JP2004186418A - Resin sealing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain resin sealing equipment by which probability of occurrence of a defective product is reduced and the cycle time of manufacture is reduced even in the case of such a product to be sealed as has a cavity on the side of a cope in particular. <P>SOLUTION: The resin sealing equipment 10 is provided with openable and closable drag 14 and cope 16 constituting a die, and supplies the product to be sealed such as a wiring board D and resin material between the drag 14 and the cope 16 to seal a part or the whole of the wiring board D with the resin material. The equipment 10 is provided with a holding mechanism H arranged at the drag 14 and capable of holding the wiring board D, and a supplying mechanism S for supplying the wiring board D to the holding mechanism H arranged at the drag 14. A wiring board pre-heater 46 with a heater (second preheating means )56 is attached to the supplying mechanism S. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin sealing device used for sealing a sealed product such as a printed wiring board with a resin.
[0002]
[Prior art]
For example, a resin sealing device for a wiring board generally includes an openable upper mold and a lower mold that constitute a mold, and supplies a wiring board (to be sealed) and a resin material between the upper mold and the lower mold. Then, part or all of the wiring board is sealed with the resin material. The wiring board may be a single unit, but a plurality of wiring boards before cutting may be sealed at a time.
[0003]
In this type of apparatus, a wiring board is supplied and placed on a lower die. In this state, one of the upper mold and the lower mold approaches the other side, and clamps the placed wiring board. A cavity (space) in which a resin is to be filled is formed in the upper mold or the lower mold, and molding and sealing of the wiring board is performed by filling the cavity with the resin (for example, Patent Document 1). reference).
[0004]
Since the wiring board is at room temperature and the resin to be sealed is at a high temperature, a heater is generally built in the lower mold and the wiring board is preheated by the heater in order to promote familiarity between the two. Such devices are also known. If the wiring board is heated before molding, the probability of occurrence of defective products can be further reduced.
[0005]
After sealing, the wiring board is placed on the lower mold, so the unloader for removing the wiring board enters between the upper and lower molds, removes the wiring board, and then cleans the mold. Cleaner penetrates between the upper mold and the lower mold to clean the upper and lower mold surfaces.
[0006]
[Patent Document 1]
JP-A-8-142106
[Problems to be solved by the invention]
However, in the resin sealing device having the above-described structure, for example, in the case of a mold configuration in which a large cavity is formed only on the lower mold side, the wiring board (sealed product) is placed on the lower mold. Since the area of contact with the lower mold in the state of being supplied and placed on the wiring board is small, there is a problem that the temperature of the wiring board does not rise and the probability of producing defective products increases.
[0008]
In particular, when the article to be sealed is a wiring board, an accessory such as a chip or a wire often exists due to its use, and the mold is easily formed in such an embodiment. For this reason, the problem that it is difficult to perform efficient preheating has been particularly prominent.
[0009]
Also, when removing the wiring board after sealing, since the wiring board is placed on the lower mold, the lower mold must be cleaned unless the wiring board is removed by the unloader. Therefore, there is a problem that the cycle time of a series of processes of the apparatus becomes long, and if the cleaning time is shortened in order to shorten the cycle time, the cleaning property is deteriorated.
[0010]
The present invention has been made in order to solve such a conventional problem, and even if a mold having a cavity only on the lower mold side is provided, the probability of occurrence of defective products is increased. It is an object of the present invention to provide a resin sealing device capable of reducing the production time and shortening the production cycle time.
[0011]
[Means for Solving the Problems]
The present invention includes an upper mold and a lower mold that can be opened and closed to form a mold, and supplies one or a plurality of sealed objects such as a wiring board and a resin material between the upper mold and the lower mold, and In a resin sealing device that seals a part or all of a sealed product with the resin material, a holding mechanism that is disposed on the upper mold and can hold the sealed product and the sealed product, The above problem has been solved by providing a supply mechanism for supplying the holding mechanism arranged on the upper die.
[0012]
In the present invention, a holding mechanism capable of holding an article to be sealed is provided on the upper mold side, and the article to be sealed is supplied to the holding mechanism arranged on the upper mold. Therefore, it is possible to hold the article to be sealed in a mode in which a space exists below the article to be sealed.
[0013]
Therefore, even if the mold has a cavity only on the lower mold side, the sealed article is heated using the space below the sealed article regardless of the existence of the cavity. can do.
