JPS649712A - Resin molding device - Google Patents
Resin molding deviceInfo
- Publication number
- JPS649712A JPS649712A JP16614587A JP16614587A JPS649712A JP S649712 A JPS649712 A JP S649712A JP 16614587 A JP16614587 A JP 16614587A JP 16614587 A JP16614587 A JP 16614587A JP S649712 A JPS649712 A JP S649712A
- Authority
- JP
- Japan
- Prior art keywords
- mold unit
- resin molding
- force
- molding
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
Abstract
PURPOSE:To improve the productive efficiency of a resin molding process by mounting two mold units to a resin molding device, alternately operating the units and repeating cleaning. CONSTITUTION:Hoop materials W, W molded by a first mold unit 3 and a resin molding section are taken out of the first mold unit 1 by opening a top force 2 and a bottom force 3. A bottom force base 8 is moved in the cross direction as the vertical relationship of the top force 2 and the bottom force 3 is kept as it is. Consequently, the first mold unit 1 is shifted to the position of standby from the position of molding and a second mold unit 4 to the position of molding from the position of standby. The top and bottom forces 2, 3 for the first mold unit 1 are cleaned by a cleaning unit 23. In the second mold unit 4, on thc other hand, hoop materials W, W are set onto a bottom force 6, and a tablet resin T is charged. Top and bottom forces 5, 6 for the second mold unit 4 are closed, and resin molding is conducted. The efficiency of molding is improved by repeating said processes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16614587A JPS649712A (en) | 1987-07-02 | 1987-07-02 | Resin molding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16614587A JPS649712A (en) | 1987-07-02 | 1987-07-02 | Resin molding device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS649712A true JPS649712A (en) | 1989-01-13 |
JPH0535658B2 JPH0535658B2 (en) | 1993-05-27 |
Family
ID=15825884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16614587A Granted JPS649712A (en) | 1987-07-02 | 1987-07-02 | Resin molding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649712A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297009U (en) * | 1989-01-19 | 1990-08-02 | ||
JPH02214629A (en) * | 1989-02-15 | 1990-08-27 | Toshifumi Wakayama | Transfer molding press |
JPH05301260A (en) * | 1992-04-23 | 1993-11-16 | Sato Tekkosho:Kk | Low-pressure injection molding method and low-pressure injection molder |
EP0594863A1 (en) * | 1992-04-13 | 1994-05-04 | Apic Yamada Corporation | Method of transfer mold and apparatus for transfer mold |
KR20210137892A (en) * | 2020-05-11 | 2021-11-18 | 아피쿠 야마다 가부시키가이샤 | Resin molding apparatus and cleaning method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100646249B1 (en) | 2004-04-08 | 2006-11-23 | 주식회사 엘지화학 | Polyethylene Pipe Having Good Melt Processibilty and High Resistance to Stress and Method for Preparing the Same Using Metallocene Catalysts |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5587517A (en) * | 1978-12-27 | 1980-07-02 | Hitachi Ltd | Method and apparatus for cleaning resin-molding mold |
JPS58157620U (en) * | 1982-04-16 | 1983-10-21 | 株式会社イデヤ | Automatic resin molding unit for electronic parts |
-
1987
- 1987-07-02 JP JP16614587A patent/JPS649712A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5587517A (en) * | 1978-12-27 | 1980-07-02 | Hitachi Ltd | Method and apparatus for cleaning resin-molding mold |
JPS58157620U (en) * | 1982-04-16 | 1983-10-21 | 株式会社イデヤ | Automatic resin molding unit for electronic parts |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0297009U (en) * | 1989-01-19 | 1990-08-02 | ||
JPH02214629A (en) * | 1989-02-15 | 1990-08-27 | Toshifumi Wakayama | Transfer molding press |
EP0594863A1 (en) * | 1992-04-13 | 1994-05-04 | Apic Yamada Corporation | Method of transfer mold and apparatus for transfer mold |
EP0594863A4 (en) * | 1992-04-13 | 1995-05-24 | Apic Yamada Corp | Method of transfer mold and apparatus for transfer mold. |
JPH05301260A (en) * | 1992-04-23 | 1993-11-16 | Sato Tekkosho:Kk | Low-pressure injection molding method and low-pressure injection molder |
KR20210137892A (en) * | 2020-05-11 | 2021-11-18 | 아피쿠 야마다 가부시키가이샤 | Resin molding apparatus and cleaning method |
Also Published As
Publication number | Publication date |
---|---|
JPH0535658B2 (en) | 1993-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |