JP4916810B2 - Resin sealing device - Google Patents

Resin sealing device Download PDF

Info

Publication number
JP4916810B2
JP4916810B2 JP2006214326A JP2006214326A JP4916810B2 JP 4916810 B2 JP4916810 B2 JP 4916810B2 JP 2006214326 A JP2006214326 A JP 2006214326A JP 2006214326 A JP2006214326 A JP 2006214326A JP 4916810 B2 JP4916810 B2 JP 4916810B2
Authority
JP
Japan
Prior art keywords
molded product
cooling
resin
sealing
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006214326A
Other languages
Japanese (ja)
Other versions
JP2008041933A (en
Inventor
博行 澤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2006214326A priority Critical patent/JP4916810B2/en
Priority to TW096128214A priority patent/TW200816331A/en
Priority to KR1020097002380A priority patent/KR20090026819A/en
Priority to CN2007800291946A priority patent/CN101501829B/en
Priority to PCT/JP2007/065249 priority patent/WO2008018379A1/en
Publication of JP2008041933A publication Critical patent/JP2008041933A/en
Application granted granted Critical
Publication of JP4916810B2 publication Critical patent/JP4916810B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C45/382—Cutting-off equipment for sprues or ingates disposed outside the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

本発明は、半導体製品を樹脂にて封止する樹脂封止装置の技術分野に関する。   The present invention relates to a technical field of a resin sealing device for sealing a semiconductor product with a resin.

従来、図９記載の半導体モールド装置（樹脂封止装置）１が公知である（特許文献１参照）。   Conventionally, a semiconductor mold apparatus (resin sealing apparatus) 1 shown in FIG. 9 is known (see Patent Document 1).

半導体モールド装置１は、半導体チップを樹脂モールドする成形装置１１と、この成形装置１１により樹脂モールドされたワーク１９を成形装置１１から取り出す取出し手段２５と、この取出し手段２５により取り出されたワーク（成形品）１９を受ける支持体２７と、この支持体２７に受けられたワーク１９を冷却する冷却手段３１と、前記支持体２７との間にワーク１９を押え込んで支持体２７と協働してワーク１９からゲートを折り取る押え手段（ゲートブレーク手段）３０と、前記冷却手段３１によりワーク１９を冷却する際にワーク１９を撮影する赤外線カメラ３２と、この赤外線カメラ３２により撮影された画像に基づきワーク１９の良否を判定する判定手段３３と、を備えた構成とされている。   The semiconductor molding apparatus 1 includes a molding apparatus 11 for resin-molding a semiconductor chip, a take-out means 25 for taking out a work 19 resin-molded by the forming apparatus 11 from the molding apparatus 11, and a work (molding) taken out by the take-out means 25. Article) 19, a support 27 that receives the support 19, a cooling means 31 that cools the work 19 received by the support 27, and the work 19 is pressed between the support 27 and cooperates with the support 27. Based on a presser means (gate break means) 30 for folding the gate from the work 19, an infrared camera 32 for photographing the work 19 when the work 19 is cooled by the cooling means 31, and an image photographed by the infrared camera 32. And a determination means 33 for determining whether the work 19 is good or bad.

樹脂封止装置では、金型内で樹脂封止された成形品は、完全に冷却される前（型から取り出すことが可能な程度にまで冷えると直ぐ）に取り出され、次の封止に備えて準備がなされる。これは装置のサイクルタイム向上等のために行なわれている。又、封止直後の成形品には、半導体チップ等の周囲に形成された本来の成形品（パーケージ部）の他に、封止工程での樹脂の通路等となるカル部やランナ部等に存在していた樹脂が冷えて固まったゲート部樹脂（不要樹脂）が一体となっている。そのため、このゲート部樹脂を取り除くための工程（ゲートブレーク工程）が設けられている。   In the resin sealing device, the molded product resin-sealed in the mold is taken out before being completely cooled (as soon as it is cooled to the extent that it can be taken out from the mold), and prepared for the next sealing. Preparations are made. This is done to improve the cycle time of the apparatus. In addition to the original molded product (package portion) formed around the semiconductor chip, the molded product immediately after sealing includes a cull portion and a runner portion that serve as a resin passage in the sealing process. The gate resin (unnecessary resin) in which the existing resin is cooled and hardened is integrated. Therefore, a process (gate break process) for removing the gate portion resin is provided.

一方、樹脂封止直後の成形品（型から取り出されたばかりの成形品）は、前述した通り未だ相当程度に高温であり、不用意にゲートブレーク工程に入ると本来取り除かれるべきゲート部の一部が残存したり、本来残るべき部分がゲート部と一緒に取り除かれてしまう等の不都合が生じる。これは、樹脂が未だ十分に冷却されていないことに起因するものであり、十分な冷却を行なうことにより回避することが可能である。   On the other hand, the molded product immediately after resin sealing (molded product just taken out of the mold) is still at a very high temperature as described above, and a part of the gate part that should be removed when the gate break process is inadvertently performed. Inconveniences such as remaining or a part that should originally remain is removed together with the gate part. This is due to the fact that the resin has not been sufficiently cooled, and can be avoided by sufficient cooling.

この点、半導体モールド装置１においても、押さえ手段（ゲートブレーク工程を行なう部分）３０と一体的に構成された冷却手段３１によってゲートブレーク工程前に事前の冷却が行なわれている。   In this respect, also in the semiconductor mold apparatus 1, prior cooling is performed before the gate break process by the cooling means 31 integrally formed with the holding means (portion for performing the gate break process) 30.

特開平７−５８１３７号公報JP-A-7-58137

しかしながら、このような構成ではゲートブレーク工程に入る直前になって初めて成形品を冷却することが出来るのであり、成形品がゲートブレーク出来る位置に配置されているにも関わらず、十分に冷却されるまで相応の時間待機している必要がある。この冷却時間（ゲートブレーク手段の待機時間）は、装置のサイクルタイムに直接影響するため、サイクルタイム短縮に対する阻害要因となってしまう。   However, in such a configuration, it is possible to cool the molded product only immediately before entering the gate break process, and the molded product is sufficiently cooled although it is disposed at a position where the gate break can be performed. It is necessary to wait for a reasonable time. This cooling time (the waiting time of the gate break means) directly affects the cycle time of the apparatus, and therefore becomes an impediment to cycle time reduction.

本発明は、このような問題を解決するべくなされたものであって、成形品を十分に冷却した上でゲートブレーク工程に入ることでゲートブレーク手段の待機時間を排除し樹脂封止装置のサイクルタイムを短縮しつつ、正確なゲートブレークを可能とする樹脂封止装置を提供することをその課題としている。   The present invention has been made to solve such a problem, and after sufficiently cooling the molded product, entering the gate break step eliminates the waiting time of the gate break means and cycles the resin sealing device. An object of the present invention is to provide a resin sealing device that enables accurate gate break while reducing time.

本発明は、半導体チップ等の被成形品を樹脂にて封止するための封止手段と、該封止手段で樹脂封止された成形品を冷却する冷却手段と、該冷却手段で冷却された成形品の不要樹脂を取り除くゲートブレーク手段と、前記封止手段で樹脂封止された成形品を前記冷却手段に搬送する第１搬送手段と、前記冷却手段で冷却された成形品を前記ゲートブレーク手段に搬送する第２搬送手段と、を備え、前記第２搬送手段が前記冷却手段で冷却された成形品を前記ゲートブレーク手段へ搬送すると、前記第１搬送手段が前記封止手段で樹脂封止された成形品を前記冷却手段に搬送する構成とされ、前記冷却手段は、前記成形品をセットするセット部と、該セット部にセットされた前記成形品に隣接するように設けられた冷却媒体通路と、前記冷却媒体通路に供給される冷却媒体と、を備え、更に、前記セット部に前記成形品をセットした状態で前記成形品を被覆可能なカバーを備え、該カバー内に前記冷却媒体通路が設けられていることで、上記課題を解決するものである。
The present invention includes a sealing means for sealing a molded article such as a semiconductor chip with a resin, a cooling means for cooling the molded article resin-sealed by the sealing means, and the cooling means Gate break means for removing unnecessary resin from the molded product, first transport means for transporting the resin-sealed molded product to the cooling means, and molding product cooled by the cooling means as the gate. Second conveying means for conveying to the break means, and when the second conveying means conveys the molded product cooled by the cooling means to the gate break means, the first conveying means is a resin by the sealing means. The sealed molded product is configured to be conveyed to the cooling unit, and the cooling unit is provided so as to be adjacent to the set unit for setting the molded product and the molded product set in the set unit. Cooling medium passage and said cooling medium Comprising a cooling medium supplied to the passage, and further comprising the coatable cover the molded article at setting the moldings to the mounting portion, the cooling medium passage is provided in the cover Thus, the above-described problems are solved.

このように、冷却専用の（冷却効果の高い）冷却手段を、封止手段とゲートブレーク手段との間に介在させ、搬送手段を介してゲートブレーク手段に搬送することにより、成形品がゲートブレーク手段に搬送された時点でゲートブレークするのに十分な程度にまで成形品を冷却しておくことが可能となる。その結果成形品がゲートブレーク手段に供給されると直ぐにゲートブレーク工程に入ることができ、ゲートブレーク手段における成形品の「冷却時間」を装置のサイクルタイム支配要因から排除することができる。又、十分に冷却された上でゲートブレークされるため、ゲート残り、ゲート折れ等を防止できる。   In this way, the cooling means dedicated to cooling (high cooling effect) is interposed between the sealing means and the gate break means, and is conveyed to the gate break means via the conveyance means, so that the molded product is gate-breaked. It becomes possible to cool the molded product to a degree sufficient for a gate break when it is conveyed to the means. As a result, as soon as the molded article is supplied to the gate break means, the gate break process can be started, and the “cooling time” of the molded article in the gate break means can be excluded from the cycle time controlling factor of the apparatus. In addition, since the gate is broken after being sufficiently cooled, it is possible to prevent the gate from being left and broken.

なお、特に、樹脂封止装置が、特定のゲートブレーク手段に対して封止手段が並列的に複数設けられているマルチプレスタイプとされている場合には、その構成上、１のゲートブレーク手段に対して次々と成形品が運ばれてくる。その結果、冷却時間に加えて「冷却のための待ち時間」が存在する。本発明をこのようなマルチプレスタイプの樹脂封止装置で実現すれば、この「冷却のための待ち時間」を利用して冷却でき、独立した（即ち搬送手段を介在させて）冷却手段を設けても、そのことによって装置のサイクルタイムを伸長する方向に影響することはない。更に、冷却手段を、複数の成形品を同時に冷却可能（複数の封止手段から搬送されてきた成形品を同時に冷却可能）なように構成すれば、より迅速に十分に冷却された成形品をゲートブレーク手段へと供給することが可能となる。 Incidentally, in particular, the resin sealing apparatus, when the sealing means is a parallel luma Ruchi press type has a plurality provided for the particular gate break means, its structure, first gate break One after another, the molded product is carried to the means. As a result, there is a “waiting time for cooling” in addition to the cooling time. If the present invention is realized by such a multi-press type resin sealing device, cooling can be performed by utilizing this “waiting time for cooling”, and an independent cooling unit (that is, via a conveying unit) is provided. However, this does not affect the direction of extending the cycle time of the apparatus. Furthermore, if the cooling means is configured so that a plurality of molded articles can be cooled at the same time (a molded article conveyed from a plurality of sealing means can be simultaneously cooled), a molded article that has been sufficiently cooled more quickly can be obtained. It becomes possible to supply to the gate break means.

又、上記冷却手段としては種々の構成を採用することができ、例えば以下のような構成とすることが考えられる。   Further, various configurations can be adopted as the cooling means, and for example, the following configurations can be considered.

又、前記冷却媒体をエアとして、前記セット部に、前記冷却媒体通路からセットされた前記成形品へと当該エアを導くエア噴出孔が備えられている構成とすれば、冷却媒体であるエアを直接成形品に噴射することができ、成形品を効率的に冷却できる。更に、希望するタイミングで希望する温度のエア（冷気）を簡易且つ自由に調整することができ、成形品の大きさや樹脂の種類に応じた最適な条件へと機動的に対応することが可能となる。   Further, if the cooling medium is air, and the air jet hole for guiding the air to the molded product set from the cooling medium passage is provided in the set portion, the air that is the cooling medium is provided. It can be directly injected onto the molded product, and the molded product can be efficiently cooled. Furthermore, the desired temperature air (cold air) can be adjusted easily and freely at the desired timing, and it is possible to flexibly respond to the optimum conditions according to the size of the molded product and the type of resin. Become.

更に、前記エア噴出時において、前記セット部にセットされた前記成形品を前記セット部に保持可能なクランプ構造を備えておけば、より強いエアの噴射が可能となり、冷却時間の短縮や更なる低温度までの冷却が可能となる。   Furthermore, if a clamp structure is provided that can hold the molded product set in the set part in the set part at the time of air ejection, stronger air can be injected, shortening the cooling time and further Cooling to a low temperature is possible.

