TWI602677B - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing method Download PDFInfo
- Publication number
- TWI602677B TWI602677B TW102105973A TW102105973A TWI602677B TW I602677 B TWI602677 B TW I602677B TW 102105973 A TW102105973 A TW 102105973A TW 102105973 A TW102105973 A TW 102105973A TW I602677 B TWI602677 B TW I602677B
- Authority
- TW
- Taiwan
- Prior art keywords
- heating
- preheating
- sealed body
- sealed
- convex
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
- B29C2045/14877—Pretreatment of the insert, e.g. etching, cleaning preheating or precooling the insert for non-deforming purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
本發明係關於一種利用樹脂將被密封體密封之樹脂密封裝置及樹脂密封方法，更詳細而言，關於一種適於利用樹脂將具有特殊之形狀部分或材質不同之部分之被密封體密封之樹脂密封裝置及樹脂密封方法。 The present invention relates to a resin sealing device and a resin sealing method for sealing a sealed body with a resin, and more particularly to a resin suitable for sealing a sealed body having a special shape portion or a material different portion by a resin. Sealing device and resin sealing method.
先前，例如進行使用樹脂密封用之成形模，藉由樹脂而將裝載有半導體晶片之導線架或電路基板等被密封體密封之處理。於此情形時，成形模係加熱至180℃左右，與此相對，電路基板等被密封體為常溫，故而，為減小兩者之溫度差，例如，將被密封體配置於成形模之模面，於該狀態下經由固定時間進行預熱，其後，將流動性樹脂填充於由成形模構成之模穴中進行硬化，進行樹脂密封。 Conventionally, for example, a molding die for resin sealing is used, and a sealed body such as a lead frame or a circuit board on which a semiconductor wafer is mounted is sealed by a resin. In this case, the molding die is heated to about 180 ° C. In contrast, since the sealed body such as the circuit board is at a normal temperature, the temperature difference between the two is reduced. For example, the sealed body is placed in the molding die. The surface is preheated in this state for a fixed period of time, and thereafter, the fluid resin is filled in a cavity formed by a molding die, and is cured to perform resin sealing.
若以此方式使用成形模進行電路基板等被密封體之預熱，則存在必需將預熱所需之時間納入整體之成形時間(密封時間)內，導致週期時間變長之類之問題。 If the mold is used to preheat the sealed body such as a circuit board in this manner, it is necessary to incorporate the time required for the preheating into the entire molding time (sealing time), resulting in a problem that the cycle time becomes long.
因此，本案申請人提出有如下技術(參照專利文獻1)：於將被密封體搬送至成形模之附近為止之搬送機構中設置加熱器，在對成形模搬送被密封體之過程中，自一側將被密封體面狀地加熱，藉此，縮短或無需在成形模中預熱被密封體之時間，從而縮短成形模中之週期時間。 Therefore, the applicant of the present invention has proposed a technique (refer to Patent Document 1) in which a heater is provided in a transport mechanism that transports a to-be-sealed body to a vicinity of a molding die, and in the process of transporting the sealed body to the molding die, The side will be heated in a planar manner by the sealing surface, thereby shortening or eliminating the need to preheat the sealed body in the forming mold, thereby shortening the cycle time in the forming mold.
[專利文獻1]日本專利特開2012-33584號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-33584
上述專利文獻1係通常製造半導體封裝之情形時之被密封體即矩形之平板狀之印刷基板或導線架等，且其尺寸亦經某種程度標準化，其厚度自身亦較小且無較大之差異之被密封體，可藉由於樹脂密封步驟前之搬送時，自一側將被密封體面狀地加熱，而進行預熱，然而，近年來，作為被密封體，必需對具有特殊之形狀或熱容量(heat capacity)不同之材質部分之被密封體進行樹脂密封。例如，於電子控制單元(ECU：Electronic Control Unit)中，作為被密封體，不僅存在裝載有半導體元件等之電路基板，而且存在具有樹脂製之筒狀連接器部分及金屬製之散熱板者，如此之該被密封體則必需利用樹脂將除散熱板之一部分及連接器部分以外之電路基板之部分密封。 The above-mentioned Patent Document 1 is a rectangular printed circuit board or a lead frame which is a sealed body in the case of manufacturing a semiconductor package, and the size thereof is also standardized to some extent, and the thickness itself is small and not large. The difference in the sealed body can be preheated by heating the surface of the sealed body from one side during the transfer before the resin sealing step. However, in recent years, it has to be a special shape or A sealed body of a material portion having a different heat capacity is resin-sealed. For example, in an electronic control unit (ECU: Electronic Control Unit), not only a circuit board on which a semiconductor element or the like is mounted but also a resin-made cylindrical connector portion and a metal heat dissipation plate are present as the sealed body. In such a sealed body, it is necessary to seal a portion of the circuit board other than the portion of the heat sink and the connector portion with a resin.
於利用上述專利文獻1中揭示之技術進行密封時，難以將被密封體之各部分預熱至所需之溫度，其中上述專利文獻1係具有如下特徵：於搬送過程中，自一側將如此地具有由如金屬與樹脂般熱容量不同之材質構成之部分更具有相對於平板狀之電路基板等為筒狀之類的特殊之形狀之連接器部分之被密封體面狀地加熱。以下，說明其原因。 When sealing is performed by the technique disclosed in the above Patent Document 1, it is difficult to preheat the respective portions of the sealed body to a desired temperature, wherein the above Patent Document 1 has the following feature: in the conveyance process, the one side will be so The portion having a material having a different heat capacity such as a metal and a resin is further heated in a planar manner with respect to a sealed portion of a connector portion having a cylindrical shape such as a flat circuit board or the like. The reason will be described below.
上述被密封體係必需將樹脂製之連接器部分充分預熱至所需之溫度，以免於樹脂製之連接器部分與將電路基板之部分密封之密封樹脂的邊界部產生剝離。然而，專利文獻1係自一側面狀地進行加熱，故而 難以將筒狀之連接器部分遍及其全周地均勻加熱。進而，若需要於短時間內將熱容量較大之樹脂製之連接器部分加熱至所需之溫度，則存在將電路基板等急遽地加熱而於電路基板上產生裂縫之可能性，因此，為了防止電路基板之裂縫，必需延長預熱時間。 In the above-described sealed system, it is necessary to sufficiently preheat the resin-made connector portion to a desired temperature to prevent peeling of the boundary portion of the resin-made connector portion and the sealing resin that seals a portion of the circuit substrate. However, Patent Document 1 heats from a side surface, and thus It is difficult to uniformly heat the cylindrical connector portion throughout its circumference. Further, if it is necessary to heat the connector portion made of a resin having a large heat capacity to a desired temperature in a short period of time, there is a possibility that the circuit board or the like is heated rapidly to cause cracks on the circuit board, and therefore, in order to prevent The crack of the circuit board must extend the warm-up time.
如此地具有特殊之形狀部分或熱容量不同之材質部分之被密封體，難以於短時間內將各部分預熱至所需之溫度。 Such a sealed body having a special shape portion or a material portion having a different heat capacity is difficult to preheat each portion to a desired temperature in a short time.
本發明係鑒於如上所述之情況而完成者，且其目的在於即便具有特殊之形狀部分或不同之材質部分之被密封體，亦可有效地將各部分預熱至適當之溫度。 The present invention has been made in view of the above circumstances, and an object thereof is to efficiently preheat each portion to an appropriate temperature even if it has a special shaped portion or a different material portion of the sealed body.
為了達成上述目的，本發明以如下方式構成。 In order to achieve the above object, the present invention is constructed as follows.
(1)本發明之樹脂密封裝置係具備將被密封體預熱之預熱機構，且藉由樹脂密封用之成形模而將由該預熱機構預熱之被密封體樹脂密封者，且上述預熱機構係設置於對上述樹脂密封用之成形模搬送上述被密封體之搬送路徑之中途，上述預熱機構具備分別具有將上述被密封體加熱之加熱面的兩個加熱手段，上述兩加熱手段之上述兩加熱面係彼此對向，上述兩加熱手段係藉由上述兩加熱面而自兩側將上述被密封體加熱者，上述兩加熱手段中之至少一加熱手段具有面向上述被密封體之加熱面中之至少一部分於接近上述被密封體之方向上突出之凸狀加熱部。 (1) The resin sealing device of the present invention includes a preheating mechanism that preheats the body to be sealed, and seals the sealed body resin preheated by the preheating mechanism by a molding die for resin sealing, and the preheating The heat mechanism is provided in the middle of the transport path for transporting the sealing body for the resin sealing, and the preheating means includes two heating means each having a heating surface for heating the sealed body, and the two heating means The two heating surfaces are opposed to each other, and the two heating means heat the sealed body from both sides by the two heating surfaces, and at least one of the heating means has a surface facing the sealed body At least a part of the heating surface is a convex heating portion that protrudes in a direction close to the sealed body.
預熱機構既可固定地設置於對樹脂密封用之成形模搬送被密封體之搬送路徑之中途，亦可沿著搬送路徑可移動地設置。於沿著搬送路徑可移動地設置預熱機構之情形時，較佳為，一面由該預熱機構進行預 熱，一面搬送被密封體。 The preheating mechanism may be fixedly disposed in the middle of the transport path for transporting the sealed body for the resin sealing mold, or may be movably provided along the transport path. In the case where the preheating mechanism is movably disposed along the transport path, it is preferable that the preheating mechanism performs the pre-heating The heat is transferred to the sealed body.
