JPH10270476A - One-face molding apparatus for chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a one/face molding apparatus for chip which enables to perform plasma cleaning operation of substrates and subsequent one-face resin sealing operation for chip with high workability. SOLUTION: A plurality of substrates 1 are pushed from a magazine 11 onto aprepositional table 22, collectively picked up by means of a suction pad, and then fed to a position above a lower electrode 32 of a plasma cleaning unit C. A lid case 33 is closed, the substrates 1 are subjected to a plasma a cleaning process, collectively picked up by means of the suction pad, and then fed to a position above a lower molding die 51 of a mold press unit D. At the position, an upper molding die 55 is lowered to seal one faces of chips on the substrates 1 with resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip single-side molding apparatus for sealing a chip mounted on a substrate with resin on one side.

[0002]

2. Description of the Related Art After a chip is mounted on a substrate, the chip is molded and sealed with a resin in order to protect the chip. Here, in the case of a chip mounted on a lead frame, double-sided sealing in which a resin mold is formed on both upper and lower surfaces of the lead frame is performed. In the case of double-sided sealing, the resin on the upper surface side and the resin on the lower surface side are integrated through the slit of the lead frame, so that they are not separated from the lead frame.

However, in the case of a chip mounted on a substrate such as a glass epoxy substrate or a ceramic substrate, single-side sealing is performed in which only the upper surface of the substrate, that is, the surface on which the chip is mounted is sealed with resin. However, in the case of single-sided sealing, since the resin only adheres to the surface of the substrate, the resin for sealing the chip is easily peeled off from the substrate.

Therefore, when a chip mounted on a substrate is sealed on one side with a resin, it is necessary to increase the adhesive force between the resin and the substrate. As a method for increasing the adhesive force, it is known to perform plasma cleaning on the surface of a substrate before performing resin sealing. In plasma cleaning, plasma is generated in a vacuum chamber, and ions and electrons collide with the surface of the substrate, thereby removing dirt on the surface of the substrate and activating the surface of the substrate. Is increased.

[0005]

However, it takes a lot of time to transfer a substrate into a vacuum chamber for plasma cleaning or to transfer a substrate after plasma cleaning in the vacuum chamber to a mold press. Therefore, simply performing the plasma cleaning of the substrate and the resin sealing of the chip in sequence does not increase the work efficiency.

Accordingly, an object of the present invention is to provide a chip single-side molding apparatus capable of performing plasma cleaning of a substrate and subsequent single-side resin sealing of the chip with good workability.

[0007]

SUMMARY OF THE INVENTION The present invention relates to a single-sided chip molding apparatus for molding a chip mounted on a substrate with a resin and sealing the chip on one side, comprising a front table for the substrate, a plasma cleaning unit, The mold press units are arranged side by side in a row, and the plasma cleaning unit is composed of a lower electrode and a lid case that is openably and closably mounted on the lower electrode, and transports a plurality of substrates mounted on the front table. After transferring all the substrates onto the lower electrode and cleaning the surface of the substrate by plasma, the substrates are collectively transferred onto the lower die of the mold press unit by the transfer unit and the chip is made of resin. To seal on one side.

[0008]

According to the present invention having the above-described structure, a large number of substrates can be collectively plasma-cleaned and then sent to a mold press unit at a time to perform chip one-side resin sealing.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a single-sided chip molding apparatus according to an embodiment of the present invention, FIGS. 2, 3, and 4 are cross-sectional views of the same plasma cleaning unit, and FIGS. 5, 6, and 7.
FIG. 8 is a sectional view of the mold press unit, and FIG. 8 is a sectional view of a substrate in which the chip is sealed on one side.

