 to 3, the first upper mold 2 of the first mold unit 1 and the second upper mold 5 of the second mold unit 4 are attached to the lower surface of the upper mold base 7. are arranged in parallel in a direction perpendicular to the hoop feeding direction,
Further, both lower molds 3 and 6 are arranged in parallel on the upper surface of the lower mold base 8 in a direction perpendicular to the hoop feeding direction so as to correspond to the first and second upper molds. As shown in FIGS. 2 and 3, the lower molds 3 and 6 are filled with tablets T made of solid resin.
A plurality of plunger pots 9 are formed in which the hoop material is loaded, and cavities 11 communicating with the plunger pots 9 through runners 10 are formed on both sides of the plunger pots 9 at predetermined intervals in the hoop material feeding direction. A predetermined number are provided at intervals. On the other hand, the upper molds 2 and 5 are provided with a predetermined number of cavities (not shown) corresponding to the cavities 11 on the lower mold side. Then, when the upper mold and the lower mold are clamped, the mold is heated by a heater unit (not shown) built into the lower mold base 8, and the tablet T is thereby melted. Further, this molten resin material is force-fed into each cavity via the runner 10 by a plunger (not shown) that enters a plunger pot of the lower mold to form a predetermined portion of the hoop material W located at the molding position. The parts are now resin molded.

In this example, a pair of hoop materials W and W are fed simultaneously in two rows from the previous process, but the molds of each mold unit 1 and 4 are filled with the same material as described above. By arranging the cavities in two rows with the plunger pot 9 in between, the cavities are arranged in two rows with an interval corresponding to the interval between the respective hoop members W, W.
Each hoop material W can be molded with resin at the same time. In addition, by providing a plurality of the above-mentioned cavities in the hoop material feeding direction, resin molding can be performed all at once for a plurality of electronic devices lined up on the hoop material at predetermined intervals. In this way, we aim to improve production efficiency.

On the other hand, as shown in FIG. 1, the press machine 13, which functions as a mold clamping device for each mold unit 1, 4, includes a ram 14 for vertically moving the upper mold base 7, and a lower mold Bolster 1 supporting base 8
5.

The lower mold base 8 is supported by the bolster 15 so as to be able to reciprocate in a direction orthogonal to the hoop feeding direction, and in this example, this is configured as follows.

That is, as shown in FIG.
Fixed rail 1 on the top surface of the hoop feeding direction
6 and 16 are fixedly installed, and slide rails 17 and 17 are attached to the lower surface of the lower mold base 8 to be slidably fitted to the fixed rails 16 and 16. The slide rails 17, 17 are attached to the front and rear flanges of the lower mold base 8 so as to be movable up and down by actuators 18, 18, and when the lower mold base 8 is moved, the slide rails 17, 17 upward to raise the lower mold base 8 slightly from the upper surface of the bolster, the lower mold base 8 can be moved by the friction between the fixed rail and the slide rail, and the mold is clamped. At times, the slide rails 17, 17 are moved downward to bring the lower surface of the lower mold base 8 into close contact with the upper surface of the bolster, so that the pressing force is received by the upper surface of the bolster.

On the other hand, the upper mold base 7 is also supported so as to be movable back and forth in a direction perpendicular to the hoop feeding direction with respect to the ram 14, and in this example, this is configured as follows.

That is, fixed rails 19, 19 are attached to the front and rear of the lower surface of the ram 14, and a slide rail 20, which is slidably fitted to the upper surface of the upper mold base 7 so as to be suspended from the fixed rails 19, 19, 20 is installed. In addition, these fixed rails 19, 19 and slide rails 20,
20 is fitted with a slight vertical play, and when the ram 14 is moving upward, a slight gap is created between the top surface of the upper mold base 7 and the bottom surface of the ram 14. The upper mold base 7 can move smoothly on the rails, and the upper surface of the upper mold base 7 comes into close contact with the lower surface of the ram 14 during mold clamping, allowing press force to be applied without putting any strain on the rails. is effectively transmitted from the lower surface of the ram 14 to the upper surface of the upper mold base 7.