又、更に、前記セット部に前記成形品をセットした状態で、該セット部を前記カバーに対して当接・離間可能なセット部移動機構を備えた構成とすれば、冷却時に成形品に発生し得る反りを最小限に抑えることが出来る。   Further, if the molded product is set in the set portion and the set portion is provided with a set portion moving mechanism capable of contacting and separating from the cover, the molded product is generated during cooling. The possible warpage can be minimized.

又、前記カバーを２分割構造とし、所定のタイミングで開閉可能に構成すれば、搬送機構による成形品の受渡しが容易となるように構成することができる。   Further, if the cover is divided into two parts and can be opened and closed at a predetermined timing, it is possible to facilitate the delivery of the molded product by the transport mechanism.

本発明を適用することにより、成形品を短時間で十分に冷却でき、冷却不足によるゲートブレーク不良（ゲート残り、ゲート折れ、密着残り等）を防止できると共に、冷却専用の構成を採り易いことから、必要に応じて成形品の反りを最小限とすることもできる。   By applying the present invention, the molded product can be sufficiently cooled in a short period of time, and it is possible to prevent a gate break failure (gate remaining, gate breakage, adhesion remaining, etc.) due to insufficient cooling, and it is easy to adopt a dedicated cooling structure. If necessary, warping of the molded product can be minimized.

以下、添付図面を参照しつつ、本発明の実施形態の一例について詳細に説明する。   Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

本発明にかかる樹脂封止装置ＪＳは、図１にその概略構成を示す通り、半導体チップ等の被成形品を樹脂にて封止するための封止手段３００と、封止手段３００により樹脂封止された成形品を冷却するための冷却手段１００と、冷却手段１００により冷却された成形品の不要樹脂を取り除くゲートブレーク手段４００と、冷却後の成形品を、冷却手段１００からゲートブレーク手段４００へと搬送する搬送手段６００と、を備えた構成とされている。又、樹脂封止装置ＪＳは、１つのゲートブレーク手段４００に対して封止手段３００が並列的に複数設けられており、所謂マルチプレスタイプの樹脂封止装置である。又、樹脂封止装置ＪＳでは、各封止手段３００から冷却手段１００までの成形品の搬送は第１搬送手段５００によって行なわれ、冷却手段１００からゲートブレーク手段４００までの搬送は第２搬送手段６００によって行われている。なお、本実施形態においては、第１搬送手段５００と第２搬送手段６００とが独立した手段として構成されているが、同一の搬送手段を用いて、封止手段３００から冷却手段１００までの搬送及び冷却手段１００からゲートブレーク手段４００までの搬送を行うような構成を採用してもよい。   A resin sealing device JS according to the present invention includes a sealing means 300 for sealing a molded product such as a semiconductor chip with a resin, and a resin sealing device by a sealing means 300 as shown in FIG. The cooling means 100 for cooling the molded product stopped, the gate break means 400 for removing unnecessary resin from the molded product cooled by the cooling means 100, and the cooled molded product from the cooling means 100 to the gate break means 400. And a conveying means 600 that conveys to the outside. The resin sealing device JS is a so-called multi-press type resin sealing device in which a plurality of sealing means 300 are provided in parallel to one gate break means 400. In the resin sealing device JS, the molded product is transferred from each sealing means 300 to the cooling means 100 by the first transfer means 500, and the transfer from the cooling means 100 to the gate break means 400 is the second transfer means. 600. In the present embodiment, the first transfer unit 500 and the second transfer unit 600 are configured as independent units. However, transfer from the sealing unit 300 to the cooling unit 100 is performed using the same transfer unit. In addition, a configuration in which conveyance from the cooling unit 100 to the gate break unit 400 may be employed.

次に、図２乃至図４を用いて、冷却手段１００について説明する。図２は、冷却手段１００の上面図であり、図３は同右側面図、図４は同正面図である。   Next, the cooling means 100 will be described with reference to FIGS. 2 is a top view of the cooling means 100, FIG. 3 is a right side view thereof, and FIG. 4 is a front view thereof.

冷却手段１００は、樹脂封止後の成形品を載置するためのセット部１０２と、当該セット部１０２を支持する４本の脚部１３０とから構成される。セット部１０２は、セット部固定ボルト１２０によって脚部１３０と一体的に連結固定されている。   The cooling means 100 includes a set portion 102 for placing a molded product after resin sealing, and four leg portions 130 that support the set portion 102. The set part 102 is connected and fixed integrally with the leg part 130 by a set part fixing bolt 120.

セット部１０２は、治具部１０２Ａとベース部１０２Ｂとから構成されており、扁平な板状のベース部１０２Ｂの上に、当該ベース部１０２Ｂと略同じ大きさの治具部１０２Ａが階層的に配置された構成とされている。この治具部１０２Ａは、位置決めピン１０３によってベース部１０２Ｂに対して位置決めされた上で固定されている。ベース部１０２Ｂの右側面には調整弁１１０が備わっており、当該調整弁１１０から冷却媒体パイプ１１１が延びている。この調整弁１１０により、当該調整弁１１０を通過する冷却媒体の量を調整することが可能とされている。冷却媒体パイプ１１１は、図示せぬ冷却媒体供給装置に繋がっている。又、ベース部１０２Ｂの内部にはエア通路１１２が形成されており、当該エア通路１１２と調整弁１１０とが連通している。   The set part 102 includes a jig part 102A and a base part 102B, and a jig part 102A having the same size as the base part 102B is hierarchically arranged on a flat plate-like base part 102B. It is set as the arrangement. The jig portion 102A is positioned and fixed with respect to the base portion 102B by the positioning pins 103. An adjustment valve 110 is provided on the right side surface of the base portion 102 </ b> B, and a cooling medium pipe 111 extends from the adjustment valve 110. The amount of the cooling medium that passes through the adjustment valve 110 can be adjusted by the adjustment valve 110. The cooling medium pipe 111 is connected to a cooling medium supply device (not shown). An air passage 112 is formed in the base portion 102B, and the air passage 112 and the adjustment valve 110 communicate with each other.