凸狀加熱部係加熱面在接近被密封體之方向上突出即可，且其形狀並無特別限定，例如可將圓柱狀、長方體等角柱狀、或者圓錐台或角錐台等截頭錐體狀等作為基本形狀，使該等形狀之各面成為所需之形狀。凸狀加熱部係其加熱面朝著被密封體之至少一部分，對被密封體進行加熱者，故而，設為如同與被密封體之應加熱之部分對向之形狀即可。 The heating surface of the convex heating portion may protrude in a direction close to the body to be sealed, and the shape thereof is not particularly limited. For example, a columnar shape such as a columnar shape or a rectangular parallelepiped shape, or a truncated cone shape such as a truncated cone or a truncated cone may be used. As a basic shape, the faces of the shapes are made into a desired shape. The convex heating portion may have a heating surface facing at least a part of the body to be sealed and heating the body to be sealed, and therefore may be shaped to face the portion to be heated of the body to be sealed.
又，凸狀加熱部係加熱面於接近被密封體之方向上突出者即可，且該凸狀加熱部之加熱面既可接觸地加熱被密封體，亦可不接觸而接近地加熱被密封體，或者，亦可使加熱面之一部分接觸地加熱被密封體。 Further, the heating portion of the convex heating portion may protrude in a direction approaching the object to be sealed, and the heating surface of the convex heating portion may heat the sealed body in contact, or may heat the sealed body without contact. Alternatively, one of the heating surfaces may be heated to contact the sealed body.
朝向接近被密封體之方向突出之凸狀加熱部可由其突出高度及形狀來規定凸狀加熱部之加熱面與被密封體之距離，且可由上述距離之大小而設定對被密封體之加熱程度。凸狀加熱部係其加熱面與被密封體之至少一部分對向，故可由該凸狀加熱部之上述突出高度或形狀，設定被密封體之上述至少一部分之加熱程度。即，可藉由選擇加熱手段之凸狀加熱部之突出高度及形狀等，選擇應預熱之被密封體之至少一部分之加熱程度。 The convex heating portion protruding toward the direction of the sealed body can define the distance between the heating surface of the convex heating portion and the object to be sealed by the height and shape of the protrusion, and the degree of heating of the sealed body can be set by the distance . Since the heating portion of the convex heating portion faces at least a portion of the body to be sealed, the degree of heating of the at least a portion of the body to be sealed can be set by the protruding height or shape of the protruding heating portion. That is, the degree of heating of at least a part of the body to be sealed which is to be preheated can be selected by selecting the protrusion height and shape of the convex heating portion of the heating means.
根據本發明之樹脂密封裝置，藉由具有彼此對向之加熱面之兩加熱手段而自兩側對被密封體進行加熱，因此，例如不會出現如同僅自一側加熱被密封體之情形般，一面自一側進行加熱一面自另一側散熱之情況，從而可加熱至所需之溫度為止，並且可抑制被密封體之上述一側與上述另一側之溫度差。又，可縮短預熱所需之時間。 According to the resin sealing device of the present invention, the sealed body is heated from both sides by the heating means having the heating faces opposed to each other, and therefore, for example, the case where the sealed body is heated only from one side does not occur. The heat is radiated from the other side while being heated from the other side, so that the temperature can be heated to a desired temperature, and the temperature difference between the one side of the sealed body and the other side can be suppressed. Moreover, the time required for warming up can be shortened.
進而，根據本發明之樹脂密封裝置，兩加熱手段中之至少一 加熱手段具有凸狀加熱部，該凸狀加熱部係面向被密封體之加熱面之至少一部分朝向接近密封體之方向突出，故而，可藉由根據該凸狀加熱部之突出高度及形狀，設定被密封體之至少一部分與凸狀加熱部之加熱面之間之距離，而設定加熱之程度。因此，例如，被密封體之熱容量較大之部分係增高凸狀加熱部之突出高度，使凸狀加熱部之加熱面接觸或接近被密封體充分地進行加熱，另一方面，被密封體之應抑制急遽之加熱或過度之加熱之部分係降低凸狀加熱部之突出高度，使該凸狀加熱部之加熱面自被密封體分離，從而可防止急遽之加熱或過度之加熱。 Further, according to the resin sealing device of the present invention, at least one of the two heating means The heating means has a convex heating portion that protrudes toward at least a portion of the heating surface of the sealed body toward the sealing body. Therefore, the heating means can be set according to the protruding height and shape of the convex heating portion. The degree of heating is set by the distance between at least a portion of the sealed body and the heating surface of the convex heating portion. Therefore, for example, the portion of the sealed body having a large heat capacity increases the protruding height of the convex heating portion, and the heating surface of the convex heating portion is brought into contact with or close to the sealed body to be sufficiently heated, and the sealed body is heated. The portion that suppresses the rapid heating or excessive heating reduces the protruding height of the convex heating portion, and separates the heating surface of the convex heating portion from the sealed body, thereby preventing rapid heating or excessive heating.
如此根據本發明之樹脂密封裝置，可有效且充分地加熱被密封體之例如熱容量較大之部分，另一方面，對於被密封體之應抑制急遽之加熱或過度之加熱之部分，可抑制加熱，從而可適當且有效地將被密封體之各部分預熱。 According to the resin sealing device of the present invention, for example, a portion having a large heat capacity of the body to be sealed can be efficiently and sufficiently heated, and on the other hand, heating can be suppressed for the portion of the body to be sealed which is subjected to rapid heating or excessive heating. Thereby, the respective portions of the sealed body can be preheated appropriately and efficiently.
(2)於本發明之較佳之實施態樣中，上述兩加熱手段之對向之兩加熱面可於接近方向及分離方向進行相對移動，且上述兩加熱手段係對由搬送構件搬入至兩加熱面之間之上述被密封體進行加熱者，於上述兩加熱手段中之至少一加熱手段中設置有發熱體。 (2) In a preferred embodiment of the present invention, the opposite heating surfaces of the two heating means are relatively movable in the approaching direction and the separating direction, and the two heating means are carried by the conveying member to the two heating When the sealed body is heated between the faces, at least one of the heating means is provided with a heat generating body.
兩加熱手段係其兩加熱面均可移動，亦可僅一加熱面相對於另一加熱面進行移動。 The two heating means can move both heating surfaces, or only one heating surface can move relative to the other heating surface.
根據該實施態樣，可於使兩加熱手段之兩加熱面分離移動之狀態下，藉由搬送構件而將被密封體搬入至兩加熱面之間，使兩加熱面接近移動，對被密封體進行預熱。 According to this embodiment, the sealed body can be carried between the heating surfaces by the conveying member while the heating surfaces of the two heating means are separated and moved, and the heating surfaces are moved close to each other. Preheat.
又，可僅於兩加熱手段中之一加熱手段中設置加熱器等發熱 體，且於被密封體之預熱之前，預先使另一加熱手段接近或接觸設置有發熱體之上述一加熱手段進行加熱，藉此，其後可利用來自一加熱手段之發熱體的發熱與另一加熱手段之餘熱，自兩側加熱被密封體。 Moreover, heating of the heater or the like may be provided only in one of the two heating means And heating, before the preheating of the sealed body, another heating means is brought into contact with or in contact with the heating means provided with the heating element, whereby the heating of the heating element from a heating means can be utilized thereafter The heat of the other heating means heats the sealed body from both sides.
(3)於上述(2)之實施態樣中，上述加熱手段亦可不使搬送上述被密封體之上述搬送構件介於上述加熱面與上述被密封體之間，而直接進行加熱。 (3) In the embodiment (2), the heating means may directly heat the transfer member that does not transport the sealed body between the heating surface and the sealed body.
根據該實施態樣，無需使用以搬送被密封體之搬送構件介於加熱面與被密封體之間，而直接對被密封體進行加熱，故而，與介隔搬送構件進行加熱之情形相比，可縮短被密封體之預熱時間。 According to this embodiment, it is not necessary to use the conveying member that conveys the to-be-sealed body between the heating surface and the to-be-sealed body, and the object to be sealed is directly heated, so that it is heated compared with the case where the conveying member is heated. The warm-up time of the sealed body can be shortened.
(4)於本發明之其他實施態樣中，上述兩加熱手段分別具有上述凸狀加熱部。 (4) In another embodiment of the present invention, each of the two heating means has the convex heating portion.
根據該實施態樣，兩加熱手段分別具有加熱面朝向接近被密封體之方向突出之凸狀加熱部，故而，可藉由兩加熱手段之凸狀加熱部而自兩側夾持著加熱被密封體之至少一部分，從而例如可集中地將被密封體之難以加熱之熱容量較大之部分預熱。 According to this embodiment, each of the heating means has a convex heating portion that protrudes toward the direction close to the body to be sealed, so that the heating means can be sealed by the heating of the two heating means from both sides. At least a part of the body, for example, can partially preheat the portion of the sealed body which is difficult to heat and has a large heat capacity.
(5)於本發明之其他實施態樣中，上述兩加熱手段中之至少一加熱手段具有複數個上述凸狀加熱部。 (5) In another embodiment of the present invention, at least one of the two heating means has a plurality of the convex heating portions.
根據該實施態樣，由於具有複數個凸狀加熱部，故而，可藉由各凸狀加熱部而對被密封體加熱每一部分，從而可使各凸狀加熱部之突出高度或形狀不同，使對被密封體之加熱之程度不同。即，可使複數個部分中之每一部分中加熱之程度不同地預熱被密封體。 According to this embodiment, since the plurality of convex heating portions are provided, each of the portions to be sealed can be heated by the respective convex heating portions, whereby the protruding height or shape of each of the convex heating portions can be made different. The degree of heating of the body to be sealed is different. That is, the sealed body can be preheated to a different extent in the heating of each of the plurality of portions.
(6)於上述(5)之實施態樣中，亦可藉由與其他凸狀加熱 部不同之材質構成上述複數個凸狀加熱部中之至少一個凸狀加熱部。 (6) In the embodiment (5) above, it is also possible to heat by other convex shapes. The different material forms at least one of the plurality of convex heating portions.