Guide bosses 21 having axial guide holes 21a are provided upright at the four corners of the upper surface of the lower mold base 8, and guide bosses 21 having axial guide holes 21a are provided at the four corners of the lower surface of the upper mold base 7. Guide rods 22 that can be slidably fitted in the guide hole 21a of the boss 21 in the axial direction are provided upright. When these guide bosses 21 and guide rods 22 are fitted, the upper and lower molds of each mold unit 1, 4 are in a state in which they are vertically opposed to each other.

The reciprocating drive between the molding position and the standby position of the first mold unit 1 and the second mold unit 4 is performed when the lower mold This is done by pushing and pulling the base 8 with an actuator (not shown). At this time, as described above, the lower mold base 8 is slightly raised relative to the upper surface of the bolster 15 by the actuation of the actuator 18 . When a lateral force is applied to the lower mold base 8,
The lower mold 8 is moved by the sliding of the fixed rail 16 and the slide rail 17, and the upper mold base 7 is suspended from the ram 14 by fitting the guide boss 21 and the guide rod 22. It follows the lower mold base 8 and moves in the same direction.

In FIG. 1 and FIG. 2, reference numerals 23 and 24
1 shows first and second cleaning units that simultaneously clean the opened upper mold and lower mold in the standby position. In this example, a pair of cleaning units are provided on both sides of the hoop conveying path 25 on the downstream side in the hoop feeding direction of the press machine 13, and these cleaning units are connected to the first mold unit 1 and the second mold unit 4 in the standby position. Each of the upper and lower molds is specially cleaned. As shown in detail in FIG. 4, this cleaning unit 23,
24 is configured such that rotating brushes 26, 26 are provided on the upper and lower surfaces of the tip of a prismatic main body, and a blower port 27 and a suction port 28 are provided near these. It is supported on a body base 29 on the downstream side in the feeding direction so as to be moved forward and backward in the hoop feeding direction by an actuator (not shown). That is,
The cleaning units 23, 24 are advanced into the space between the upper mold and the lower mold when the mold units 1, 4 in the standby position are in the mold open state, and the upper and lower rotating brushes 26, 26 While blowing and brushing the surfaces of the upper and lower molds, the resin scraps peeled off from the molds are sucked to perform cleaning.

Further, in FIGS. 1 and 2, reference numeral 30
1 shows a loader loading resin tablets T into the lower molds 3 and 6 of the mold unit which are in an open state at the molding position. This loader 30 chucks the tablet on the side of the hoop conveyance path 12 on the upstream side in the hoop feed direction of the press machine 13, and then moves above the hoop conveyance path 31 and picks up the upper mold which is in the mold open state at the molding position. Advancing between the mold and the lower mold, dropping resin tablets T into the plunger pots 9 of the lower molds 3 and 6, respectively.
Then, the operation of returning to the tracking position is repeated.

The operation of the resin molding device having the above configuration will be explained step by step. In addition, in the following figures, a dashed line M indicates the mold position.

FIG. 5 shows a point in time when the first mold unit 1 is in the molding position and the second mold unit 4 is in the standby position, and mold clamping has been completed. Next, as shown in FIG. 6, the ram 14 is raised, the upper molds 2 and 3 are slightly raised, and the conveyance paths 12 and 25 on the upstream and downstream sides of the press 13 are slightly raised. Remove the hoop material W, W or the resin mold part from the lower mold 3. At this time, the guide boss 21 and guide rod 22 are still in a fitted relationship. Next, while maintaining the vertical relationship between the upper mold and the lower mold, the seventh
As shown in the figure, the lower mold base 8 is moved laterally. At this time, the guide boss 21 and guide rod 2
2 are in a fitting relationship, the upper mold base 7 also moves in the same direction. In this way, the first mold unit 1 moves from the molding position to the standby position, and the second mold unit 4 moves from the standby position to the molding position. At the same time, a predetermined amount of hoop material W is fed. Next, as shown in FIG. 8, the ram 14 rises further and the upper and lower molds are completely opened. In this state, the conveyance paths 12 and 25 are lowered and the hoop materials W and W are set on the lower mold 6 of the second mold unit 4, and at the same time the loader 30 is operated and the resin is applied to the lower mold 6. While loading the tablet T, the upper and lower molds 2 and 3 of the first mold unit 1 in the standby position are
is cleaned by the first cleaning unit 23.