一方、治具部１０２Ａの表面（図３における上面）は、成形品１８０の形状に対応した形状（例えば成形品１８０の形状に沿って模られた形状）とされており、成形品１８０がセットされる。成形品１８０には、半導体チップ等が樹脂にて封止されたパッケージ部１８０Ａと、封止工程において樹脂の通路となるランナ部分やカル部分に相当する部分の不要樹脂（以下、この不要樹脂のことを単にランナ部１８０Ｂやカル部１８０Ｃとする。）とが複数備わっている。又、治具部１０２Ａには、前述した成形品１８０がセットされた際のちょうどカル部１８０Ｃの位置及びランナ部１８０Ｂの位置に、エア噴出孔１１４が設けられている。このエア噴出孔１１４は、前述したエア通路１１２と連通しており、冷却媒体パイプ１１１及び調整弁１１０を介してエア通路１１２に供給された冷却媒体（エア）を成形品１８０に対して噴出可能とされている。このエアは、予め冷却されたエアであってもよいし、室温程度のエアであってもよい。又、空気だけでなく、例えば窒素等の不活性ガスを利用してもよい。   On the other hand, the surface of the jig portion 102A (the upper surface in FIG. 3) has a shape corresponding to the shape of the molded product 180 (for example, a shape imitated along the shape of the molded product 180). Is done. The molded product 180 includes a package portion 180A in which a semiconductor chip or the like is sealed with a resin, and an unnecessary resin corresponding to a runner portion or a cull portion that becomes a resin passage in the sealing process (hereinafter referred to as an unnecessary resin). This is simply referred to as a runner portion 180B or a cull portion 180C). The jig portion 102A is provided with an air ejection hole 114 at the position of the cull portion 180C and the position of the runner portion 180B when the above-described molded product 180 is set. The air ejection hole 114 communicates with the air passage 112 described above, and the cooling medium (air) supplied to the air passage 112 via the cooling medium pipe 111 and the regulating valve 110 can be ejected to the molded product 180. It is said that. This air may be air that has been cooled in advance, or may be air at about room temperature. Moreover, you may utilize not only air but inert gas, such as nitrogen, for example.

又、治具部１０２Ａの略四隅には、当該冷却手段１００に搬送されてきた成形品１８０を把持可能なクランプ爪１６０が設けられている。このクランプ爪１６０は、治具部１０２Ａに対して回転可能に支持されており、ばね１６２によって、セット部１０２へと搬送されてきた成形品１８０をセット部１０２の表面に保持可能とされている。なお、図面に示した符号１７０は、樹脂封止装置ＪＳにおける第１搬送手段５００の一部（搬送手段の爪部先端）が現れているのであり、当該冷却手段１００を構成する部品ではない。   In addition, clamp claws 160 capable of gripping the molded product 180 conveyed to the cooling means 100 are provided at substantially four corners of the jig portion 102A. The clamp claw 160 is rotatably supported with respect to the jig portion 102A, and a molded product 180 conveyed to the set portion 102 can be held on the surface of the set portion 102 by a spring 162. . In addition, the code | symbol 170 shown in drawing is part of the 1st conveyance means 500 (resin | tip of the nail | claw part of a conveyance means) in the resin sealing apparatus JS, and is not components which comprise the said cooling means 100.

又、セット部１０２には、４本のガイドピン１１６が設けられており、成形品１８０のリードフレームに備わるガイド穴（図示しない）に当該ガイドピン１１６が貫通することで、セット部１０２に対する成形品１８０の位置決めが可能とされている。   The set portion 102 is provided with four guide pins 116, and the guide pin 116 penetrates a guide hole (not shown) provided in the lead frame of the molded product 180, so that the set portion 102 is molded. The product 180 can be positioned.

次に、冷却手段１００の作用について説明する。   Next, the operation of the cooling means 100 will be described.

樹脂封止装置ＪＳでは、並列的に複数設けられた封止手段３００によって順次成形品１８０が作られている。この成形品１８０は、第１搬送手段（例えばアンローダ）５００によって封止手段３００から取り出されると同時に冷却手段１００に向って搬送される。冷却手段１００の上部にまで成形品１８０が搬送されると、続いてセット部１０２にセットされることになる。このとき、所定のタイミングでセット部１０２に備わるクランプ爪１６０が開放されて、成形品１８０のセット部１０２へのセット（載置）を許容する。更に、成形品１８０が当該セット部１０２にセットされると、クランプ爪１６０がばね１６２の働きによって閉じられることにより、成形品１８０をクランプ（把持）することとなる。   In the resin sealing device JS, the molded product 180 is sequentially formed by a plurality of sealing means 300 provided in parallel. The molded product 180 is taken out from the sealing means 300 by the first conveying means (for example, unloader) 500 and is simultaneously conveyed toward the cooling means 100. When the molded product 180 is conveyed to the upper part of the cooling means 100, it is subsequently set in the setting unit 102. At this time, the clamp claw 160 provided in the set unit 102 is opened at a predetermined timing, and the set (placement) of the molded product 180 on the set unit 102 is allowed. Furthermore, when the molded product 180 is set in the set portion 102, the clamp claw 160 is closed by the action of the spring 162, whereby the molded product 180 is clamped (gripped).

一方、冷却媒体パイプ１１１からは、所定のタイミングでエア（冷却媒体）が供給されている。エアの温度は成形品１８０の種類や樹脂の種類等によって適宜最適に調整される。又、エア通路１１２に供給されるエアの量においても、調整弁１１０によって適宜最適に調整可能である。エア通路１１２に供給されたエアは、エア噴出孔１１４から成形品１８０のカル部１８０Ｃや、ランナ部１８０Ｂに対して噴出される。これにより、成形品１８０の特にカル部１８０Ｃやランナ部１８０Ｂの温度は急速に冷却されることになる。このとき、セット部１０２にセットされた成形品１８０は、クランプ爪によって確実に把持固定されており、エアの噴射によって成形品１８０が飛散したり、位置がずれてしまうことはない。又、勢いよくエアを噴射することも可能となるため、冷却時間の短縮や更なる低温度までの冷却が可能となる。ゲートブレーク手段４００におけるゲートブレーク工程の際、樹脂の冷却不足により生じるゲート残り、ゲート折れ、密着残り等は、まさにこのカル部１８０Ｃ、ランナ部１８０Ｂの部分で起こるため、当該部分を直接冷却することは非常に効果が高い。   On the other hand, air (cooling medium) is supplied from the cooling medium pipe 111 at a predetermined timing. The temperature of the air is optimally adjusted as appropriate depending on the type of molded product 180, the type of resin, and the like. Also, the amount of air supplied to the air passage 112 can be adjusted optimally by the adjusting valve 110 as appropriate. The air supplied to the air passage 112 is ejected from the air ejection hole 114 to the cull portion 180C of the molded product 180 and the runner portion 180B. Thereby, especially the temperature of the cull part 180C and the runner part 180B of the molded product 180 is rapidly cooled. At this time, the molded product 180 set in the setting unit 102 is securely held and fixed by the clamp claws, and the molded product 180 is not scattered or displaced by air injection. In addition, since it is possible to inject air vigorously, it is possible to shorten the cooling time and cool to a lower temperature. In the gate break process in the gate break means 400, the gate residue, gate breakage, adhesion remaining, etc. caused by insufficient cooling of the resin occur in the cull portion 180C and the runner portion 180B. Is very effective.