作為不同之材質，較佳為熱導率不同之材質，且例如可藉由利用熱導率較小之材質構成凸狀加熱部，而減弱藉由該凸狀加熱部進行加熱之被密封體之部分之加熱程度，相反地，可藉由利用熱導率較大之材質構成凸狀加熱部，而增強藉由該凸狀加熱部進行加熱之被密封體之部分之加熱程度。 As a different material, a material having a different thermal conductivity is preferable, and for example, a convex heating portion can be formed by using a material having a small thermal conductivity, and the sealed body heated by the convex heating portion can be weakened. In part, the degree of heating is reversed, and the convex heating portion can be formed by using a material having a large thermal conductivity to enhance the degree of heating of the portion of the sealed body heated by the convex heating portion.
根據該實施態樣，例如可藉由利用與其他凸狀加熱部相比熱導率較小之材質構成複數個凸狀加熱部中之至少一個凸狀加熱部之材質，而使由上述一個凸狀加熱部進行加熱之被密封體之部分與由其他凸狀加熱部進行加熱之被密封體之部分相比抑制加熱，相反地，可藉由利用與其他凸狀加熱部相比熱導率較大之材質構成複數個凸狀加熱部中之至少一個凸狀加熱部之材質，而使由上述一個凸狀加熱部進行加熱之被密封體之部分與由其他凸狀加熱部進行加熱之被密封體之部分相比，充分地進行加熱。 According to this embodiment, for example, the material of at least one of the plurality of convex heating portions can be formed of a material having a smaller thermal conductivity than the other convex heating portions, and the convex shape can be formed by the one convex shape. The portion of the sealed body heated by the heating portion suppresses heating as compared with the portion of the sealed body heated by the other convex heating portion, and conversely, the thermal conductivity is larger than that of the other convex heating portions. The material is made of a material of at least one of the plurality of convex heating portions, and the portion of the sealed body heated by the one convex heating portion and the sealed body heated by the other convex heating portions are In part, heating is performed sufficiently.
(7)於本發明之其他實施態樣中，上述凸狀加熱部於前端部具有凹陷之凹部。凹部之形狀並無特別限定，例如，可將凹部之形狀設為與被密封體之至少一部分之外形形狀對應之形狀，且藉由凹部而將被密封體之上述至少一部分包圍或嵌入地進行加熱。又，可由凹部之至底面為止之深度(凸狀加熱部之前端部與凹部之底面之間之分離距離)，確保與被密封體之距離，且例如可藉由使凹部之至底面為止之深度變深，而增大與被密封體之間之距離，從而減弱面向凹部之被密封體之部分之加熱之程度。 (7) In another embodiment of the present invention, the convex heating portion has a concave portion at a front end portion. The shape of the concave portion is not particularly limited. For example, the shape of the concave portion may be a shape corresponding to at least a part of the shape of the sealed body, and the at least a portion of the sealed body may be surrounded or embedded by the concave portion. . Further, the depth from the concave portion to the bottom surface (the separation distance between the front end portion of the convex heating portion and the bottom surface of the concave portion) can be secured to the sealed body, and can be, for example, the depth from the concave portion to the bottom surface. The depth is increased to increase the distance from the body to be sealed, thereby weakening the degree of heating of the portion of the body to be sealed facing the recess.
根據該實施態樣，凸狀加熱部於作為突出端之前端部具有凹陷之凹部，故而，可將凹部設為與被密封體之至少一部分之外形形狀對應 之形狀，且藉由該凹部而將被密封體之至少一部分包圍或嵌入地集中進行加熱。又，相反地，可由凹部之至底面為止之深度，確保與被密封體之距離，且例如藉由使凹部之深度變深，而增加與被密封體之間之距離，從而減弱面向凹部之被密封體之部分之加熱之程度。 According to this embodiment, the convex heating portion has a concave portion at the end portion as the protruding end, so that the concave portion can be formed to correspond to at least a part of the shape of the sealed body. The shape is obtained by heating and concentrating at least a part of the sealed body by the concave portion. Further, conversely, the distance from the concave portion to the bottom surface can be ensured to the distance from the body to be sealed, and the distance between the body and the body to be sealed can be increased, for example, by deepening the depth of the concave portion, thereby weakening the face facing the concave portion. The extent to which the portion of the seal is heated.
(8)於本發明之進而其他實施態樣中，上述加熱手段具備：發熱塊，其藉由發熱體而發熱；以及加熱體，其可裝卸地安裝於該發熱塊，並且具有上述加熱面。 (8) In still another embodiment of the present invention, the heating means includes: a heat generating block that generates heat by the heat generating body; and a heating body that is detachably attached to the heat generating block and has the heating surface.
發熱塊並不限於單一之加熱塊，亦可連結有複數個塊。 The heat generating block is not limited to a single heating block, and a plurality of blocks may be connected.
加熱體具有加熱面之至少一部分朝向接近被密封體之方向突出之凸狀加熱部。 The heating body has a convex heating portion in which at least a part of the heating surface protrudes in a direction approaching the to-be-sealed body.
根據該實施態樣，具有凸狀加熱部之加熱體相對發熱塊可裝卸，故而，可相應於應預熱之被密封體之種類，預先準備複數個具有突出高度或形狀等不同之凸狀加熱部之加熱體，且根據預熱之被密封體，更換安裝於發熱塊之加熱體，藉此，可容易地應對各種被密封體。 According to this embodiment, the heating body having the convex heating portion is detachable from the heat generating block, and therefore, a plurality of convex heatings having different protruding heights or shapes can be prepared in advance in accordance with the type of the sealed body to be preheated. In the heating body of the unit, the heating body attached to the heat generating block is replaced by the preheated sealed body, whereby various sealed bodies can be easily handled.
(9)本發明之樹脂密封方法係將被密封體預熱進行樹脂密封者，且包含如下步驟：於對樹脂密封用之成形模搬送被密封體之搬送路徑之中途，將上述被密封體進行預熱；以及，藉由上述樹脂密封用之成形模而將經預熱之被密封體進行樹脂密封；上述進行預熱之步驟係藉由分別具有彼此對向配置且加熱上述被封止體之加熱面的兩個加熱手段之上述兩加熱面，而自兩側預先加熱上述被密封體，且上述兩加熱手段中之至少一加熱手段之面向上述被密封體之加熱面之至少一部分具有朝向接近上述被密封體之方向突出之凸狀加熱部。 (9) The resin sealing method of the present invention is a method of preheating a sealed body to perform resin sealing, and includes the steps of: performing the sealing body in a middle of a conveying path for transporting the sealed body by a molding die for resin sealing Preheating; and resin sealing the preheated sealed body by the above-mentioned molding die for resin sealing; the step of preheating is performed by respectively arranging opposite to each other and heating the above-mentioned sealed body Heating the two heating surfaces of the two heating means on the heating surface, and preheating the sealed body from both sides, and at least a part of the heating surface of the heating means facing the sealed body has at least a part of the heating means The convex heating portion that protrudes in the direction of the sealed body.
根據本發明之樹脂密封方法，藉由具有彼此對向之加熱面之兩加熱手段而自兩側將被密封體預熱，故而，可有效地進行預熱。 According to the resin sealing method of the present invention, the sealed body is preheated from both sides by the two heating means having the heating faces opposed to each other, so that the preheating can be performed efficiently.
進而，根據本發明之樹脂密封方法，兩加熱手段中之至少一加熱手段具有面向被密封體之加熱面之至少一部分朝向接近被密封體之方向突出之凸狀加熱部，故而，可由該凸狀加熱部之突出高度或形狀，設定被密封體之至少一部分與凸狀加熱部之加熱面之間之距離，從而設定加熱程度，藉此，可對被密封體將每一部分適當地預熱。 Further, according to the resin sealing method of the present invention, at least one of the heating means has a convex heating portion that faces at least a part of the heating surface of the sealed body toward the direction in which the object to be sealed is protruded, so that the heating means can be convex The protruding height or shape of the heating portion sets the distance between at least a portion of the sealed body and the heating surface of the convex heating portion, thereby setting the degree of heating, whereby each portion of the sealed body can be appropriately preheated.
(10)於本發明之較佳之實施態樣中，上述兩加熱手段之對向之上述兩加熱面係於接近方向及分離方向上可進行相對移動，且上述兩加熱手段中之一加熱手段具有發熱體，且更包括如下步驟：於上述進行預熱之步驟之前，使上述兩加熱手段之上述兩加熱朝向接近方向移動，利用上述一加熱手段對另一加熱手段進行加熱。 (10) In a preferred embodiment of the present invention, the two heating surfaces facing the two heating means are relatively movable in the approaching direction and the separating direction, and one of the two heating means has a heating means The heating element further includes the step of moving the two heatings of the two heating means toward the approaching direction before the step of preheating, and heating the other heating means by the one heating means.
根據該實施態樣，於進行預熱之步驟之前，藉由具有發熱體之一加熱手段而預先對另一加熱手段進行加熱，藉此，於其後進行預熱之步驟中，可利用來自一加熱手段之發熱體之發熱與另一加熱手段之餘熱加熱被密封體。 According to this embodiment, before the step of preheating, another heating means is heated in advance by one heating means having a heating element, whereby the step of preheating is used in the step of preheating The heat generated by the heating means of the heating means and the remaining heat of the other heating means heat the sealed body.
(11)於本發明之其他實施態樣中，上述進行預熱之步驟係藉由上述兩加熱手段之兩加熱面，而自兩側夾持著上述被密封體之至少一部分進行加熱。 (11) In another embodiment of the present invention, the step of preheating is performed by heating at least a part of the sealed body from both sides by the heating surfaces of the two heating means.
根據該實施態樣，進行預熱之步驟係藉由兩加熱手段而自兩側夾持著被密封體之至少一部分進行加熱，故而，可對被密封體之上述至少一部分集中地進行預熱。 According to this embodiment, the step of preheating is performed by heating at least a part of the body to be sealed from both sides by the two heating means, so that at least a part of the body to be sealed can be preheated intensively.