[0014]
Further, after the sealing is completed, it is possible to immediately take out the molded article after separating the sealed article from the lower mold side with the separation of the upper and lower molds by the holding mechanism arranged in the upper mold, At the same time, cleaning of the lower mold can be started. Therefore, the cycle time of product manufacturing can be shortened accordingly.
[0015]
In the present invention, the structure of the holding mechanism is not particularly limited. For example, the holding mechanism of the upper mold is separated from the center of the lower mold in a plan view (independently of the upper mold). The upper die together with the holding mechanism, and the horizontal die to a position off the center of the lower die in plan view. When adopted, the sealed product can be heated while being held in a wider space, and a supply mechanism for the sealed product can be easily installed using this wide space. become.
[0016]
When the holding mechanism is movable horizontally as described above, the lower die has a smaller number of cavities than the total number of package portions to be sealed of the article to be sealed. In such a case, since the holding mechanism can move in the horizontal direction by a predetermined distance while holding the sealed product, the sealing of the entire package to be sealed of the supplied sealed product is performed. The same cavity can be used a plurality of times, and it is possible to more flexibly cope with articles to be sealed having various shapes (or connected states). Also, the cycle time can be further reduced.
[0017]
Further, when the holding mechanism is horizontally movable as described above, as a result, the movable configuration of the transfer mechanism can be a simple configuration having only one axis. Combination becomes easy.
[0018]
Further, in the present invention, the sealed product supply mechanism can transfer the sealed product before sealing to a position directly below the holding mechanism while supporting the sealed product from below the sealed product. By providing such a sealed article transfer means, the holding mechanism only needs to hold the sealed article supplied immediately below itself, so that the structure can be further simplified.
[0019]
In the case where the sealed article transfer means itself includes first preheating means capable of heating the sealed article from below the sealed article, the sealed article is moved downward. It is possible to reliably heat up from the side.
[0020]
Note that, in place of the first preheating means or in combination with the first preheating means, the supply mechanism of the sealed article is configured to transfer the sealed article to the holding mechanism by the sealed article transfer means. Before or during the transfer, if the sealed article is provided with a second preheating means capable of heating the sealed article from above, the sealed article is generally flush with the upper surface side. Heating can be efficiently performed by close contact.
[0021]
In addition, by setting the gap between the sealed product in this case and the heating surface of the second preheating means to be 0.1 mm to 0.5 mm, the sealed product having a large distortion generates heat distortion or the like. Without this, heating can be performed uniformly and efficiently.
[0022]
In the present invention, since the article to be sealed is held by the holding mechanism provided on the upper mold, this structure is positively utilized, together with the first and second preheating means, or Instead of these preheating means, a configuration in which the third preheating means is incorporated in the upper die itself may be adopted.
[0023]
The additional configuration described above can be arbitrarily and selectively employed.
[0024]
For example, an upper mold and a lower mold that can be opened and closed constituting a mold are provided, and a sealed product such as one or a plurality of wiring boards and a resin material are supplied between the upper mold and the lower mold, and the sealed mold is provided. In a resin sealing device that seals a part or all of a product with the resin material, a holding mechanism that is disposed on the upper mold and is capable of holding the sealed product; A supply mechanism for supplying to the holding mechanism disposed in the upper die, the upper die together with the holding mechanism, to a position deviated from the center of the lower die in a plan view, can be moved in the horizontal direction, the sealed An article supply mechanism includes a sealed article transfer unit that can transfer the sealed article before sealing to a position directly below the holding mechanism while supporting the sealed article from below. Before or during the transfer of the sealed product to the holding mechanism by the sealed product transfer means, A second preheating means capable of heating the sealed article from above, and wherein the sealed article transfer means itself is capable of heating the sealed article from below the sealed article; It is possible to adopt a configuration provided with preheating means.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic front view showing a configuration of a resin sealing device 10 according to an embodiment of the present invention.
[0026]
The resin sealing device 10 includes an openable and closable upper mold 14 and a lower mold 16 that constitute a mold 12, and a wiring board (sealed product) D and a resin material between the upper mold 14 and the lower mold 16. (Not shown) is supplied, and a part of the wiring board D (the lower part in the example of the figure) is sealed with the resin material.
[0027]
The details will be described below.
[0028]
In FIG. 1, an upper plate 20 is fixed to upper ends of four tie bars 22 erected from a base plate (not shown). A slide plate 24 is slidably supported by four tie bars 22 between the upper plate 20 and the base plate, and is vertically movable by an actuator 26.
