JPH02214629A - Transfer molding press - Google Patents

Abstract

PURPOSE:To shorten the time of a cycle by simultaneously performing a molding stage, carry-out of moldings and a deflashing stage. CONSTITUTION:When molding work of a bottom force 8a is finished, the bottom forces 8a, 8b are returned to the positions of the stations 6a, 6b. A base plate carrier 21a is moved on the bottom force 8a and the attraction plates 22a...22a are lowered and attract a molded base plate and are raised. Thereafter the attractive plates are moved to the left and the sealed base plate is placed on a belt conveyor 40 and carried to the next stage. When the carrier 21a is moved to the left, a deflasher 13a is immediately moved on the bottom force 8a and simultaneously the rotary brush 17a of the deflasher 13a discharges the flown chips of burr to a duct 14a connected to a hood 15a. The above-mentioned work is alternately performed by stations 6a, 6c loaders 9a, 9b, the deflashers 13a, 13b and the base plate carrier 21a, 21b which are symmetrically provided left and right.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a transfer molding machine used for molding thermosetting resin, and particularly for molding a circuit resin board or lead frame on which an IC chip is mounted. The placed IC chip is sealed with resin, the connector, the vibrator, etc. are sealed with resin, etc.
This invention relates to a transfer molding machine for sealing mechanical parts in all fields in resin.

[Prior Art] Conventionally, a transfer molding machine used for molding thermosetting resins uses hydraulic pressure to raise and lower a fixed upper mold along a lower guide post with an internal cartridge heater. The circuit resin board with the IC chip mounted on it or the lead frame with the IC chip mounted on it is brought in from the outside and set in the cavity of the lower mold, and the molding material is heated using a preheater in a separate device. After preheating and softening it a little, the lower mold is raised and combined with the upper mold, then the softened molding material is taken out from the preheater and put into the mold pot, and then poured into the lower mold and hardened. After that, the lower mold is lowered to take out the molded product from the lower mold, and the inside of the lower mold is manually deburred to form one cycle.

[Problems to be Solved by the Invention] However, in the above-mentioned conventional molding machine, it is impossible to perform molding during the loading ratio of the insert product, the unloading of the molded product, and the deburring process, so it is difficult to shorten the cycle time. In addition, it is difficult to carry in the insert parts, carry out the molded parts, and deburr them in a narrow space, and it is difficult to secure space between the upper and lower molds. As a result, the rise time of the lower mold becomes longer, which also causes the problem that the cycle time becomes longer.

In addition, since deburring of the lower mold is carried out between the upper and lower molds, the burr particles removed from the lower mold are not completely discharged by the discharge pump and are scattered and attached to the molding machine, and are carried into the lower mold. There is a risk that the IC chip may adhere to the IC chip on the board to be set, or may be damaged when the board with the IC chip mounted between the narrow upper and lower molds is loaded or unloaded.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a transfer molding machine that enables molding even during the loading/unloading and deburring processes of molded products and shortens cycle time.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a thermosetting resin molding machine including: an upper mold that can be raised and lowered; and a mold installed directly below the upper mold and at a symmetrical position thereof. a pair of lower molds that are installed to be able to move left and right between these stations and receive molding material from the upper mold; and a pair of lower molds that are installed on the left and right sides of the station at symmetrical positions to supply the substrate and to a loader for moving the lower die; a deburring device installed so as to be movable rearward from a position above the symmetrical station; and above a center line connecting the left and right loaders and above the deburring device. A transfer molding machine characterized by comprising: a substrate loading/unloading device having a plurality of suction plates that move vertically and horizontally between the left and right loaders and the left and right stations; , the lower mold can be raised and lowered,
A transfer molding machine according to claim (1).

Further, the deburring device may include a deburring means using a rotating brush and a dust suction means.

Further, the substrate carrying-in/out-loading device also functions as a molded product carrying-out means.

[Function] By moving the two lower molds alternately between three stations, one mold performs the molding process, and the other lower mold carries in the substrate or unloads the molded product, and performs the molding process. This makes it possible to carry out the deburring process at the same time, reducing cycle time.

In addition, deburring of the lower mold and loading and unloading of the substrate into the lower mold cavity can be performed in a wide area outside the molding machine.