成形品１８０が十分に冷却されると、成形品１８０は、第２搬送手段６００によってゲートブレーク手段４００へと搬送される。ここで成形品１８０の不要樹脂部分（カル部１８０Ｃ、ランナ部１８０Ｂ）が取り除かれることになる。   When the molded product 180 is sufficiently cooled, the molded product 180 is transported to the gate break unit 400 by the second transport unit 600. Here, unnecessary resin portions (the cull portion 180C and the runner portion 180B) of the molded product 180 are removed.

このように、冷却手段１００を、封止手段３００とゲートブレーク手段４００との間に第２搬送手段６００を介して配置することにより、成形品１８０がゲートブレーク手段４００に搬送された時点でゲートブレークするのに十分な程度にまで冷却しておくことが可能となる。その結果成形品１８０がゲートブレーク手段４００に供給されると直ぐにゲートブレーク工程に入ることができ、成形品冷却のための「冷却時間」を装置のサイクルタイム支配要因から排除することができる。又、十分に冷却された上でゲートブレークされるため、ゲート残り、ゲート折れ等を防止できる。   As described above, the cooling unit 100 is disposed between the sealing unit 300 and the gate break unit 400 via the second transfer unit 600, so that the molded product 180 is transferred to the gate break unit 400 when the molded product 180 is transferred to the gate break unit 400. It becomes possible to cool it enough to break. As a result, as soon as the molded product 180 is supplied to the gate break means 400, the gate break process can be started, and the "cooling time" for cooling the molded product can be excluded from the cycle time controlling factor of the apparatus. In addition, since the gate is broken after being sufficiently cooled, it is possible to prevent the gate from being left and broken.

なお、特に、特定のゲートブレーク手段に対して封止手段３００が並列的に複数設けられている封止装置（所謂マルチプレスタイプ）の場合には、その構成上、１のゲートブレーク手段に対して次々と成形品１８０が運ばれてくる。その結果、冷却時間に加えて「冷却のための待ち時間」が存在する。この「冷却のための待ち時間」を利用して冷却でき、独立した（即ち搬送手段を介在させて）冷却手段を設けても、そのことによって装置のサイクルタイムを伸長する方向に影響することはない。更に、図示はしていないが、冷却手段１００を、複数の成形品１８０を同時に冷却可能（複数の封止手段３００から搬送されてきた成形品１８０を同時に冷却可能）なように構成すれば、より迅速に十分に冷却された成形品１８０をゲートブレーク手段４００へと供給することが可能となる。   In particular, in the case of a sealing device (so-called multi-press type) in which a plurality of sealing means 300 are provided in parallel with respect to a specific gate break means, because of its configuration, with respect to one gate break means One after another, the molded product 180 is carried. As a result, there is a “waiting time for cooling” in addition to the cooling time. It is possible to cool using this “waiting time for cooling”, and even if an independent cooling means (that is, interposing the conveying means) is provided, it does not affect the direction of extending the cycle time of the apparatus. Absent. Further, although not shown, if the cooling unit 100 is configured so that a plurality of molded products 180 can be cooled at the same time (the molded products 180 conveyed from the plurality of sealing units 300 can be cooled simultaneously), The molded article 180 that has been sufficiently cooled more quickly can be supplied to the gate break means 400.

なお、例えばエア噴出孔１１４を設けずに、閉じられたエア通路によってエアをセット部内に循環させることによって、セット部１０２の表面を冷却し、更に成形品１８０を冷却するような、所謂「間接冷却」として構成することも可能である。このように構成すれば、成形品に対して直接冷却媒体を噴射するのに比べてゆっくりと冷却することが可能となるため、樹脂の種類によって生じ得る「急冷による反りや割れ」を防止することができると共に、樹脂バリ等の飛散を防止することが出来る。なお、このような間接冷却の場合は、冷却媒体は必ずしもエアである必要はなく、直接成形品に対して噴射することができない水等の液体を用いることも可能となる。又、間接冷却の場合は、成形品の一部分のみを極端に冷却するのではなく成形品全体をセット部表面を介して徐々に冷却することになり、この点においても成形品に部分的に生じる温度差によって反りや割れが生じることを防止可能である。   For example, without providing the air ejection holes 114, air is circulated in the set portion by a closed air passage so that the surface of the set portion 102 is cooled and the molded product 180 is further cooled. It can also be configured as “cooling”. By configuring in this way, it becomes possible to cool down more slowly than injecting the cooling medium directly onto the molded product, and therefore, preventing “warping and cracking due to rapid cooling” that may occur depending on the type of resin. It is possible to prevent scattering of resin burrs and the like. In the case of such indirect cooling, the cooling medium does not necessarily need to be air, and it is possible to use a liquid such as water that cannot be directly injected onto the molded product. Further, in the case of indirect cooling, not only a part of the molded product is extremely cooled, but the entire molded product is gradually cooled through the surface of the set part, and this point also occurs partially in the molded product. It is possible to prevent warping and cracking due to a temperature difference.

次に冷却手段の他の実施形態について図５乃至図８を用いて説明する。   Next, another embodiment of the cooling means will be described with reference to FIGS.

図５は冷却手段２００の上面図であり、図６は同右側面図、図７は同右側面図であってセット部カバーが閉じた状態を示す図、図８は正面図（図７矢示VIII方向）である。   5 is a top view of the cooling means 200, FIG. 6 is a right side view of the same, FIG. 7 is a right side view of the cooling unit 200, and shows a state where the set cover is closed, and FIG. 8 is a front view (arrow of FIG. 7). VIII direction).

冷却手段２００では、セット部２０２の表面側（即ち成形品）がセット部カバー２４０によって所定のタイミングで被覆される点が前述の冷却手段１００と比べて特徴的な部分である。なお、当該冷却手段２００におけるセット部２０２の構成は、前述した冷却手段１００におけるセット部１０２の構成と略同一であるため、同一又は類似する部分については数字下２桁が同一の符号を付するに止め、重複した構成及び作用の説明については省略する。   The cooling unit 200 is characterized in that the surface side (that is, the molded product) of the set unit 202 is covered with the set unit cover 240 at a predetermined timing compared to the cooling unit 100 described above. The configuration of the set unit 202 in the cooling unit 200 is substantially the same as the configuration of the set unit 102 in the cooling unit 100 described above. Therefore, the same or similar parts are denoted by the same reference numerals in the last two digits. The description of the duplicated configuration and operation will be omitted.

図６に示すように、冷却手段２００におけるセット部２０２は、脚部２３０を介して第１シリンダ（セット部移動機構）２５０によって上下方向（図６における上下方向）に所定のタイミングで上下動することが可能とされている。又、脚部２３０の左右側（図６における左右側）には、セット部カバー２４０が設けられている。   As shown in FIG. 6, the set portion 202 in the cooling means 200 moves up and down at a predetermined timing in the vertical direction (vertical direction in FIG. 6) by the first cylinder (set portion moving mechanism) 250 via the leg portion 230. It is possible. A set cover 240 is provided on the left and right sides (left and right sides in FIG. 6) of the leg portion 230.