[0029]
The lower die 16 is fixed to the upper surface 24A of the slide plate 24, and has a cavity 23 for forming a package portion on its upper surface 16A. The lower die 16 is also provided with an ejection mechanism (not shown) for releasing the molded wiring board D from the mold.
[0030]
On the other hand, the upper die 14 is attached to two tie bars 22 located on the back side of the paper surface of FIG. 1 via a linear guide 28 so as to be movable in the horizontal direction (movable in the horizontal direction in the drawing). The linear guide 28 is provided with an actuator 32 having one side attached to the fixed part 30. The actuator 32 is connected to the upper mold 14 via a metal fitting 34, and moves the upper mold 14 horizontally. By this horizontal movement, the upper mold 14 can be moved in a horizontal direction to a position deviated from the center C1 of the lower mold 16 in a plan view, more specifically, to a position deviated from the vertical projection surface of the upper plate 20. Has become.
[0031]
The upper die 14 is positioned so that the upper surface 14A is at a height at which the upper die 14 is in contact with the lower surface 20A of the upper plate 20 when the upper die 20 is at the lower part of the upper plate 20, that is, at the pressing position.
[0032]
Inside the upper die 14, an air inlet 36 for adsorbing the wiring board D is provided thereon. The intake hole 36 communicates with a pipe 37 connected to the side surface, and the pipe 37 is connected to a vacuum generator 39. A holding mechanism H is configured by the suction hole 36, the pipe 37, and the vacuum generator 39.
[0033]
Below the position where the upper die 14 has moved out of the pressing position (the position depicted in FIG. 1: hereinafter referred to as a wiring board receiving position for convenience), a wiring board elevating body (sealed article transfer means of the supply mechanism S) ) 40 is arranged to be vertically movable. The wiring board elevating body 40 is fixed at one end to an end of an actuator 42 attached to a fixed portion (not shown), and can be raised by the actuator 42 to a height close to the upper die 14 moved to the wiring board receiving position. It has been. A heater (first preheating means) 44 is inserted into and fixed to the wiring board elevating body 40, and a relief hole 47 (see FIG. 2) for a protruding portion 45 such as a chip and a wire is formed on the upper surface. .
[0034]
In the supply mechanism S, a wiring board preheating body 46 is provided so as to be positioned at a predetermined position between the upper die 14 moved to the wiring board receiving position and the wiring board elevating body 40 at the lowest position. I have. A heater (second preheating means) 56 is attached to the wiring board preheating body 46, and can be moved in the horizontal direction via a linear guide attached to a fixed portion. This movement is performed via a mounting bracket 54 by an actuator 52 mounted on one side to the fixed portion 50.
[0035]
As shown in FIG. 2, the gap δ1 between the lower surface 46A of the wiring board preheating body 46 and the upper surface 40A of the wiring board elevating body 40 sandwiching the wiring board D is formed wider by δ2 than the plate thickness d1 of the wiring board D. Have been. δ2 is preferably about 0.1 to 0.5 mm. It is preferable that the gap δ3 (not shown) between the upper surface 40A of the wiring board elevating body 40 and the lower surface 14B of the upper die 14 when the wiring board elevating body 40 is raised to the upper limit is set to 5 mm or less.
[0036]
Next, the operation of the resin sealing device according to the present embodiment will be described with reference to FIG.
[0037]
In FIG. 3A, the upper die 14 is at the pressing position in a state where the wiring board D is sucked into the suction hole 36, and the slide plate 24, the lower die 16 and the wiring board elevating body 40 are at the lowered positions. is there. Further, the wiring board preheating body 46 is on standby at a position retracted from above the wiring board elevating body 40.
[0038]
From this state, the state shown in FIG. 3B is formed. That is, the lower mold 16 in which the resin material is sealed in the cavity 23 is pushed up by the actuator 26 and is brought into close contact with the upper mold 14 to form a package by heat and pressure. While the upper mold 14 and the lower mold 16 are performing the package molding, the wiring board preheating body 46 moves to the upper position of the wiring board elevating body 40 and raises and lowers the wiring board D on which the wiring board D (before molding) is placed. The body 40 rises to a position immediately before the wiring board D hits the lower surface (heating surface) 46A of the wiring board preheating body 46.