根據本發明，藉由具有彼此對向之加熱面之兩加熱手段，而自兩側將被密封體預熱，故而，可於短時間內有效地進行預熱。又，兩加熱手段中之至少一加熱手段具有面向被密封體之加熱面之至少一部分朝向接近密封體之方向突出之凸狀加熱部，故而，可藉由該凸狀加熱部而設定被密封體之至少一部分之加熱程度，藉此，可對被密封體將每一部分適當地預熱。 According to the present invention, since the sealed body is preheated from both sides by the two heating means having the heating faces opposed to each other, the preheating can be efficiently performed in a short time. Further, at least one of the heating means has a convex heating portion that faces at least a part of the heating surface of the sealed body toward the direction close to the sealing body, so that the sealed body can be set by the convex heating portion At least a portion of the degree of heating, whereby each portion of the body to be sealed is suitably preheated.
1‧‧‧搬入單元 1‧‧‧ moving into the unit
2‧‧‧成形單元 2‧‧‧forming unit
3‧‧‧搬出單元 3‧‧‧ Moving out of the unit
4‧‧‧接收部 4‧‧‧ Receiving Department
5‧‧‧預熱部 5‧‧‧Preheating department
6‧‧‧托盤冷卻部 6‧‧‧Tray Cooling Department
7‧‧‧托盤貯存部 7‧‧‧Tray storage department
8‧‧‧被密封體 8‧‧‧Blocked body
9‧‧‧托盤 9‧‧‧Tray
10‧‧‧第1預熱機構 10‧‧‧1st preheating mechanism
11‧‧‧第2預熱機構 11‧‧‧2nd preheating mechanism
12‧‧‧冷卻機構 12‧‧‧Cooling mechanism
13‧‧‧成形模 13‧‧‧ Forming die
14‧‧‧衝壓機構 14‧‧‧Punching mechanism
15‧‧‧分離部 15‧‧‧Departure Department
16‧‧‧送出部 16‧‧‧Send out
17‧‧‧銷 17‧‧ ‧ sales
18‧‧‧基板 18‧‧‧Substrate
19‧‧‧散熱板 19‧‧‧Dissipation plate
20‧‧‧連接器 20‧‧‧Connector
20a‧‧‧筒狀部 20a‧‧‧Cylinder
20b‧‧‧凸緣部 20b‧‧‧Flange
21‧‧‧安裝孔 21‧‧‧Installation holes
22‧‧‧封裝 22‧‧‧Package
23‧‧‧密封樹脂 23‧‧‧ Sealing resin
24‧‧‧開口 24‧‧‧ openings
25‧‧‧上加熱塊 25‧‧‧Upper heating block
26‧‧‧下加熱塊 26‧‧‧lower heating block
27‧‧‧上預熱塊(加熱體) 27‧‧‧Upheating block (heating body)
27a‧‧‧第1凸狀加熱部 27a‧‧‧1st convex heating part
27a1、28a1、28b1‧‧‧凹部 27a 1 , 28a 1 , 28b 1 ‧ ‧ recess
28‧‧‧下預熱塊(加熱體) 28‧‧‧Unheating block (heating body)
28a‧‧‧第2凸狀加熱部 28a‧‧‧2nd convex heating part
28b、28c‧‧‧第3凸狀加熱部 28b, 28c‧‧‧3rd convex heating part
29‧‧‧搬入搬出機構 29‧‧‧ Moving into and out of the organization
圖1係表示本發明之一實施形態之樹脂密封裝置之概略構成之俯視圖。 Fig. 1 is a plan view showing a schematic configuration of a resin sealing device according to an embodiment of the present invention.
圖2A係表示被密封體之前視圖。 Fig. 2A is a front view showing the sealed body.
圖2B係表示被密封體之俯視圖。 Fig. 2B is a plan view showing the sealed body.
圖3A係表示成品之封裝之前視圖。 Figure 3A is a front view of the package of the finished product.
圖3B係表示成品之封裝之俯視圖。 Figure 3B is a plan view showing the package of the finished product.
圖4係表示將被密封體進行預熱之狀態之剖面圖。 Fig. 4 is a cross-sectional view showing a state in which the sealed body is preheated.
圖5係沿圖4之A-A線之剖面圖。 Figure 5 is a cross-sectional view taken along line A-A of Figure 4.
圖6係本發明之其他實施形態之對應於圖4之剖面圖。 Figure 6 is a cross-sectional view corresponding to Figure 4 of another embodiment of the present invention.
以下，根據圖式對本發明之實施形態進行詳細說明。 Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
圖1係本發明之一實施形態之樹脂密封裝置之概略俯視圖。 Fig. 1 is a schematic plan view of a resin sealing device according to an embodiment of the present invention.
該實施形態之樹脂密封裝置具備搬入單元1、兩個成形單元2、及搬出單元3。搬入單元1係自前步驟接收應進行樹脂密封之下述之被 密封體(未圖示)。成形單元2係藉由將自搬入單元1接收之被密封體樹脂密封而形成樹脂密封體。搬出單元3係對自成形單元2接收之樹脂密封體實施特定之後處理，完成單個之封裝，且將該等封裝送出。 The resin sealing device of this embodiment includes a loading unit 1, two molding units 2, and a carry-out unit 3. The loading unit 1 receives the following resin which should be sealed with a resin from the previous step. Sealing body (not shown). The molding unit 2 is formed by sealing a sealed body resin received from the loading unit 1 to form a resin sealing body. The unloading unit 3 performs a specific post-processing on the resin sealing body received from the forming unit 2, completes a single package, and delivers the packages.
搬入單元1包括：接收部4，其接收被密封體；預熱部5，其將被密封體進行預熱；托盤冷卻部6，其將配置有被密封體之托盤9進行冷卻；以及托盤貯存部7。接收部4係將自前步驟接收之被密封體配置於托盤9之特定之位置。預熱部5係自接收部4接收托盤9，將配置於托盤9之被密封體進行預熱。托盤冷卻部6係將經預熱之被密封體搬送至成形單元2後，冷卻變空的托盤9。托盤貯存部7係將冷卻至室溫程度之托盤9堆積貯存。 The loading unit 1 includes a receiving portion 4 that receives the sealed body, a preheating portion 5 that preheats the sealed body, a tray cooling portion 6 that cools the tray 9 on which the sealed body is disposed, and a tray storage Department 7. The receiving unit 4 arranges the sealed body received from the previous step at a specific position of the tray 9. The preheating unit 5 receives the tray 9 from the receiving unit 4, and preheats the sealed body placed on the tray 9. The tray cooling unit 6 conveys the preheated sealed body to the forming unit 2, and then cools the empty tray 9. The tray storage unit 7 stores and stores the tray 9 which has been cooled to room temperature.
配置有被密封體之托盤9係藉由未圖示之移送機構而移送至預熱部5。將由預熱部5預熱之被密封體搬送至成形單元2後之變空的托盤9係藉由未圖示之移送機構，而經由托盤冷卻部6移送至托盤貯存部7。 The tray 9 on which the sealed body is placed is transferred to the preheating unit 5 by a transfer mechanism (not shown). The empty tray 9 that has been transported to the molding unit 2 by the preheating unit 5 is transferred to the tray storage unit 7 via the tray cooling unit 6 by a transfer mechanism (not shown).
於該實施形態中，預熱部5包括：第1預熱機構10，其自下表面側對配置於托盤9之被密封體進行預熱；以及第2預熱機構11，其如下所述地自上下兩表面側對配置於托盤9之被密封體進行預熱，且第1預熱機構10配備有兩個。 In the embodiment, the preheating unit 5 includes a first preheating mechanism 10 that preheats the sealed body disposed on the tray 9 from the lower surface side, and a second preheating mechanism 11 as follows. The sealed body disposed on the tray 9 is preheated from the upper and lower surface sides, and the first preheating mechanism 10 is provided with two.
沿著托盤9之移送方向設置有兩個第1預熱機構10、及一個第2預熱機構11。依序使配置有被密封體之托盤9移動至兩個第1預熱機構10之上，並依序配置於各個第1預熱機構10上進行預熱。藉此，可緩慢地加熱配置於托盤9之被密封體。各第1預熱機構10係使用加熱塊等，不介隔托盤9地直接預熱配置於托盤9之被密封體。關於第2預熱機構11 將於下文敍述。 Two first preheating mechanisms 10 and one second preheating mechanism 11 are provided along the transfer direction of the tray 9. The tray 9 on which the sealed body is placed is sequentially moved to the two first preheating mechanisms 10, and sequentially placed on each of the first preheating mechanisms 10 to be preheated. Thereby, the sealed body disposed on the tray 9 can be slowly heated. Each of the first preheating mechanisms 10 uses a heating block or the like to directly preheat the sealed body placed on the tray 9 without interposing the tray 9. About the second preheating mechanism 11 It will be described below.
又，於托盤冷卻部6中沿著空托盤9之移送方向設置有三個冷卻機構12。 Further, three cooling mechanisms 12 are provided in the tray cooling unit 6 along the transfer direction of the empty tray 9.
該實施形態之樹脂密封裝置具備兩個成形單元2，且於各成形單元2設置有具有由相對向之上模與下模構成之1對成形模13之衝壓機構14。又，藉由未圖示之拾取器件，而將經預熱之被密封體移載至搬入搬出機構29後，移送搬入至成形模13，另一方面，自成形模13將樹脂密封後之樹脂密封體分別搬出，且搬出至搬出單元3。 The resin sealing device of this embodiment includes two molding units 2, and each molding unit 2 is provided with a press mechanism 14 having a pair of molding dies 13 which are opposed to the upper mold and the lower mold. In addition, the preheated sealed body is transferred to the loading/unloading mechanism 29 by a pick-up device (not shown), and then transferred to the molding die 13, and the resin sealed from the molding die 13 is resin-sealed. The sealed bodies are respectively carried out and carried out to the carry-out unit 3.