[Example] Fig. 1 is a perspective view of a transfer molding machine showing an embodiment of the present invention, Fig. 2 is a schematic front view showing the left side of an embodiment of the present invention, and Fig. 3(a) is a perspective view of a transfer molding machine showing an embodiment of the present invention. FIG. 3(b) is a sectional view showing a state in which a lead frame on which an IC chip is mounted is set, and FIG. 3(b) is a sectional view showing a state in which a circuit resin board on which an IC chip is written is set in a lower mold.

Four guide posts 2 are erected at the center of the upper surface of the table 1, and an upper mold 3 having a heating chamber for molding material therein is installed along the four guide posts so as to be movable up and down by hydraulic pressure.

In addition, instead of the upper mold 3, the lower mold 8b or 8a that has been moved directly below the upper mold 3 may be configured to be movable up and down.

4 is a transfer cylinder, and 5 is an operation panel.

Stations 6a, 6b, and 6c are installed directly below the upper die 3 and at positions symmetrical thereto, respectively, and a pair of guide rails are provided across each of the stations 6a, 6b, and 6c. Further, 8a and 8b are lower molds of the same structure connected by a rod 10, and are installed movably along the guide rail 7. 9a and 9b are this lower mold 8a
, 8b and push the lower dies 8a, 8b to a predetermined position with removable rods lla, 11b using a pair of loaders for supplying the substrate on which the IC chip is mounted to the substrate loading/unloading device 21a. That is, station 6b
, 6c.

In addition, the loaders 9a and 9b carry the substrates on which the IC chips are mounted (hereinafter referred to as substrates) to the substrate loading/unloading device 21a.
21b (not shown, only the left side will be explained below), the number of substrates a to be set in the lower mold 8a is made to appear below the transparent dustproof cover 18'a by the feeder 17a, and the substrates are loaded and unloaded. Move the device 21a directly above it, open the dustproof cover 18a, and at the same time remove the suction plate 2.
2a .
The feeder l 7 a that has supplied to the substrates 2a, .

Further, above the stations 6a, 6c at both ends, a pair of guide rails 12a, 12b are provided, each extending to the rear of the table l, on pillars 16a, 16b. Removing devices 13a, 13b
is movably mounted. This deburring device 1
3a, 13b (13b not shown) are flexible ducts 14a, 14b connected to an intake fan (not shown)
It has a structure in which rotating brushes 41a and 41b are provided in hoods 15a and 15b that are connected to (not shown).

21a and 21b (21b is not shown) are substrate loading/unloading devices that move left and right along guide rails 20a and 20b extending above the center line connecting the left and right loaders 9a and 9b. Multiple suction plates 22a at the bottom...
- 22a and 22b... 22b (not shown) is mounted so as to be able to move up and down.

The guide rails 20a and 20b are connected to the deburring device 1.
The deburring device 13a is located above the deburring device 3a and 13b.
, 13b do not obstruct the movement of the table 1 to the rear.

Next, the operation will be explained. In this embodiment, when an IC chip 31 placed on a lead frame 30 shown in FIG. 3(a) is sealed with a thermosetting resin 32, ) IC chip 31 placed on the circuit resin board 35 shown in
A case where the thermosetting resin 32 is sealed will be described.

In FIGS. 3(a) and 3(b), 33 is a bonding wire, 36 is an upper mold, 37 is a lower mold, and 38 is a knock for fixing the lead frame between the upper mold and the lower mold.

First, the substrate loading/unloading device 21a is positioned directly above the feeder 17a of the loader 9a, the dustproof cover 18a of the loader 9a is opened, and the suction plates 22a...22a at the bottom of the substrate loading/unloading device 21a are lowered. After sucking the substrate a and raising the suction plates 22a...22a, the substrate loading/unloading device 2 closes the dustproof cover 18a.
1a to the right in FIG. 1 to a position directly above the lower mold 8a, lower the suction plates 22a...22a, set the substrate a in the cavity, release the suction, and then press the suction plates 22a...
・Raise 22a to the original position and remove the board loading/unloading device 21.
In FIG. 1, the lower mold 8b is the lower mold in which resin molding has already been completed.

Next, the rod lla of the loader 9a is extended, and the lower mold 8
Move a and 8b to the positions of stations 6b and 6c.

Next, after the molding material is heated and softened by the preheater of the upper mold 3, the upper mold 3 is lowered or the lower mold 8a is raised (claim (2)) to align the upper mold and the lower mold, and the molding material is heated and softened. After injecting from a nozzle (not shown) into the lower mold 8a (in the case of FIG. 3(b)) or into the cavities of the upper mold 3 and the lower mold 8a (in the case of FIG. 3(a)), it is cured, and then the upper mold 3 or lower the lower mold 8a (in the case of claim (2)).