FIGS. 1 to 7 show various devices for manufacturing the finished product shown in FIG. 8. First, a typical finished product will be described with reference to FIG. Reference numeral 1 denotes a substrate on which a chip 2 is mounted. The chip 2 and the substrate 1 are connected by wires 3, and a molding resin 4 for protecting the chips 2 and the wires 3 is formed. The mold resin 4 is formed only on the upper surface of the substrate 1 and seals the chip 2 on one side. As a method for connecting the chip 2 and the substrate 1, besides the wires 3, a flip chip method or a TAB method for connecting via bumps may be used. Next, a single-sided molding apparatus for forming the molding resin 4 will be described with reference to FIGS.

First, the overall structure will be described with reference to FIG. In FIG. 1, a single-sided molding apparatus includes a supply unit A, a pre-unit B for a substrate, a plasma cleaning unit C, and a mold press unit D arranged side by side in a row. It is configured to be attached along the unit.

The supply unit A supplies the substrate 1 on which the chip 2 is mounted to the front unit B. The front unit B arranges the substrates 1 in a horizontal row and waits for sending the plurality of substrates 1 to the plasma cleaning unit C at one time. The plasma cleaning unit C is for cleaning the surface of the substrate 1 by plasma. The mold press unit D forms a mold resin for sealing the chips 2 on the plurality of substrates 1 after the plasma cleaning. The substrate transport means E transports the substrate 1 of the front unit B to the plasma cleaning unit C, and transports the substrate 1 of the plasma cleaning unit C to the mold press unit D.

First, the supply unit A will be described.
Reference numeral 11 denotes a magazine in which the substrates 1 are stacked and stored. Reference numeral 12 denotes a base plate on which the magazine 11 is installed. Reference numeral 13 denotes an elevator, which rotates the feed screw 15 with a motor 14 to raise and lower the magazine 11. A pusher 16 is provided behind the magazine 11, and the rod 17 advances to push out the substrates 1 in the magazine 11 one by one to the front unit B in the front. In this case, the height of the magazine 11 is adjusted by driving the elevator 13 so that the substrate 1 extruded by the pusher 16 is at the same level as the rod 17. Note that the feeding direction of the substrate 1 is defined as the X direction.

Next, the front unit B will be described. The front unit B includes a movable table 21 and a movable table 2.
1 comprises a front table 22 mounted on the table. The movable table 21 includes a feed screw 23 that is horizontal in the Y direction and a motor 24 that rotates the feed screw 23. When the motor 24 is driven to rotate the feed screw 23, the front table 22 moves in the Y direction. Accordingly, by moving the front table 22 in the Y direction in synchronization with the pushing of the substrate 1 by the pusher 16, the substrates 1 are placed side by side on the front table 22 as shown in FIG.

Next, the plasma cleaning unit C will be described. In FIG. 1 and FIG. 2, reference numeral 31 denotes a pedestal, in which a lower electrode 32 is provided.
A lid case 33 is provided on the base 31. The base 31 and the lid case 33 are provided with an openable / closable vacuum chamber 30.
Is composed. In FIG. 2, a bracket 34 is connected to a side surface of the lid case 33. The bracket 34 is supported by a rod 36 of a cylinder 35. A slider 37 is attached to a lower portion of the bracket 34,
The slider 37 is slidably fitted on a vertical guide rail 38. Therefore, the rod 36 of the cylinder 35
, The lid case 33 moves up and down. FIG. 2, FIG.
4 shows a state where the lid case 33 is raised and the vacuum chamber 30 is opened, and FIG. 4 shows a state where the lid case 33 is lowered on the base 31 and closed. That is, the cylinder 35 serves as opening and closing means for the lid case 33.

In FIG. 2, the lower electrode 32 has a cord 3
9 is connected to a high-voltage / high-frequency power supply 40. The lid case 33 is a ground electrode. Lower electrode 3
2 is detachably connected to the inside of the base 31 by bolts 41. In FIG. 4, reference numeral 42 denotes a vacuum pump, which suctions the inside of the vacuum chamber 30 under vacuum. A pipe 43 connects the vacuum chamber 30 and the vacuum pump 42.
A plasma generation gas such as an argon gas is supplied from the gas supply device 44 into the vacuum chamber 30. 45 is a vacuum gauge and 46 is an atmospheric vent device.