成形模13係構成為不僅具有上模及下模以外，更具有中間模。該成形模13係用於使用周知之轉注成形技術進行樹脂密封之成形模。對成形模13之構成要素進行簡單說明。於下模設置有罐，其貯存樹脂材料；及柱塞，其於罐中升降自如地嵌入，且擠壓流動性樹脂。於上模設置有槽，其係樹脂材料熔融而形成之流動性樹脂進行流動之空間；流道，其係移送流動性樹脂之通路；及模穴，其係填充流動性樹脂之空間。 The forming die 13 is configured to include not only an upper die and a lower die but also an intermediate die. This molding die 13 is used for a resin-sealed molding die using a well-known transfer molding technique. The constituent elements of the forming die 13 will be briefly described. The lower mold is provided with a tank for storing a resin material; and a plunger which is freely and detachably embedded in the tank and which is squeezing the fluid resin. The upper mold is provided with a groove which is a space in which the fluid resin formed by melting the resin material flows; a flow path which is a passage for transferring the fluid resin; and a cavity which fills the space of the fluid resin.
搬出單元3中包括：分離部15，其自成形單元2接收樹脂密封後之樹脂密封體，且將多餘之部分自樹脂密封體中分離，藉此，形成單個之封裝；以及送出部16，其將作為成品之單個之封裝送出至下一步驟。 The unloading unit 3 includes a separating portion 15 that receives the resin-sealed resin sealing body from the forming unit 2, and separates the excess portion from the resin sealing body, thereby forming a single package; and the delivery portion 16, which The individual package as a finished product is sent to the next step.
其次，對由該實施形態之樹脂密封裝置進行樹脂密封之被密封體、及作為將樹脂密封後之樹脂密封體之多餘部分去除而成的成品之封裝進行說明。 Next, the sealed body which is resin-sealed by the resin sealing device of this embodiment, and the package of the finished product which removes the excess part of the resin sealing body after resin sealing are demonstrated.
圖2A、圖2B係表示被密封體8之圖，且圖2A為其前視圖，圖2B為俯視圖。 2A and 2B are views showing the sealed body 8, and Fig. 2A is a front view thereof, and Fig. 2B is a plan view.
被密封體8例如為輸送機器用之電子控制單元，且具有：基板18，其裝載有半導體元件等未圖示之零件；及散熱板19，其由銅板等構成。進而，於基板18上安裝有電源及用以收發信號之連接器20。連接器20係由樹脂製之外殼構成，且具有銷17，經由該銷17電性連接於基板18。連接器20之外殼具備筒狀部20a及矩形之凸緣部20b。連接器20中之基板18側之端部成為與密封後之密封樹脂23之間之邊界部。散熱板19具有用以安裝密封後之樹脂密封體之安裝孔21。 The sealed body 8 is, for example, an electronic control unit for a transport device, and includes a substrate 18 on which components (not shown) such as semiconductor elements are mounted, and a heat dissipation plate 19 made of a copper plate or the like. Further, a power source and a connector 20 for transmitting and receiving signals are mounted on the substrate 18. The connector 20 is formed of a resin case and has a pin 17 electrically connected to the substrate 18 via the pin 17. The outer casing of the connector 20 is provided with a tubular portion 20a and a rectangular flange portion 20b. The end portion of the connector 20 on the side of the substrate 18 serves as a boundary portion with the sealing resin 23 after sealing. The heat sink 19 has a mounting hole 21 for mounting a sealed resin sealing body.
被密封體8之基板18既可為玻璃環氧基板等基材中包含樹脂之基板，亦可為金屬基底基板等以金屬為基材之基板，且可為陶瓷基板或矽酮等半導體基板，進而亦可為導線架等。 The substrate 18 of the sealed body 8 may be a substrate including a resin in a substrate such as a glass epoxy substrate, a substrate made of a metal substrate such as a metal base substrate, or a semiconductor substrate such as a ceramic substrate or an anthrone. Further, it can be a lead frame or the like.
圖3A、圖3B係表示自樹脂密封後之樹脂密封體將多餘部分分離所得的成品即封裝之圖，圖3A為其前視圖，圖3B為俯視圖。 3A and 3B are views showing a package obtained by separating a redundant portion of the resin sealing body after resin sealing, and FIG. 3A is a front view thereof, and FIG. 3B is a plan view.
封裝22具有由硬化樹脂構成之密封樹脂23。密封樹脂23係以完全地覆蓋連接器20之銷17、基板18、及裝載於基板18上之零件之方式形成。 The package 22 has a sealing resin 23 made of a hardened resin. The sealing resin 23 is formed to completely cover the pin 17 of the connector 20, the substrate 18, and the components mounted on the substrate 18.
封裝22係藉由自樹脂密封體將多餘之樹脂分離而完成。密封樹脂23例如使用環氧樹脂或矽酮樹脂等熱硬化性樹脂材料。 The package 22 is completed by separating excess resin from the resin sealing body. As the sealing resin 23, for example, a thermosetting resin material such as an epoxy resin or an fluorenone resin is used.
其次，說明該實施形態之第2預熱機構11對被密封體8之預熱。 Next, the preheating of the to-be-sealed body 8 by the 2nd preheating mechanism 11 of this embodiment is demonstrated.
圖4係表示藉由第2預熱機構11來預熱被密封體8之狀態之剖面圖，圖5係沿著圖4之A-A線之剖面圖。 Fig. 4 is a cross-sectional view showing a state in which the sealed body 8 is preheated by the second preheating mechanism 11, and Fig. 5 is a cross-sectional view taken along line A-A of Fig. 4.
作為搬送構件之托盤9係支持著被密封體8之周緣部進行搬 送者，且形成有與被密封體8之連接器20及基板18等對應之開口24。 The tray 9 as a conveying member supports the peripheral portion of the sealed body 8 to be moved. The feeder 24 is formed with an opening 24 corresponding to the connector 20 of the sealed body 8 and the substrate 18 and the like.
第2預熱機構11具有上加熱塊25及下加熱塊26，且兩加熱塊25、26可於上下方向上接近、分離移動。於各加熱塊25、26，分別設置有匣式加熱器等(未圖示)發熱體，且可對發熱體進行控制，調節各加熱塊25、26之溫度。 The second preheating mechanism 11 has an upper heating block 25 and a lower heating block 26, and the two heating blocks 25 and 26 are movable in the vertical direction. Each of the heating blocks 25 and 26 is provided with a heating element such as a rake heater (not shown), and the heating element can be controlled to adjust the temperature of each of the heating blocks 25 and 26.
如上所述，被密封體8具有熱容量較大之樹脂製之連接器20，並且，該連接器20具有與基板18及散熱板19之類的平板狀不同之筒狀部20a及凸緣部20b，且為了防止與密封樹脂23之邊界部中之剝離，而必需充分地進行預熱。另一方面，需要裝載有半導體元件等之基板18，以免被急遽地加熱。 As described above, the sealed body 8 has the connector 20 made of resin having a large heat capacity, and the connector 20 has the tubular portion 20a and the flange portion 20b which are different from the flat plate shape such as the substrate 18 and the heat radiating plate 19. In order to prevent peeling from the boundary portion of the sealing resin 23, it is necessary to sufficiently perform preheating. On the other hand, it is necessary to mount the substrate 18 with a semiconductor element or the like so as not to be heated rapidly.
該實施形態係為了可對具有特殊之形狀部分或熱容量不同之材質部分之被密封體8有效且每一部分地適當進行預熱，而以如下之方式構成。 This embodiment is configured to be effective for the sealed body 8 having a special shape portion or a material portion having a different heat capacity, and to preheat each portion as appropriate.
於各加熱塊25、26上分別可裝卸地安裝有作為具有將被密封體8加熱之加熱面之上下之加熱體的預熱塊27、28，且兩預熱塊27、28之加熱面(表面)彼此對向。 Preheating blocks 27, 28 as heating bodies having heating surfaces above the heating surface to be sealed, and heating surfaces of the two preheating blocks 27, 28 are detachably attached to the respective heating blocks 25, 26 ( Surface) opposite each other.
藉由上加熱塊25及上預熱塊27而構成一加熱手段，且藉由下加熱塊26及下預熱塊28而構成另一加熱手段。 A heating means is formed by the upper heating block 25 and the upper preheating block 27, and another heating means is formed by the lower heating block 26 and the lower preheating block 28.
圖4及圖5係表示如下之狀態：於彼此分離之狀態之上下之預熱塊27、28間，將配置有被密封體8之托盤9搬送至特定位置後，使上下之預熱塊27、28於接近方向上移動，支持著被密封體8自上下兩側進行預熱。 4 and 5 show a state in which the trays 9 on which the sealed body 8 is placed are transported to a specific position between the preheating blocks 27 and 28 which are separated from each other, and the upper and lower preheating blocks 27 are placed. , 28 moves in the approaching direction, and supports the preheating of the sealed body 8 from the upper and lower sides.
該實施形態之第2預熱機構11係將密封體8如連接器20之部分、基板18之部分等使加熱程度局部不同地進行預熱。 In the second preheating mechanism 11 of the embodiment, the sealing body 8 such as the portion of the connector 20 and the portion of the substrate 18 are preheated in a partially different degree of heating.
具體而言，上下之各預熱塊27、28分別具有使面向被密封體8之加熱面局部地於接近被密封體8之方向上突出之第1~第3凸狀加熱部27a、28a、28b。 Specifically, each of the upper and lower preheating blocks 27 and 28 has first to third convex heating portions 27a and 28a that partially protrude from the heating surface facing the sealed body 8 in a direction approaching the to-be-sealed body 8, 28b.