When the loader 30 and the cleaning unit 23 are retracted, the ram 14 is moved down to clamp the mold as shown in FIG. It is done. At this time, the upper and lower molds 2 and 3 of the first mold unit 1 in the standby position are also brought into close contact with each other, so that the mold temperature lowered by blowing during cleaning is restored.

Next, the first mold unit 1 is placed in the mold position,
The second mold unit 4 moves to the standby position and performs the same operation as described above, except that in this case, cleaning of the second mold unit 4 is performed by a dedicated second cleaning unit indicated by the reference numeral 24. It will be done.

In this way, the first mold unit 1 and the second mold unit 4 alternately take the molding position and the standby position, and in each mold opening state, the tablet is loaded into the mold unit in the molding position and the tablet is placed in the standby position. The cleaning of the mold unit located in the mold unit is carried out at the same time.

Therefore, the production efficiency of the resin molding process is dramatically improved compared to the conventional example in which cleaning and tablet loading had to be performed sequentially. Furthermore, even if the temperature of the mold unit in the standby position drops due to blowing during cleaning, the temperature will recover as the upper and lower molds are brought into close contact with each other at the same time as the mold unit in the mold position is clamped. This also makes it possible to shorten the time for one mold cycle, further improving the efficiency of the resin molding process, and also avoiding deterioration in the quality of the mold package.

Of course, the scope of the invention is not limited to the embodiments described above. For example, in the embodiment, two rows of hoop material W are molded using one mold unit, but only one row of hoop material W may be molded.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway front view of a resin molding device according to an embodiment of the present invention, Fig. 2 is a view taken along the - line in Fig. FIG. 4 is a perspective view of the cleaning unit according to the embodiment, and FIGS. 5 to 9 are diagrams schematically showing the operation of the resin molding apparatus in the embodiment. DESCRIPTION OF SYMBOLS 1...First mold unit, 2...Upper mold (of the first mold unit), 3...Lower mold (of the first mold unit), 4...Second mold unit, 5...(Second mold unit) Upper mold (of the mold unit), 6...Lower mold (of the second mold unit), 13...Mold clamping device (press machine), 23,
24...Cleaning unit.

Claims (1)

[Scope of Claims] 1. An apparatus for applying resin molding to a frame for manufacturing electronic components that is conveyed in the longitudinal direction, which is capable of sliding movement on a bolster of a press machine in a direction perpendicular to the conveyance direction of the frame. The first and second lower molds are installed in parallel in the sliding direction on the lower mold base supported by the lower mold base, and can be slid in the same direction as the lower mold base with respect to the ram of the press device. By providing first and second upper molds corresponding to the first and second lower molds, respectively, on the upper mold base supported by A first mold unit and a second mold unit consisting of the second lower mold and the second upper mold move into a mold position on the frame conveyance path, and a standby position where they retreat laterally from this mold position. By vertical movement of the ram, it is possible to select between the mold closing state and the mold opening state, and when the first mold unit takes the standby position, the mold opening state can be selected. A first cleaning unit that advances between the upper and lower molds located in the upper and lower molds to remove resin residue from these molds, and an upper cleaning unit that is in the mold open state when the second mold unit is in the standby position. A resin molding device characterized in that second cleaning units that extend between a mold and a lower mold and remove resin waste from these molds are provided on both sides of the frame conveyance path.