Next, the mold press unit D will be described with reference to FIGS. Reference numeral 50 denotes a base on which a lower mold 51 is installed. At the four corners of the base 50, columns 52 are erected.
3 is attached. A lifting plate 5 is provided below the top plate 53.
4 is attached. An upper mold 55 facing the lower mold 51 is mounted on the elevating plate 54. A motor 56 is provided on the top plate 53, and a vertical feed screw 57 driven and rotated by the motor 56 is provided with a nut 58 on the upper mold 55.
Is screwed into. Therefore, when the motor 56 drives and the feed screw 57 rotates, the upper mold 55 moves up and down with respect to the lower mold 51. 5 and 6 show a state in which the upper mold 55 has risen, and FIG. 7 shows a state in which the upper mold 55 has descended and joined to the lower mold 51 to perform mold pressing. In FIG. 5, reference numeral 59 denotes a cavity formed on the lower surface of the upper mold 55, and the chip 2 on the substrate 1 is positioned in the cavity 59, and the molding resin is pressed into the cavity 59 in this state.

Next, referring to FIG. 1 and FIG.
The transfer means E will be described. Reference numeral 61 denotes a main body case that is long in the X direction, and includes a feed screw 62 that is long in the X direction and a motor 63 that rotates the feed screw 62. A nut 64 is screwed to the feed screw 62. Therefore, when the feed screw 62 rotates, the nut 64
In the X direction. In FIG. 2, reference numeral 65 denotes a guide rail for guiding the movement of the nut 64.

In FIG. 2, an L-shaped bracket 66 is mounted on a nut 64. A linear guide 67 is mounted on the front surface of the bracket 66. The linear guide 67 supports a horizontal arm 68 extending forward. A plurality of suction pads 6 are provided at the tip of the arm 68.
9 is mounted. The suction pad 69 is connected to a suction device 70 and holds the substrate 1 by vacuum suction. The method of holding the substrate 1 is not limited to vacuum suction, and the substrate 1 may be held by a chuck. The arm 68 is supported by a rod 72 of a cylinder 71. Therefore, when the rod 72 protrudes and retracts, the suction pad 69 moves up and down. When the motor 63 is driven to rotate the feed screw 62, the nut 64 moves in the X direction along the feed screw 62, and the suction pad 69 also moves in the same direction. As a result, the substrate 1 vacuum-adsorbed to the suction pad 69 is transported in the X direction.

In FIG. 1, reference numeral F denotes a second transfer means for the substrate, which is provided downstream of the transfer means E, and sends out the substrate 1 after the completion of the mold press to the next step.
The second transporting means F is the same as the transporting means E described above, and therefore, the description thereof is omitted by adding a suffix a to the reference numerals.

This single-sided chip molding apparatus has the above-described configuration. Next, the overall operation will be described with reference to the drawings. In FIG. 1, the substrate 1 in the magazine 11 is pushed out onto the front table 22 by the pusher 16. Motor 2
4 is a front table 22 in conjunction with the operation of the pusher 16.
Are intermittently moved in the Y direction, thereby aligning the substrate 1 on the front table 22 in the same arrangement as the arrangement of the substrates 1 on the lower mold 51. That is, the supply unit A and the front unit B of the substrate serve as alignment means for aligning the substrate 1 with the arrangement of the substrate 1 on the lower mold 51.
When a predetermined number (four in this example) of substrates 1 are extruded onto the front table 22, the arm 68
By moving up and down.
The four substrates 1 are collectively picked up by the suction pads 69.

Next, the arm 68 moves above the lower electrode 32 of the plasma cleaning unit C. FIG. 2 shows the state at this time. Next, the arm 68 is lowered to land the substrate 1 on the lower electrode 32 (FIG. 3). Then, after releasing the vacuum suction state of the substrate 1 by the suction pad 69, the arm 68 is raised and the arm 68 is moved to the side. Deport to As described above, the plurality of substrates 1 on the front table 22 are collectively transferred onto the lower electrode 32 while maintaining the alignment state on the front table 22.