即，上預熱塊27係具有面向連接器20之部分朝向接近連接器20之方向(下方)突出，以使被密封體8之樹脂製之連接器20之部分可與基板18及散熱板19相比集中進行加熱之大致長方體狀之第1凸狀加熱部27a。 That is, the upper preheating block 27 has a portion facing the connector 20 so as to protrude toward the connector 20 (downward) so that a portion of the resin-made connector 20 of the sealed body 8 can be combined with the substrate 18 and the heat dissipation plate 19. The first convex heating portion 27a has a substantially rectangular parallelepiped shape in which heating is concentrated.
又，下預熱塊28係具有面向連接器20之部分朝向接近連接器20之方向(上方)突出，以使被密封體8之樹脂製之連接器20之部分可與基板18及散熱板19相比集中進行加熱之大致長方體狀之第2凸狀加熱部28a。又，下預熱塊28具有面向散熱板19之部分朝向接近散熱板19之方向突出之第3凸狀加熱部28b。 Further, the lower preheating block 28 has a portion facing the connector 20 so as to protrude toward the connector 20 (upward) so that a portion of the resin-made connector 20 of the sealed body 8 can be combined with the substrate 18 and the heat sink 19. The second convex heating portion 28a has a substantially rectangular parallelepiped shape that is heated intensively. Further, the lower preheating block 28 has a third convex heating portion 28b that protrudes toward the heat radiating plate 19 in a direction toward the heat radiating plate 19.
上預熱塊27之第1凸狀加熱部27a具有作為突出端之前端部以自上方及左右包圍被密封體8之連接器20之筒狀部20a及凸緣部20b之方式凹陷之凹部27a1。 The first convex heating portion 27a of the upper preheating block 27 has a concave portion 27a recessed so as to surround the cylindrical portion 20a and the flange portion 20b of the connector 20 of the sealed body 8 from the upper end and the left end. 1 .
下預熱塊28之第2凸狀加熱部28a具有作為突出端之前端部以接收被密封體8之連接器20之下部之方式較淺地凹陷之凹部28a1。 The second convex heating portion 28a of the lower preheating block 28 has a concave portion 28a 1 which is shallowly recessed as a front end portion of the protruding end to receive the lower portion of the connector 20 of the sealed body 8.
又，下預熱塊28之第3凸狀加熱部28b係具有以於與散熱板19之間保持間隙之方式向下方凹陷之凹部28b1，以避免急遽地加熱散熱板19上之基板18。該凹部28b1係以與散熱板19上之基板18對應之方式形 成。進而，於上預熱塊27之面向基板18之加熱面，未設置朝向接近基板18之方向突出之凸狀加熱部，而於上預熱塊27與基板18之間確保有充分之間隔，避免將基板18急遽地加熱。 Further, preheating the third convex block 28 of the heating portion 28b has a line of a gap between the holder and the heat radiating plate 19 in the concave portion of the lower recess 28b. 1, to avoid abruptly heat the radiator plate 19 on the substrate 18 The recess 28b 1 is formed to correspond to the substrate 18 on the heat dissipation plate 19. Further, in the heating surface of the upper preheating block 27 facing the substrate 18, a convex heating portion protruding toward the substrate 18 is not provided, and a sufficient interval is ensured between the upper preheating block 27 and the substrate 18 to avoid The substrate 18 is heated rapidly.
如此構成之第2預熱機構11係於上下之預熱塊27、28彼此分離之狀態下，藉由托盤9而將被密封體8搬入至兩預熱塊27、28之間。 In the second preheating mechanism 11 configured as described above, the sealed body 8 is carried between the two preheating blocks 27 and 28 by the tray 9 in a state where the upper and lower preheating blocks 27 and 28 are separated from each other.
繼而，兩預熱塊27、28彼此接近移動，將被密封體8之連接器20之部分夾入上下之預熱塊27、28之間，並且支持被密封體8之散熱板19之周緣部分。 Then, the two preheating blocks 27, 28 are moved close to each other, and the portion of the connector 20 to be sealed 8 is sandwiched between the upper and lower preheating blocks 27, 28, and the peripheral portion of the heat radiating plate 19 of the sealed body 8 is supported. .
上下之加熱塊25、26之發熱係經由上下之預熱塊27、28之具有凹部27a1、28a1之第1、第2凸狀加熱部27a、28a，直接傳導至被密封體8之連接器20之部分。藉此，可集中地預熱樹脂製之連接器20之部分，另一方面，使散熱板19經由下預熱塊28之第3凸狀加熱部28b進行加熱。此處，於散熱板19上之基板18之部分，由第3凸狀加熱部28b之凹部28b1確保空間，故而可防止該部分被急遽地加熱。 The heat generation of the upper and lower heating blocks 25 and 26 is directly transmitted to the sealed body 8 via the first and second convex heating portions 27a and 28a having the concave portions 27a 1 and 28a 1 of the upper and lower preheating blocks 27 and 28 Part of the device 20. Thereby, the portion of the resin-made connector 20 can be collectively preheated, and on the other hand, the heat dissipation plate 19 is heated by the third convex heating portion 28b of the lower preheating block 28. Here, the portion of the substrate on the heat radiation plate 1918, the third by a recess 28b of the convex portion 28b is heated. 1 to secure a space, and therefore this portion is prevented from abruptly heated.
如此熱容量較大且具有筒狀部20a等之樹脂製之連接器20之部分係以藉由第1凸狀加熱部27a及第2凸狀加熱部28a夾持其外形之方式進行加熱，故而可於短時間內充分地進行加熱。藉此，於成形單元2中之樹脂密封時，可降低連接器20之部分與密封樹脂23之邊界部分之溫度差，從而可使連接器20之樹脂與密封樹脂23之密接性提昇，防止邊界部中之剝離。 The portion of the connector 20 made of resin having a large heat capacity and having the tubular portion 20a and the like is heated so as to sandwich the outer shape of the first convex heating portion 27a and the second convex heating portion 28a. The heating is sufficiently performed in a short time. Thereby, when the resin in the forming unit 2 is sealed, the temperature difference between the portion of the connector 20 and the boundary portion of the sealing resin 23 can be lowered, so that the adhesion between the resin of the connector 20 and the sealing resin 23 can be improved, and the boundary can be prevented. Stripping in the ministry.
又，散熱板19上之基板18之部分係由第3凸狀加熱部28b之凹部28b1確保空間，故而可防止基板18之部分被急遽地加熱。 Further, the substrate 19 on the heat dissipation plate portion 18 of the third line by a recess 28b of the convex portion 28b is heated to secure a space. 1, and therefore prevents the portion of the substrate 18 is heated abruptly.
上下之預熱塊27、28係可裝卸地安裝於上下之加熱塊25、26。因此，預先根據應預熱之被密封體8之種類，準備形狀或材質(即熱導率)等不同之複數種預熱塊27、28。於更換進行樹脂密封之被密封體8之情形時，將安裝於加熱塊25、26之預熱塊27、28更換為與被密封體8對應者。藉此，亦可容易地應對種類不同之被密封體8。 The upper and lower preheating blocks 27, 28 are detachably attached to the upper and lower heating blocks 25, 26. Therefore, a plurality of types of preheating blocks 27 and 28 having different shapes, materials (i.e., thermal conductivity) and the like are prepared in advance according to the type of the body 8 to be preheated. When the sealed body 8 to be resin-sealed is replaced, the preheating blocks 27 and 28 attached to the heating blocks 25 and 26 are replaced with the sealed body 8. Thereby, it is also possible to easily cope with the sealed body 8 of a different type.
於該實施形態中，下預熱塊28之第3凸狀加熱部28b係構成為具有以於與散熱板19之間保持間隙之方式凹陷之凹部28b1，以避免急遽地加熱散熱板19上之基板18，但作為本發明之其他實施形態，亦可例如圖6所示，藉由與其他部分相比熱導率較小之材質、例如氟樹脂或陶瓷等而構成第3凸狀加熱部28c，藉此，亦可避免急遽地加熱基板18之部分。 In this embodiment, the third preheating heating convex portion 28b of the block 28 to maintain the system is configured to have a concave portion in the recess of a gap between the plate 19 and the radiator 28b. 1, to avoid abruptly heat the heat radiating plate 19 In the other embodiment of the present invention, as shown in FIG. 6, for example, the third convex heating portion 28c may be formed of a material having a smaller thermal conductivity than other portions, such as a fluororesin or ceramic. Thereby, it is also possible to avoid urgency heating of the portion of the substrate 18.
其次，參照圖1~圖5，說明該實施形態之樹脂密封方法。首先，如圖1所示，準備複數個結合被密封體而製作之托盤9。將該等托盤9積層地配置於托盤貯存部7。 Next, a resin sealing method of this embodiment will be described with reference to Figs. 1 to 5 . First, as shown in Fig. 1, a plurality of trays 9 which are combined with the sealed body are prepared. These trays 9 are placed in a stack on the tray storage unit 7.
繼而，如圖1所示，將1個托盤9自托盤貯存部7移送至接收部4。於該步驟中，既可由作業者移送托盤9，亦可使用適當之移送器件。 Then, as shown in FIG. 1, one tray 9 is transferred from the tray storage unit 7 to the receiving unit 4. In this step, the tray 9 can be transferred by the operator or an appropriate transfer device can be used.
繼而，將複數個被密封體配置於托盤9。再者，亦可預先將分別配置有複數個被密封體之複數個托盤9積層地配置於托盤貯存部7。於此情形時，將配置有被密封體之1個托盤9自托盤貯存部7移送至接收部4。又，亦可將配置有被密封體之1個托盤9自前步驟移送至接收部4。 Then, a plurality of sealed bodies are placed on the tray 9. Further, a plurality of trays 9 each having a plurality of sealed bodies arranged therein may be stacked in advance in the tray storage portion 7. In this case, one tray 9 on which the sealed body is placed is transferred from the tray storage unit 7 to the receiving unit 4. Further, one tray 9 on which the sealed body is placed may be transferred from the previous step to the receiving unit 4.