[0039]
FIG. 2 shows the details of this state. The gap δ1 between the lower surface 46A of the wiring board preheating body 46 and the wiring board D of the wiring board elevating body 40 is wider than the plate thickness d1 of the wiring board D by δ2 (that is, about 0.1 to 0.5 mm). Since the wiring board D is formed, the elongation (thermal expansion) of the wiring board D is not hindered.
[0040]
Next, the resin sealing device 10 is in a state as shown in FIG. That is, at the stage when the molding is completed, the lower die 16 is lowered by the actuator 26 together with the slide plate 24, and the upper die 14 and the lower die 16 are opened. At this time, the wiring board D is released by the eject mechanism, and is in a state of being sucked and held in the suction hole 36 of the upper die 14.
[0041]
On the other hand, at the same time (or before or after this), the wiring board lifting / lowering body 40 on which the wiring board D is mounted is lowered to the lower limit, and the wiring board preheating body 46 is retracted from the sky above the wiring board lifting / lowering body 40. Is returned to.
[0042]
FIG. 4D shows the state after that. That is, the molded and sealed wiring board D is taken out from the upper mold 14 by an unloader (not shown), and at the same time, the cleaning of the mold 12 is performed by a cleaning mechanism (not shown). In order to receive the wiring board (the article to be sealed before sealing) D, it has moved to the wiring board receiving position. When the upper die 14 moves to the wiring board receiving position, the wiring board lifting / lowering body 40 on which the wiring board D is placed passes the position where it has been preheated, and the wiring board D contacts the lower surface of the upper die 14 (or (Just before contact). In this state, the upper die 14 again sucks and holds the new wiring board D, and the wiring board lifting / lowering body 40 descends to the lower limit without the wiring board D. Further, the upper die 14 moves to the pressing position of the resin sealing device 10.
[0043]
These operations (A) to (D) are repeated, and molding and sealing are sequentially performed.
[0044]
According to the present embodiment, since the upper mold 14 can be moved in the horizontal direction together with the holding mechanism H to the wiring board receiving position that is off the center of the lower mold 16 in plan view, as a result, the wiring board The holding mechanism H of D can be moved in the horizontal direction. For this reason, the driving mechanism of the wiring board lifting / lowering body (sealed article transfer means) 40 for transferring the wiring board D to the holding mechanism H can have a simple configuration of only one axis.
[0045]
In addition, since the holding mechanism H moves integrally with the upper mold 14, the structure of the holding mechanism H can be configured as described above, which is a "suction mechanism that is difficult if not integrated with the upper mold 14". Become like The holding mechanism H by suction can more flexibly cope with a change in the size of the wiring board D as compared with a configuration in which the wiring board D is mechanically held using, for example, a movable claw. It is excellent in that the possibility of damaging the wiring board D is small.
[0046]
In addition, since the wiring board lifting / lowering body 40 transfers the wiring board D to a position immediately below the holding mechanism H while supporting the wiring board D from below the wiring board D, the wiring board is formed by the suction holes 36 of the holding mechanism H. D can be held very reliably.
[0047]
Further, while the wiring board D is being transported to the holding mechanism H by the wiring board lifting / lowering body 40, the wiring board D can be heated from above (a flat surface side where no chips or wires exist) by a heater (second heater). (A second preheating means) 56 is provided. Therefore, the wiring board D can be efficiently preheated in a state where only the extremely narrow gap δ2 of 0.1 mm to 0.5 mm is left between the wiring board preheating body 46 and the wiring board D. In addition, the presence of the gap δ2 does not obstruct the thermal expansion of the wiring board D, so that the stress remaining on the wiring board D can be reduced.
[0048]
Further, since the wiring board elevating body 40 itself includes the heater (first preheating means) 44 capable of heating the wiring board D from below the wiring board D, the wiring board D can also be preheated from below. In particular, after the preheating by the wiring board preheating body 46 is completed, and before the wiring board D is brought close to the intake hole 36 of the upper die 14 (between (B) to (D) in FIG. 3), It is possible to prevent the heat accumulated in the wiring board D from being taken to the (large-capacity) wiring board elevating body 40 side.
[0049]
Further, since the gap between the wiring board elevating body 40 and the upper mold 14 when the wiring board elevating body 40 is raised to the upper limit is set to 5 mm or less, the wiring board D after the suction and holding of the wiring board D in the suction holes 36 of the upper mold 14 is performed. The wiring board D can be radiantly heated from below.