セット部カバー２４０は、継手２５６を介して旋回シャフト２４４と連結されている。旋回シャフト２４４は、軸受２４５を備えたシャフト固定ブロック２５４にて基台２９０に支持されている。即ち、セット部カバー２４０は、旋回シャフト２４４の軸心を中心として回動可能に支持されている。又、旋回シャフト２４４には開閉センサ２５８（図８参照）が設けられており、セット部カバー２４０の開閉状態を検知可能とされている。セット部カバー２４０は、側面から見ると略「コの字」の形状（図６、図７参照）として構成されており、「コの字」の底面部分で旋回シャフト２４４と連結している。セット部カバー２４０における、旋回シャフト２４４との連結部分の内側（第１シリンダ２５０側）には緩衝材２４９が取り付けられている。当該緩衝材２４９がストッパ２４６と当接することによって、セット部カバー２４０の閉じ位置が定められている。一方、セット部カバー２４０における、旋回シャフト２４４との連結部分の外側（反第１シリンダ２５０側）は、第２シリンダ２５２と連結されている（シリンダ連結部２４８）。このシリンダ連結部２４８が第２シリンダ２５２によって上下に駆動されることによって、セット部カバー２４０が開閉することになる。又、「コの字」の上面に相当する部分は、セット部２０２を被覆するカバー部２４１であり、このカバー部２４１はアーム部２４２を介して「コの字」底面側と一体化されている。又、カバー部２４１は、セット部２０２と似通った構成とされており、略板状の治具部２４１Ａの上にベース部２４１Ｂが重ねて配置構成されている。更に、ベース部２４１Ｂにはエア通路２４７が設けられ、治具部２４１Ａにはエア噴出孔２４３が設けられている。即ち、カバー部２４１は、セット部２０２の上下方向を逆に構成したものに近似している。又、カバー部２４１に備わるエア通路２４７にも調整弁２６０を介して冷却媒体パイプ（図示しない）が連結され、図示せぬ冷却媒体供給機構からエアが供給可能とされている。   The set portion cover 240 is connected to the turning shaft 244 via a joint 256. The turning shaft 244 is supported on the base 290 by a shaft fixing block 254 including a bearing 245. That is, the set portion cover 240 is supported so as to be rotatable about the axis of the turning shaft 244. The turning shaft 244 is provided with an open / close sensor 258 (see FIG. 8) so that the open / close state of the set portion cover 240 can be detected. When viewed from the side, the set portion cover 240 is configured to have a substantially “U” shape (see FIGS. 6 and 7), and is connected to the turning shaft 244 at the bottom portion of the “U”. A cushioning material 249 is attached to the inner side (first cylinder 250 side) of the connecting portion with the turning shaft 244 in the set portion cover 240. When the cushioning material 249 contacts the stopper 246, the closing position of the set portion cover 240 is determined. On the other hand, the outer side (on the side opposite to the first cylinder 250) of the connecting portion with the turning shaft 244 in the set portion cover 240 is connected to the second cylinder 252 (cylinder connecting portion 248). When the cylinder connecting portion 248 is driven up and down by the second cylinder 252, the set portion cover 240 is opened and closed. The portion corresponding to the upper surface of the “U” is a cover portion 241 that covers the set portion 202, and this cover portion 241 is integrated with the bottom surface side of the “U” via the arm portion 242. Yes. The cover portion 241 has a configuration similar to that of the set portion 202, and a base portion 241B is placed on a substantially plate-shaped jig portion 241A. Further, an air passage 247 is provided in the base portion 241B, and an air ejection hole 243 is provided in the jig portion 241A. That is, the cover portion 241 is similar to the configuration in which the vertical direction of the set portion 202 is reversed. Further, a cooling medium pipe (not shown) is also connected to the air passage 247 provided in the cover portion 241 via the adjustment valve 260 so that air can be supplied from a cooling medium supply mechanism (not shown).

当該冷却手段２００への成形品２８０の受渡しは、図６に示した状態、即ち、セット部カバー２４０が開き且つ第１シリンダ（セット部移動機構）２５０によってセット部２０２が上昇した状態で行なわれる。この状態で成形品２８０をセット部２０２に受け入れる。本実施形態では、セット部カバー２４０が２分割構造で所定のタイミングで開閉可能とされており、成形品２８０の受け渡しが容易である。   Delivery of the molded product 280 to the cooling means 200 is performed in the state shown in FIG. 6, that is, in a state where the set portion cover 240 is opened and the set portion 202 is raised by the first cylinder (set portion moving mechanism) 250. . In this state, the molded product 280 is received by the setting unit 202. In the present embodiment, the set portion cover 240 has a two-part structure and can be opened and closed at a predetermined timing, so that the molded product 280 can be easily delivered.

続いてセット部２０２が第１シリンダ２５０の作用により下降（図６における下側）すると共に、セット部カバー２４０が閉じられて、図７に示した状態となる。その後セット部２０２が再度上昇し、セット部２０２にセットされた成形品２８０がカバー部２４１（の治具部２４１Ａ）の方向に上昇する。このとき、成形品２８０をカバー部２４１（の治具部２４１Ａ）に対して直接的に当接させて挟むか否かは、成形品２８０の形状、反りの許容量、材料等に応じて適宜変更する。その結果、セット部２０２及び成形品２８０が、セット部カバー２４０（のカバー部２４１）によって被覆される。この状態で、成形品に対してエアを噴出することで成形品２８０の両面側から積極的に冷却可能となり、又、冷却媒体による冷却効率をより向上させることが可能となる。即ち、噴出したエア（冷気）が周囲に飛散することなく成形品のみを確実に冷却することができる。   Subsequently, the set portion 202 is lowered (lower side in FIG. 6) by the action of the first cylinder 250, and the set portion cover 240 is closed, resulting in the state shown in FIG. Thereafter, the set part 202 is raised again, and the molded product 280 set on the set part 202 is raised in the direction of the cover part 241 (the jig part 241A). At this time, whether or not the molded product 280 is directly brought into contact with the cover portion 241 (the jig portion 241A) is appropriately determined according to the shape of the molded product 280, the allowable amount of warpage, the material, and the like. change. As a result, the set part 202 and the molded product 280 are covered with the set part cover 240 (the cover part 241 thereof). In this state, by blowing air to the molded product, it becomes possible to actively cool from both sides of the molded product 280, and it is possible to further improve the cooling efficiency by the cooling medium. That is, it is possible to reliably cool only the molded product without the jetted air (cold air) scattering around.