繼而，使用未圖示之移送機構，將配置有被密封體之托盤9移送至具有三個第1、第2預熱機構10、10、11之預熱部5。於預熱部5中設置有加熱塊作為第1預熱機構10。使用未圖示之移送機構，依序將配置 有被密封體之托盤9移送至第1預熱機構10、10之加熱塊上。藉此，緩慢地加熱配置於托盤9上之被密封體。 Then, the tray 9 on which the sealed body is placed is transferred to the preheating unit 5 having the three first and second preheating mechanisms 10, 10, and 11 by a transfer mechanism (not shown). A heating block is provided in the preheating unit 5 as the first preheating mechanism 10. Use a transfer mechanism not shown, in order The tray 9 having the sealed body is transferred to the heating block of the first preheating mechanisms 10 and 10. Thereby, the sealed body disposed on the tray 9 is slowly heated.
進而，藉由第2預熱機構11，以如上之方式進行預熱。 Further, the second preheating mechanism 11 performs preheating as described above.
即，第2預熱機構11係於圖4及圖5所示之上下之預熱塊27、28彼此分離之狀態下，藉由托盤9而將被密封體8搬入至兩預熱塊27、28之間。 In other words, the second preheating mechanism 11 carries the sealed body 8 into the two preheating blocks 27 by the tray 9 in a state in which the preheating blocks 27 and 28 are separated from each other as shown in FIGS. 4 and 5 . Between 28.
繼而，兩預熱塊27、28彼此接近移動，將被密封體8之連接器20之部分夾入上下之預熱塊27、28之間，並且支持著散熱板19之周緣部進行加熱。 Then, the two preheating blocks 27, 28 move close to each other, and the portion of the connector 20 to be sealed 8 is sandwiched between the upper and lower preheating blocks 27, 28, and the peripheral portion of the heat radiating plate 19 is supported for heating.
此時，藉由上下之加熱塊25、26而生成之熱經由上下之預熱塊27、28之第1、第2凸狀加熱部27a、28a，直接傳導至被密封體8之連接器20之部分，故而，可集中地對樹脂製之連接器20之部分進行預熱。另一方面，散熱板19經由下預熱塊28之第3凸狀加熱部28b進行預熱，故而，散熱板19上之基板18之部分藉由第3凸狀加熱部28b之凹部28b1而確保空間，避免過度地預熱。 At this time, the heat generated by the upper and lower heating blocks 25 and 26 is directly transmitted to the connector 20 of the sealed body 8 via the first and second convex heating portions 27a and 28a of the upper and lower preheating blocks 27 and 28. In part, the portion of the resin-made connector 20 can be preheated intensively. On the other hand, the third preheating heating convex portion 28 of the lower block 19 via the heat dissipation plate 28b preheating, therefore, the upper portion of the substrate of the heat radiating plate 1918 by a concave portion 3 of the convex portion 28b of the heating and 28b. 1 Ensuring space and avoiding excessive warm-up.
繼而，使用適當之移送機構，將配置有經預熱之被密封體之托盤9自圖1所示之預熱部5移送至托盤冷卻部6。 Then, the tray 9 on which the preheated sealed body is placed is transferred from the preheating portion 5 shown in Fig. 1 to the tray cooling portion 6 by using an appropriate transfer mechanism.
繼而，藉由未圖示之拾取器件，而利用搬入搬出機構29將經預熱之被密封體自托盤9移載，將該等被密封體搬入至成形模13之下模中之特定之位置進行配置。 Then, the pre-heated sealed body is transferred from the tray 9 by the loading/unloading mechanism 29 by a pick-up device (not shown), and the sealed body is carried into a specific position in the lower mold of the forming die 13 Configure it.
繼而，將配置之被密封體固定於下模之模面。而且，藉由將成形模13鎖模，而將安裝於被密封體之上表面之零件收容於設置在上模中 之模穴中。其後，將流動性樹脂填充於模穴中。 Then, the configured sealed body is fixed to the die face of the lower mold. Further, by clamping the molding die 13, the components attached to the upper surface of the sealed body are housed in the upper mold. In the cavity. Thereafter, the fluid resin is filled in the cavity.
繼而，於接著將成形模13鎖模之狀態下，使流動性樹脂硬化。藉此，形成包含密封樹脂23及多餘之樹脂之硬化樹脂。 Then, the fluid resin is cured in a state where the mold 13 is subsequently mold-locked. Thereby, a cured resin containing the sealing resin 23 and the excess resin is formed.
繼而，將成形模13開模。繼而，使用搬入搬出機構29，將樹脂密封體自成形單元2搬出至搬出單元3之分離部15。 Then, the forming die 13 is opened. Then, the resin sealing body is carried out from the molding unit 2 to the separation unit 15 of the unloading unit 3 by using the loading/unloading mechanism 29.
其次，於分離部15中，使用分離用夾具，將多餘之樹脂自各樹脂密封體中分離。該分離係藉由稱作澆口切斷、打澆口(degate)等之周知之方式而進行。藉由該步驟，而自樹脂密封體完成圖3所示之封裝22。 Next, in the separation unit 15, a separate jig is used to separate excess resin from each resin sealing body. This separation is carried out by means known as gate cutting, degate, and the like. By this step, the package 22 shown in Fig. 3 is completed from the resin sealing body.
繼而，使用適當之移送機構，將封裝22自分離部15移送至送出部16，送至下一步驟中。 Then, the package 22 is transferred from the separation unit 15 to the delivery unit 16 using an appropriate transfer mechanism, and is sent to the next step.
可藉由以如上之方式，利用預熱部5對自前步驟收取之被密封體進行預熱，使用成形模13將被密封體樹脂密封，形成樹脂密封體，且將多餘之樹脂自樹脂密封體中分離，而完成封裝22。 The sealed body collected from the previous step can be preheated by the preheating portion 5 as described above, and the sealed body resin can be sealed with the molding die 13 to form a resin sealing body, and the excess resin is supplied from the resin sealing body. The middle is separated and the package 22 is completed.
該實施形態係藉由預熱部5之第1、第2預熱機構10、10、11而將被密封體8直接且緩慢地加熱，直至將被密封體8搬入至成形單元2之成形模13為止，故而，可效率良好地且不造成熱衝擊地將被密封體8預熱至充分之溫度。進而，於第2預熱機構中，可集中地將樹脂製之連接器20之部分預熱，故而可於圖3A、圖3B所示之密封樹脂23與樹脂製之連接器20之間之邊界部減小溫度梯度。藉此，可使密封樹脂32與連接器20之間之密接性提昇，從而可抑制密封樹脂23之剝離。 In this embodiment, the sealed body 8 is directly and slowly heated by the first and second preheating mechanisms 10, 10, and 11 of the preheating unit 5 until the molded body 8 is carried into the forming die of the forming unit 2. Therefore, the sealed body 8 can be preheated to a sufficient temperature efficiently and without causing thermal shock. Further, in the second preheating mechanism, the portion of the resin-made connector 20 can be collectively preheated, so that the boundary between the sealing resin 23 and the resin-made connector 20 shown in Figs. 3A and 3B can be used. Reduce the temperature gradient. Thereby, the adhesion between the sealing resin 32 and the connector 20 can be improved, and peeling of the sealing resin 23 can be suppressed.
該實施形態係於上下之各加熱塊25、26中分別內置有加熱器等發熱體，將上下之預熱塊27、28加熱，但作為本發明之其他實施形態， 亦可僅於一加熱塊25(26)中內置發熱體。於此情形時，另一加熱塊26(25)之預熱塊28(27)於預熱被密封體8之前，使各預熱塊27、28接近移動而接觸。藉此，藉由具有發熱體之一加熱塊25(26)而將另一加熱塊26(25)之預熱塊28(27)加熱，另一加熱塊26(25)之預熱塊28(27)藉由其餘熱而將被密封體8加熱。根據其他實施形態，可實現加熱所需之電力之節省。 In this embodiment, a heating element such as a heater is incorporated in each of the upper and lower heating blocks 25 and 26, and the upper and lower preheating blocks 27 and 28 are heated. However, as another embodiment of the present invention, It is also possible to incorporate a heating element only in one heating block 25 (26). In this case, the preheating block 28 (27) of the other heating block 26 (25) causes the preheating blocks 27, 28 to move close to each other before preheating the sealed body 8. Thereby, the preheating block 28 (27) of the other heating block 26 (25) is heated by the heating block 25 (26) having one of the heating elements, and the preheating block 28 of the other heating block 26 (25) ( 27) The sealed body 8 is heated by the remaining heat. According to other embodiments, the power savings required for heating can be achieved.
於上述之實施形態中，第2預熱機構11係設置於預熱部5之最終段，但亦可設置於至成形單元2之樹脂密封用之成形模13為止之搬送路徑上之任何位置，例如亦可設置於成形單元2正前方之托盤冷卻部6或成形單元2中。 In the above embodiment, the second preheating mechanism 11 is provided in the final stage of the preheating unit 5, but may be provided at any position on the conveying path up to the molding die 13 for resin sealing of the molding unit 2. For example, it may be provided in the tray cooling unit 6 or the forming unit 2 directly in front of the forming unit 2.
該實施形態之樹脂密封裝置係設置有兩個成形單元2，但並不限定於兩個，亦可設置一個或三個以上之成形單元2。藉此，可容易地調整樹脂密封裝置之製造能力 The resin sealing device of this embodiment is provided with two molding units 2, but is not limited to two, and one or three or more molding units 2 may be provided. Thereby, the manufacturing ability of the resin sealing device can be easily adjusted
又，上述之實施形態係使用轉注成形，但並不限定於此，亦可使用射出成形或壓縮成形。 Further, although the above embodiment is formed by transfer molding, the present invention is not limited thereto, and injection molding or compression molding may be used.