[0050]
In the above embodiment, the upper mold 14 is configured to be able to move horizontally, and is configured to be able to be held by the holding mechanism H. Therefore, for example, the operation shown in FIG. 4 may be obtained. it can. FIG. 4 schematically shows the movement of each component to facilitate understanding of the operation.
[0051]
When the wiring board D has a plurality of package portions to be sealed and the lower mold 16 has only one cavity 23, first, as shown in FIG. The upper die 14 is moved to a position where the package part Pa1 (at the right end) can be sealed, the upper die 14 and the lower die 16 are closed at this position, and the package part Pa1 is molded and sealed. Next, as shown in (B), the upper mold 14 is moved to a position where the next package part Pa2 can be sealed, and the upper mold 14 and the lower mold 16 are closed again at this position to form the package part Pa2. By repeating such movement and molding, even when the wiring board D has a plurality of package parts Pa1, Pa2,... And the lower mold 16 has only one cavity 23, the wiring board held by the upper mold 14 is provided. By moving D, it is possible to seal all package portions Pa1, Pa2,... Of the wiring board D to be sealed, as shown in FIG. That is, by using the same cavity C a plurality of times, it is possible to sequentially mold and seal. This method is particularly effective for molding / sealing when a plurality of wiring boards D are connected (before division) to form one large wiring board.
[0052]
In the case of this configuration, at least one cavity 23 of the lower mold 16 is sufficient. When there are a plurality of cavities of the lower mold 16, the upper mold 14 may be moved by an amount corresponding to a horizontal distance between the plurality of cavities.
[0053]
In addition, many variations of the present invention can be considered, and the present invention is not necessarily limited to the configuration of the above embodiment.
[0054]
For example, in the above embodiment, the holding mechanism H is configured to move horizontally together with the upper die 14, but a configuration may be used in which only the holding mechanism moves horizontally by using, for example, a linear guide.
[0055]
Further, the upper mold and the holding mechanism may be configured not to move horizontally, and instead, the supply mechanism of the sealed product (the sealed product transfer means) may be configured to be vertically and horizontally movable. .
[0056]
In the above-described embodiment, the direction in which the upper mold 14 can move in the horizontal direction is limited to only one side (the supply mechanism S side) of the resin sealing device 10, but, for example, as shown by the imaginary line in FIG. By extending the guide (28) to the side opposite to the supply mechanism, the area of movement of the upper mold and the holding mechanism is enlarged, and the molded article is held by the upper mold and the holding mechanism. The function of the unloader for taking out may also be used. Thereby, the cycle time can be further reduced.
[0057]
In the above embodiment, when the upper mold 14 and the lower mold 16 are opened and closed, the upper mold 14 is fixed in the vertical direction, and the lower mold 16 is moved up and down. On the contrary, the lower mold is fixed. Alternatively, the upper die may be slid up and down.
[0058]
In this case, the upper die may be movable in two axes, vertical and horizontal, or the upper die may be moved only in the vertical direction, and as described above, the object to be sealed is combined with the movement of the supply mechanism. It is also possible to adopt a configuration in which the transfer is performed to a position directly below the holding mechanism.
[0059]
In the above embodiment, as a specific configuration of the holding mechanism H, a configuration using a negative pressure through the intake hole 36 is adopted, but the specific configuration of the holding mechanism is not limited to the above configuration. For example, a movable claw capable of holding a sealed product may be provided on the lower surface of the upper mold to mechanically sandwich the sealed product.
[0060]
In the above embodiment, the heater (first preheating means) 44 is arranged so as to be built in the wiring board elevating body (sealed article transfer means) 40, and the heater (second preheating means) dedicated to the supply mechanism S is provided. However, in the present invention, the arrangement of the preheating means is not particularly limited. For example, it is not always necessary to provide both of these two preheating means, and one of them may be omitted in consideration of the size of the article to be sealed and the attachment state of accessories to the article to be sealed such as chips and wires. It may be. When only one of them is used, it is preferable to leave a dedicated second preheating means from the viewpoint of uniformity and efficiency of heating. On the other hand, in the present invention, since the article to be sealed is held by the holding mechanism provided on the upper mold, the first and second pre-heating means or the Instead of the preheating means, a configuration may be adopted in which the third preheating means (see the imaginary line heater 55 in FIG. 1) is incorporated in the upper die itself.