While the lower mold 8a is being molded, the lower mold 8b
is on station 6C, and guide rails 12b, 1
The sealed substrate (molded product) is taken out from the lower mold 8b by the other substrate loading/unloading device 21b (not shown) that moves back and forth along the line 2b, and then deburring is performed by the other deburring device 13b (not shown). .

As a result, the substrate from the loader 9b is set into the empty cavity of the lower mold 8b by the substrate loading/unloading device 21b.

As mentioned above, when the molding operation of the lower mold 8a is completed, the lower mold 8
a and 8b return to the positions of stations 6a and 6b, the left substrate loading/unloading device 21a moves onto the lower mold 8a, and the suction plates 22a...22a descend to suction the molded (sealed) substrates. After ascending, it moves to the left as shown in Figure 1,
At a position above the belt conveyor 40, the suction cup 22a...2
2a descends and opens the suction cups 22a...22a,
The sealed substrate is placed on the belt conveyor 40 and transported to the next process. When the substrate loading/unloading device 21a moves to the left, the deburring device 13a immediately moves onto the lower die 8a, and at the same time, the rotating brush 17a of the deburring device 13a
While rotating, pressurized air is blown from an air nozzle (not shown), and the scattered burr particles are sucked and discharged by a blower connected to a duct 14a connected to a hood 15a.

Stations 6a, 6c, and loader 9a are arranged symmetrically to the right and left of station 6b for the above-mentioned work.

9b, deburring devices 13a and 13b, and substrate loading/unloading devices 21a and 21b.

Further, by using servo motors to drive all moving mechanisms such as the substrate loading/unloading device 21a and the deburring device 13a, delicate movements can be stably obtained.

[Effects of the Invention] As described above, according to the present invention, the cycle time can be shortened because the molding process, the molded product unloading process, and the deburring process can be performed simultaneously and in parallel. Furthermore, since there is no need to provide a space between the upper and lower molds for carrying out and deburring, the height of the machine body can be lowered, and the time required for raising and lowering the upper mold can be shortened. Furthermore, in the daylight-sized space between the upper mold and the lower mold as in the past, the arm of the automatic machine does not move in and out to automatically load (set) and automatically transfer the board into the lower mold, and the space between the left and right sides of the upper mold is improved. Since it utilizes a large amount of space, the space can be used widely and the degree of freedom in design increases. Furthermore, the arm of the automatic machine for loading and unloading substrates into and out of the lower mold does not need to move in and out between the upper and lower molds, and the lowering distance of the upper mold (in claim (2), the raising distance of the lower mold) is designed to be short. As a result, the pressing force is stable.

Moreover, since the deburring work is carried out in a space, the work can be carried out reliably and safely.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a transfer molding machine showing an embodiment of the present invention, Fig. 2 is a schematic front view showing the left side of an embodiment of the invention, and Fig. 3(a) shows an IC chip mounted on the lower mold. A cross-sectional view showing the set lead frame, Figure 3 (
b) is a sectional view showing a state in which a circuit resin board on which an IC chip is mounted is set on a lower mold. 3... Upper mold % 8a, 6b, 6c... Station, 8a, 8b"・Lower mold, '13 a, 13 b-・
- Deburring devices 22a, 22b... Suction plate, 21a, 21b... Board loading/unloading device. Sesho Tei Hosho (self-proposal)

Claims (4)

[Claims] (1) In a thermosetting resin molding machine, an upper mold that can be raised and lowered, a station installed directly below the upper mold and at a symmetrical position thereof, and a station that is installed so as to be movable left and right between these stations, and a pair of lower molds that receive molding material from the upper mold; a loader that is installed on the left and right sides of the station at the symmetrical position and supplies the substrate and moves the lower mold; A deburring device installed so as to be movable rearward is located above the center line connecting the left and right loaders and above the deburring device, and moves between the left and right loaders and the left and right stations. 1. A transfer molding machine comprising: a substrate loading/unloading device having a plurality of suction plates that move laterally. (2) Claim (2) The lower mold can be moved up and down instead of the upper mold.
1) The transfer molding machine described above. (3) The transfer molding machine according to claim 1, wherein the deburring device includes a deburring means using a rotating brush and a dust suction means. (4) The transfer molding machine according to claim (1), wherein the substrate carry-in/out device is a molded product carry-out means.