Next, the vacuum chamber 30 is closed by lowering the lid case 33. FIG. 4 shows the state at this time.
Then, the vacuum pump 42 is driven to vacuum-evacuate the inside of the vacuum chamber 30, and a gas is supplied from the gas supply unit 44 into the vacuum chamber 30. Next, the power supply 40 is turned on to apply a high-frequency voltage to the lower electrode 32. Then vacuum chamber 3
Plasma ions are generated in the area 0 and collide with the surface of the substrate 1 to clean the surface.

When the cleaning is completed, the inside of the vacuum chamber 30 is returned to normal pressure by operating the atmospheric venting device 46, the lid case 33 is raised, and the vacuum chamber 30 is opened. Next, the arm 68 moves above the substrate 1 on the lower electrode 32 and performs an up / down operation to collectively pick up the four substrates 1 by vacuum suction with the suction pad 69.

Next, the arm 68 moves above the lower mold 51 of the mold press unit D. FIG. 5 shows the state at this time. Then, the suction pad 69 descends and lands the substrate 1 on the lower mold 51 (FIG. 6). After releasing the vacuum suction state, the suction pad 69 rises and retreats to the side of the lower mold 51.
As described above, since the plurality of substrates 1 on the lower electrode 32 are aligned in advance in the arrangement on the lower mold 51, they are collectively transferred onto the lower mold 51. Next, the upper mold 55 descends to clamp the substrate 1 (FIG. 7), press resin into the cavity 59, and seal the chip 2 on the substrate 1 with the mold resin 4.
When the mold resin 4 in the cavity 59 is cured,
The upper mold 55 is raised, and the substrate 1 on the lower mold 51 is vacuum-sucked by the suction pad of the second transfer means F, picked up, and transferred to the next step. Thus, a series of operations is completed.

[0026]

According to the present invention, a large number of substrates can be collectively plasma-cleaned and then simultaneously sent to a mold press unit to perform single-sided resin sealing of the chip. Stopping is performed with good workability, and productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip single-side molding apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a plasma cleaning unit of the chip single-side molding apparatus according to one embodiment of the present invention;

FIG. 3 is a sectional view of a plasma cleaning unit of the chip single-side molding apparatus according to one embodiment of the present invention;

FIG. 4 is a cross-sectional view of a plasma cleaning unit of the chip single-side molding apparatus according to one embodiment of the present invention.

FIG. 5 is a cross-sectional view of a mold press unit of the chip single-sided molding apparatus according to one embodiment of the present invention.

FIG. 6 is a cross-sectional view of a mold press unit of the single-sided chip molding apparatus according to one embodiment of the present invention.

FIG. 7 is a sectional view of a mold press unit of the chip single-sided molding apparatus according to one embodiment of the present invention.

FIG. 8 is a cross-sectional view of a substrate in which a chip is sealed on one side of a chip single-side molding apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List A supply unit B front unit C plasma cleaning unit D mold press unit E substrate transfer means 1 substrate 2 chip 4 resin 11 magazine 22 front table 32 lower electrode 33 lid case 35 cylinder 51 lower mold 55 upper mold

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Teruaki Nishinaka 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A single-sided chip molding apparatus for molding a chip mounted on a substrate with a resin and sealing the chip on one side,
A front table for the substrate, a plasma cleaning unit, and a mold press unit arranged side by side in a horizontal line, and the plasma cleaning unit includes a lower electrode and a lid case that is openably and closably mounted on the lower electrode; After a plurality of substrates placed on the table are collectively transferred onto the lower electrode by the transfer means and the surface of the substrate is plasma-cleaned, these substrates are collectively transferred by the transfer means to the mold press unit. A single-sided molding apparatus for a chip, which is mounted on a lower mold and sealed on one side with a resin.