なお、セット部カバー２４０の開閉構造は前述した構成に限定されるのではなく、セット部を効果的に被覆可能である限りにおいて、例えばスライド式に開閉してもよい。   The opening / closing structure of the set portion cover 240 is not limited to the above-described configuration, and may be opened and closed, for example, as long as the set portion can be effectively covered.

本発明は、特に所謂マルチプレスタイプの樹脂封止装置に特に有効であるが、シングルプレスタイプの樹脂封止装置への適用を除外するものではない。   The present invention is particularly effective for a so-called multi-press type resin sealing apparatus, but application to a single press type resin sealing apparatus is not excluded.

本発明の実施形態の一例である樹脂封止装置の概略構成図Schematic configuration diagram of a resin sealing device which is an example of an embodiment of the present invention 冷却手段１００の上面図Top view of the cooling means 100 同、右側面図（図２における矢示III方向から見た図）Same side view (viewed from the direction of arrow III in FIG. 2) 同、正面図（図２における矢示IV方向から見た図）Same as above, front view (viewed from the direction of arrow IV in FIG. 2) 冷却手段の他の構成例（冷却手段２００）の上面図Top view of another configuration example of cooling means (cooling means 200) 同、右側面図（図５における矢示VI方向）Same as above, right side view (direction of arrow VI in Fig. 5) 同、右側面図であって、セット部カバーが閉じた状態図The same right side view with the set cover closed 同、正面図（図７における矢示VIII方向から見た図）Same as above, front view (viewed from the direction of arrow VIII in FIG. 7) 特許文献１記載の半導体モールド装置（樹脂封止装置）Semiconductor mold device (resin sealing device) described in Patent Document 1

符号の説明Explanation of symbols

１００、２００…冷却手段
１０２、２０２…セット部
１０２Ａ、２０２Ａ…治具部
１０２Ｂ、２０２Ｂ…ベース部
１０３、２０３…位置決めピン
１１０、２１０、２６０…調整弁
１１１…冷却媒体パイプ
１１２、２１２、２４７…エア通路
１１４、２１４、２４３…エア噴出孔
１１６、２１６…ガイドピン
１２０、２２０…セット部固定ボルト
１３０、２３０…脚部
１６０、２６０…クランプ爪
１６２、２６２…バネ
１８０、２８０…成形品
２４０…セット部カバー
２４１…カバー部
２４２…アーム部
２４４…旋回シャフト
２４５…軸受
２４６…ストッパ
２４８…シリンダ係合部
２４９…緩衝材
２５０…第１シリンダ
２５２…第２シリンダ
２５４…シャフト固定ブロック
２５６…継手
２５８…開閉センサ
２９０…基台 DESCRIPTION OF SYMBOLS 100, 200 ... Cooling means 102, 202 ... Set part 102A, 202A ... Jig part 102B, 202B ... Base part 103, 203 ... Positioning pin 110, 210, 260 ... Adjustment valve 111 ... Cooling medium pipe 112, 212, 247 ... Air passages 114, 214, 243 ... Air ejection holes 116, 216 ... Guide pins 120, 220 ... Set portion fixing bolts 130, 230 ... Leg portions 160, 260 ... Clamp claws 162, 262 ... Spring 180, 280 ... Molded product 240 ... Set part cover 241 ... Cover part 242 ... Arm part 244 ... Swivel shaft 245 ... Bearing 246 ... Stopper 248 ... Cylinder engagement part 249 ... Buffer material 250 ... First cylinder 252 ... Second cylinder 254 ... Shaft fixing block 256 ... Joint 258 ... Opening / closing sensor 290 ... Base

Claims (7)

半導体チップの被成形品を樹脂にて封止するための封止手段と、
該封止手段で樹脂封止された成形品を冷却する冷却手段と、
該冷却手段で冷却された成形品の不要樹脂を取り除くゲートブレーク手段と、
前記封止手段で樹脂封止された成形品を前記冷却手段に搬送する第１搬送手段と、
前記冷却手段で冷却された成形品を前記ゲートブレーク手段に搬送する第２搬送手段と、を備え、
前記第２搬送手段が前記冷却手段で冷却された成形品を前記ゲートブレーク手段へ搬送すると、前記第１搬送手段が前記封止手段で樹脂封止された成形品を前記冷却手段に搬送する構成とされ、
前記冷却手段は、前記成形品をセットするセット部と、
該セット部にセットされた前記成形品に隣接するように設けられた冷却媒体通路と、
前記冷却媒体通路に供給される冷却媒体と、を備え、
更に、前記セット部に前記成形品をセットした状態で前記成形品を被覆可能なカバーを備え、該カバー内に前記冷却媒体通路が設けられている
ことを特徴とする樹脂封止装置。 And sealing means for sealing the semiconductor chip to be molded article of a resin,
A cooling means for cooling the molded product resin-sealed by the sealing means;
Gate break means for removing unnecessary resin from the molded product cooled by the cooling means;
First conveying means for conveying the molded product resin-sealed by the sealing means to the cooling means;
A second conveying means for conveying the molded product cooled by the cooling means to the gate break means,
When the second conveying means conveys the molded product cooled by the cooling means to the gate break means, the first conveying means conveys the molded product resin-sealed by the sealing means to the cooling means. And
The cooling means includes a set unit for setting the molded product;
A cooling medium passage provided so as to be adjacent to the molded article set in the set portion;
A cooling medium supplied to the cooling medium passage,
The resin sealing device further comprising a cover capable of covering the molded product in a state where the molded product is set in the set portion, and the cooling medium passage is provided in the cover. 請求項１において、
当該樹脂封止装置は、特定の前記ゲートブレーク手段に対して前記封止手段が並列的に複数設けられているマルチプレスタイプとされている
ことを特徴とする樹脂封止装置。 In claim 1,
The resin sealing apparatus is a multi-press type in which a plurality of the sealing means are provided in parallel to the specific gate break means. 請求項１又は２において、
前記冷却媒体はエアであり、
前記セット部には、前記冷却媒体通路からセットされた前記成形品へと当該エアを導くエア噴出孔が備えられている
ことを特徴とする樹脂封止装置。 In claim 1 or 2,
The cooling medium is air;
The resin sealing device, wherein the set portion includes an air ejection hole that guides the air from the cooling medium passage to the molded product set. 請求項３において、
更に、エア噴出時において、前記セット部にセットされた前記成形品を前記セット部に保持可能なクランプ構造を備える
ことを特徴とする樹脂封止装置。 In claim 3,
Furthermore, the resin sealing apparatus characterized by including the clamp structure which can hold | maintain the said molded product set to the said set part to the said set part at the time of air ejection. 請求項１乃至４のいずれかにおいて、
更に、前記セット部に前記成形品をセットした状態で、該セット部を前記カバーに対して当接・離間可能なセット部移動機構を備える
ことを特徴とする樹脂封止装置。 In any one of Claims 1 thru | or 4,
The resin sealing device further comprising: a set part moving mechanism capable of contacting and separating the set part from the cover in a state where the molded product is set in the set part. 請求項１乃至５のいずれかにおいて、
前記カバーが２分割構造とされて、所定のタイミングで開閉可能とされている
ことを特徴とする樹脂封止装置。 In any one of Claims 1 thru | or 5,
The resin sealing device, wherein the cover has a two-part structure and can be opened and closed at a predetermined timing. 請求項１乃至６のいずれかにおいて、
前記冷却手段が、複数の前記成形品を同時に冷却可能である
ことを特徴とする樹脂封止装置。
In any one of Claims 1 thru | or 6.
The resin sealing device, wherein the cooling means can simultaneously cool a plurality of the molded products.
JP2006214326A 2006-08-07 2006-08-07 Resin sealing device Active JP4916810B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006214326A JP4916810B2 (en) 2006-08-07 2006-08-07 Resin sealing device
TW096128214A TW200816331A (en) 2006-08-07 2007-08-01 Resin sealing apparatus
KR1020097002380A KR20090026819A (en) 2006-08-07 2007-08-03 Resin sealing apparatus
CN2007800291946A CN101501829B (en) 2006-08-07 2007-08-03 Resin sealing apparatus
PCT/JP2007/065249 WO2008018379A1 (en) 2006-08-07 2007-08-03 Resin sealing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006214326A JP4916810B2 (en) 2006-08-07 2006-08-07 Resin sealing device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011220123A Division JP2012044199A (en) 2011-10-04 2011-10-04 Resin sealing device