[0061]
In the above-described embodiment, the relief hole 47 for the projecting portion 45 such as the chip and the wire of the wiring board (sealed article) D is formed on the upper surface side of the wiring board lifting / lowering body (sealed article transfer means) 40. When the position of the chip, the wire, and the like is on the upper surface side of the sealed product, the escape hole may be provided on the lower surface of the second preheating means.
[0062]
In the above embodiment, when the wiring board (sealed article) D is mounted on the wiring board lifting / lowering body (sealed article transfer means) 40, the upper surface and the wiring board preheating body (second preheating means) 46 are moved. The gap δ2 formed between the lower surface and the lower surface is set to 0.1 mm to 0.5 mm, and the gap δ2 is secured by positioning at the time of installation of both means. Alternatively, the gap may be secured by mechanically abutting the two via the stopper.
[0063]
In the above embodiment, after the preheating of the wiring board (sealed article) D is completed, the wiring board elevating body (sealed article transfer means) 40 is configured to descend to the lower limit, but the transfer of the sealed article. The means does not necessarily have to descend to the lower limit, and may be configured to descend only by an amount that avoids interference with the second preheating means.
[0064]
【The invention's effect】
According to the present invention, in particular, it is possible to reduce the probability of occurrence of a defective product even in a sealed product in which a cavity exists on the lower mold side, and to shorten the cycle time of manufacturing. A resin sealing device that can be obtained.
[Brief description of the drawings]
FIG. 1 is a front view schematically showing a resin sealing device according to an example of an embodiment of the present invention. FIG. 2 is a schematic diagram showing the movement of each operating part of the resin sealing device in FIG. 1 over time. FIG. 3 is an enlarged sectional view showing a state in which the wiring board is preheated by the wiring board preheating device. FIG. 4 is a schematic view showing an example of the operation in the above embodiment.
DESCRIPTION OF SYMBOLS 10 ... Resin sealing device 12 ... Mold 14 ... Upper mold 16 ... Lower mold 20 ... Upper plate 22 ... Tie bar 24 ... Slide plate 28 ... Linear guide 32 ... Actuator 36 ... Intake hole 40 ... Wiring board elevating body 42 ... Actuator 44 55, 56 heater 46 wiring board preheating body D wiring board H holding mechanism S supply mechanism

Claims (10)

An openable upper mold and a lower mold that constitute a mold are provided, and a sealed product such as one or a plurality of wiring boards and a resin material are supplied between the upper mold and the lower mold, and the sealed product is In a resin sealing device that seals part or all with the resin material,
A holding mechanism arranged on the upper mold and capable of holding the sealed product,
A supply mechanism for supplying the sealed product to a holding mechanism arranged in the upper mold,
A resin sealing device comprising: In claim 1,
The resin sealing device is characterized in that the holding mechanism is configured to be able to hold a sealed product before sealing and to be able to hold a sealed product after sealing. In claim 1 or 2,
A resin sealing device, wherein the upper die holding mechanism is horizontally movable to a position deviated from the center of the lower die in plan view. In claim 3,
The resin sealing device, wherein the upper die is movable in a horizontal direction together with the holding mechanism to a position deviated from the center of the lower die in plan view. In claim 3 or 4,
The lower mold has a number of cavities less than the total number of package portions to be sealed of the sealed product,
By moving the holding mechanism in the horizontal direction by a predetermined distance while holding the object to be sealed, the same cavity is closed a plurality of times when all the package parts to be sealed of the supplied object to be sealed are sealed. A resin sealing device characterized by being usable. In any one of claims 1 to 5,
The supply mechanism of the sealed product,
Resin sealing, characterized in that it comprises a sealed article transfer means capable of transferring the sealed article before sealing to a position directly below the holding mechanism while supporting the sealed article from below the sealed article. apparatus. In claim 6,
The resin sealing device, wherein the sealed article transfer means itself includes first preheating means capable of heating the sealed article from below the sealed article. In claim 6 or 7,
Before or during the transfer of the sealed article to the holding mechanism by the sealed article transfer means, the supply mechanism of the sealed article can heat the sealed article from above. A resin sealing device comprising: (2) a preheating means. In any one of claims 6 to 8,
A resin sealing device, wherein a gap between a heating surface of the second preheating means and an article to be sealed is set in a range of 0.1 mm to 0.5 mm. In any one of claims 1 to 9,
A resin sealing device, wherein the upper mold itself includes third preheating means capable of heating the sealed product from above the sealed product.

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