於使用壓縮成形之情形時，於成形模13之下模設置模穴，且以如下之方式進行樹脂密封。即，首先，對模穴供給粉狀、粒狀、片(flake)狀(薄片狀)、塊狀、薄板狀等之樹脂材料。繼而，藉由將樹脂材料加熱而使其熔融，生成流動性樹脂。藉此，使模穴成為由流動性樹脂填充之狀態。繼而，藉由將成形模13鎖模，而將安裝於固定在上模之被密封體之下表面之零件浸漬於填充在模穴中之流動性樹脂中。繼而，接著加熱流動性樹脂使其硬化，藉此，形成硬化樹脂。藉由至此為止之步驟，形成樹脂密封體。 再者，亦可將常溫下為液狀之樹脂(液狀樹脂)供給至模穴。可藉由該方法，而使模穴成為由流動性樹脂填充之狀態。 In the case of using compression molding, a cavity is formed in the mold below the molding die 13, and resin sealing is performed in the following manner. That is, first, a resin material such as a powder, a granule, a flake (flaky), a block, or a thin plate is supplied to the cavity. Then, the resin material is heated and melted to form a fluid resin. Thereby, the cavity is filled in a state of being filled with a fluid resin. Then, by clamping the molding die 13, the member attached to the lower surface of the sealed body fixed to the upper mold is immersed in the fluid resin filled in the cavity. Then, the fluid resin is heated and hardened, whereby a hardened resin is formed. The resin sealing body is formed by the steps up to this point. Further, a resin (liquid resin) which is liquid at normal temperature may be supplied to the cavity. By this method, the cavity can be filled with a fluid resin.
上述實施形態係作為被密封體，應用於輸送機器用之電子控制單元進行了說明。並不限定於此，亦可將本發明應用於內燃機關、電動機、制動機構等各種用途中使用之電子控制單元。又，本發明並不限定於電子控制單元，亦適於具有特殊之形狀部分或不同之材質部分等之被密封體。作為此種例子，可列舉電力控制用之電力控制單元中使用之被密封體。進而，亦可將本發明應用於不具有特殊之形狀部分或熱容量之不同之材質部分等之通常之被密封體。 The above embodiment has been described as an electronic control unit for a transport device as a sealed body. The present invention is not limited to this, and the present invention can also be applied to an electronic control unit used in various applications such as an internal combustion engine, an electric motor, and a brake mechanism. Further, the present invention is not limited to the electronic control unit, and is also suitable for a sealed body having a special shape portion or a different material portion. As such an example, the to-be-sealed body used for the electric power control unit for electric power control is mentioned. Further, the present invention can also be applied to a conventional sealed body which does not have a special shape portion or a different material portion of a heat capacity.
1‧‧‧搬入單元 1‧‧‧ moving into the unit
2‧‧‧成形單元 2‧‧‧forming unit
3‧‧‧搬出單元 3‧‧‧ Moving out of the unit
4‧‧‧接收部 4‧‧‧ Receiving Department
5‧‧‧預熱部 5‧‧‧Preheating department
6‧‧‧托盤冷卻部 6‧‧‧Tray Cooling Department
7‧‧‧托盤貯存部 7‧‧‧Tray storage department
9‧‧‧托盤 9‧‧‧Tray
10‧‧‧第1預熱機構 10‧‧‧1st preheating mechanism
11‧‧‧第2預熱機構 11‧‧‧2nd preheating mechanism
12‧‧‧冷卻機構 12‧‧‧Cooling mechanism
13‧‧‧成形模 13‧‧‧ Forming die
14‧‧‧衝壓機構 14‧‧‧Punching mechanism
15‧‧‧分離部 15‧‧‧Departure Department
16‧‧‧送出部 16‧‧‧Send out
29‧‧‧搬入搬出機構 29‧‧‧ Moving into and out of the organization
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012090202A JP5774538B2 (en) | 2012-04-11 | 2012-04-11 | Resin sealing device and resin sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201341148A TW201341148A (en) | 2013-10-16 |
| TWI602677B true TWI602677B (en) | 2017-10-21 |
Family
ID=49327318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102105973A TWI602677B (en) | 2012-04-11 | 2013-02-21 | Resin sealing device and resin sealing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5774538B2 (en) |
| KR (1) | KR101667864B1 (en) |
| CN (1) | CN104081511B (en) |
| TW (1) | TWI602677B (en) |
| WO (1) | WO2013153721A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6049597B2 (en) * | 2013-11-28 | 2016-12-21 | Ｔｏｗａ株式会社 | Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus |
| CN107466159B (en) * | 2016-06-06 | 2022-07-19 | 宁波舜宇光电信息有限公司 | Molded circuit board of camera module and manufacturing equipment and manufacturing method thereof |
| CN107466160B (en) * | 2016-06-06 | 2022-04-29 | 宁波舜宇光电信息有限公司 | Equipment and method for manufacturing molded circuit board of camera module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW484192B (en) * | 1998-12-02 | 2002-04-21 | Hitachi Ltd | Semiconductor device, method of manufacturing the same, and electronic device |
| JP2004186418A (en) * | 2002-12-03 | 2004-07-02 | Sainekkusu:Kk | Resin sealing equipment |
| JP2011116084A (en) * | 2009-12-07 | 2011-06-16 | Towa Corp | Resin sealing apparatus and resin sealing method |
| TW201205690A (en) * | 2010-07-29 | 2012-02-01 | Towa Corp | Resin-encapsulation apparatus and manufacturing method of resin-encapsulated electronic component |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003318206A (en) * | 2002-04-23 | 2003-11-07 | Nec Semiconductors Kyushu Ltd | Semiconductor fabrication apparatus and its heater plate detaching jig |
| JP4115228B2 (en) * | 2002-09-27 | 2008-07-09 | 三洋電機株式会社 | Circuit device manufacturing method |
| JP4916810B2 (en) * | 2006-08-07 | 2012-04-18 | 住友重機械工業株式会社 | Resin sealing device |
| JP5157219B2 (en) * | 2007-03-29 | 2013-03-06 | 日本電気株式会社 | Manufacturing apparatus, heater plate attaching / detaching jig, and heater plate attaching / detaching method |
| JP4349437B2 (en) * | 2007-06-04 | 2009-10-21 | 株式会社デンソー | Manufacturing method of electronic device |
| JP5334822B2 (en) * | 2009-12-07 | 2013-11-06 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
-
2012
- 2012-04-11 JP JP2012090202A patent/JP5774538B2/en active Active
-
2013
- 2013-02-07 KR KR1020147021774A patent/KR101667864B1/en active IP Right Grant
- 2013-02-07 CN CN201380005305.5A patent/CN104081511B/en active Active
- 2013-02-07 WO PCT/JP2013/000679 patent/WO2013153721A1/en active Application Filing
- 2013-02-21 TW TW102105973A patent/TWI602677B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW484192B (en) * | 1998-12-02 | 2002-04-21 | Hitachi Ltd | Semiconductor device, method of manufacturing the same, and electronic device |
| JP2004186418A (en) * | 2002-12-03 | 2004-07-02 | Sainekkusu:Kk | Resin sealing equipment |
| JP2011116084A (en) * | 2009-12-07 | 2011-06-16 | Towa Corp | Resin sealing apparatus and resin sealing method |
| TW201205690A (en) * | 2010-07-29 | 2012-02-01 | Towa Corp | Resin-encapsulation apparatus and manufacturing method of resin-encapsulated electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5774538B2 (en) | 2015-09-09 |
| CN104081511B (en) | 2017-01-18 |
| KR101667864B1 (en) | 2016-10-19 |
| JP2013219275A (en) | 2013-10-24 |
| WO2013153721A1 (en) | 2013-10-17 |
| CN104081511A (en) | 2014-10-01 |
| TW201341148A (en) | 2013-10-16 |
| KR20140117482A (en) | 2014-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI260036B (en) | Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system | |
| CN107026107B (en) | Electronic component manufacturing apparatus and manufacturing method, and electronic component | |
| JP5824765B2 (en) | Resin molding method, resin molding apparatus, and supply handler | |
| KR101316289B1 (en) | Circuit apparatus and method for manufacturing the same | |
| TWI641471B (en) | Resin molding die and resin molding method | |
| JP5697919B2 (en) | Resin sealing device and resin sealing method | |
| TW201813469A (en) | Molded circuit board of camera module and manufacturing equipment and manufacturing method of molded circuit board | |
| JP4336499B2 (en) | Resin sealing molding method and apparatus for electronic parts | |
| JP6804410B2 (en) | Conveying mechanism, resin molding device, method of delivering the object to be molded to the molding mold, and method of manufacturing the resin molded product | |
| JP5985402B2 (en) | Resin sealing device and resin sealing method | |
| TWI728725B (en) | Resin molding device and manufacturing method of resin molded product | |
| TWI688056B (en) | Resin molding device and method for manufacturing resin molded product | |
| TWI602677B (en) | Resin sealing device and resin sealing method | |
| TWI706908B (en) | Conveying device, resin molding device, and manufacturing method of resin molded product | |
| JP5334822B2 (en) | Resin sealing device and resin sealing method | |
| JP6438794B2 (en) | Mold, resin molding apparatus and resin molding method | |
| TW201739015A (en) | Resin packaging device and resin packing method capable of corresponding to product type required for complicated manufacture forms, such as a double forming method of the substrate, two-sided forming method, etc. | |
| JP6611631B2 (en) | Resin molding method and resin molding apparatus | |
| JP3629124B2 (en) | Semiconductor device cooling device and manufacturing method thereof | |
| JP5308107B2 (en) | Circuit device manufacturing method | |
| KR101316273B1 (en) | Circuit apparatus | |
| JP5334821B2 (en) | Resin sealing device and resin sealing method | |
| JPH1190969A (en) | Method and device for molding and manufacture of semiconductor device | |
| JP2004090371A (en) | Mold for molding and method for manufacturing apparatus for mixed integrated circuit using it | |
| JP2015119080A (en) | Mold package |