Publications (2)

Publication Number Publication Date
JP2008041933A JP2008041933A (en) 2008-02-21
JP4916810B2 true JP4916810B2 (en) 2012-04-18

Family

ID=39032909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006214326A Active JP4916810B2 (en) 2006-08-07 2006-08-07 Resin sealing device

Country Status (5)

Country Link
JP (1) JP4916810B2 (en)
KR (1) KR20090026819A (en)
CN (1) CN101501829B (en)
TW (1) TW200816331A (en)
WO (1) WO2008018379A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102756454B (en) * 2011-04-27 2016-03-09 松下知识产权经营株式会社 The manufacture method of resin-seal molding product
JP2012044199A (en) * 2011-10-04 2012-03-01 Sumitomo Heavy Ind Ltd Resin sealing device
JP5774538B2 (en) * 2012-04-11 2015-09-09 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP6304435B1 (en) * 2017-07-25 2018-04-04 第一精工株式会社 Substrate deformation prevention mechanism and substrate deformation prevention method
CN110976689B (en) * 2019-12-02 2021-07-30 广东戴卡旭汽车零部件有限公司 Hub spinning process
JP7275060B2 (en) * 2020-02-05 2023-05-17 Ｔｏｗａ株式会社 REMOVAL MECHANISM, RESIN MOLDING APPARATUS AND MANUFACTURING METHOD
US11791283B2 (en) 2021-04-14 2023-10-17 Nxp Usa, Inc. Semiconductor device packaging warpage control
EP4099367A3 (en) * 2021-06-03 2022-12-28 NXP USA, Inc. Semiconductor device packaging warpage control

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359813A (en) * 1989-07-27 1991-03-14 Tokin Corp Thin-film magnetic head
JPH0745299Y2 (en) * 1989-10-16 1995-10-18 株式会社東芝 Molded product take-out device
JP2790500B2 (en) * 1989-12-01 1998-08-27 株式会社日立製作所 Semiconductor plastic package manufacturing equipment
JP2571719Y2 (en) * 1993-09-16 1998-05-18 住友精密工業株式会社 Work removal device for semiconductor molding
JP4327986B2 (en) * 2000-04-21 2009-09-09 アピックヤマダ株式会社 Resin sealing device
JP4871447B2 (en) * 2000-12-13 2012-02-08 住友重機械工業株式会社 Multi-press mold equipment
JP4601325B2 (en) * 2004-05-17 2010-12-22 第一精工株式会社 Resin sealing device

Also Published As

Publication number Publication date
KR20090026819A (en) 2009-03-13
CN101501829A (en) 2009-08-05
JP2008041933A (en) 2008-02-21
TW200816331A (en) 2008-04-01
WO2008018379A1 (en) 2008-02-14
CN101501829B (en) 2011-03-16

Similar Documents

Publication Publication Date Title
JP4916810B2 (en) Resin sealing device
KR0164440B1 (en) Method and apparatus for molding resin to seal electronic parts
US20080020510A1 (en) Fabrication method of semiconductor device
TW202017091A (en) Carrying device, resin molding device, carrying method, and manufacturing method of resin molded product
TWI753157B (en) Molding mold and resin molding method
JP2012044199A (en) Resin sealing device
KR102325513B1 (en) Work carry-in device, work take-out device, molding die and resin molding apparatus having the same
TWI786515B (en) Resin molding device and resin molding method
JP4153769B2 (en) Resin sealing device
KR20230170030A (en) Resin molding device and manufacturing method of resin molded products
JP2694509B2 (en) Resin sealing molding method for electronic parts
WO2023149016A1 (en) Resin sealing device and resin sealing method
JP4327985B2 (en) Resin sealing device
JP3911402B2 (en) Semiconductor sealing device
TW202210266A (en) Resin sealing device capable of suppressing a temperature drop of a resin sealing mold and preventing degradation of molding quality and lowering of productivity caused by the temperature drop even when a large number of resin sheets are put into a resin sealing mold
JP6418464B1 (en) Substrate conveying apparatus and substrate conveying method
KR20240073105A (en) Resin encapsulation device, encapsulation mold, and resin encapsulation method
JP4322523B2 (en) Semiconductor device mounting device
JPS63184344A (en) Equipment for manufacturing semiconductor
KR970007094Y1 (en) Magazine holder of lead frame loader for semiconductor package
KR20240012545A (en) Resin molding apparatus and method for manufacturing resin molded products
KR100247506B1 (en) Preheating apparatus of automatic molding press for semiconductor package manufacturing
CN115917717A (en) Cleaning mechanism, resin molding apparatus, and method for manufacturing resin molded product
KR19980019577A (en) BOAT UNIT OF A SEALING APPARATUS FOR PRODUCING IC PACKAGE
JPH10310239A (en) Curing device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081016

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110607

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110705

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111004

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111012

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111101

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111222

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120124

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120125

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150203

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4916810

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250